Alignment aids

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H01L2224/26135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/26135Alignment aids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 11,342,298
- Issue date May 24, 2022
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages including die over-shift indicating patterns
- Patent number 11,239,177
- Issue date Feb 1, 2022
- SK hynix Inc.
- Sukwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 10,861,818
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Imaging module can easily and stably connect an imaging-sensing dev...
- Patent number 10,804,620
- Issue date Oct 13, 2020
- Fujikura Ltd.
- Takao Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including die over-shift indicating patterns
- Patent number 10,692,816
- Issue date Jun 23, 2020
- SK hynix Inc.
- Sukwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 10,011,098
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
4D Device, process and structure
- Patent number 9,259,902
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Roy R. Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,202,804
- Issue date Dec 1, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,841,783
- Issue date Sep 23, 2014
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a filling of a gap in semiconductor devices
- Patent number 8,586,411
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
4D device process and structure
- Patent number 8,247,895
- Issue date Aug 21, 2012
- International Business Machines Corporation
- Wilfried Haensch
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film for stacking semiconductor chips
- Patent number 7,960,023
- Issue date Jun 14, 2011
- Toray Advanced Materials Korea Inc.
- Chang-Hoon Sim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for electronic components, method for manufacturing semico...
- Patent number 7,915,743
- Issue date Mar 29, 2011
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low shrinkage polyester thermosetting resins
- Patent number 7,868,113
- Issue date Jan 11, 2011
- Designer Molecules, Inc.
- Stephen M. Dershem
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...
- Publication number 20210005568
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20190304945
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...
- Publication number 20130181339
- Publication date Jul 18, 2013
- Mars Technology
- Wenjun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A FILLING OF A GAP IN SEMICONDUCTOR DEVICES
- Publication number 20120282739
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120153462
- Publication date Jun 21, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
4D Process and Structure
- Publication number 20120129276
- Publication date May 24, 2012
- International Business Machines Corporation
- Wilfried Haensch
- B32 - LAYERED PRODUCTS
Information Patent Application
4D DEVICE PROCESS AND STRUCTURE
- Publication number 20110170266
- Publication date Jul 14, 2011
- IBM Corporation
- Wilfried Haensch
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...
- Publication number 20110103034
- Publication date May 5, 2011
- Yao-Sheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for electronic components, method and for manufacturing se...
- Publication number 20090311827
- Publication date Dec 17, 2009
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low shrinkage polyester thermosetting resins
- Publication number 20080251935
- Publication date Oct 16, 2008
- Stephen Dersham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS
- Publication number 20080226884
- Publication date Sep 18, 2008
- TORAY SAEHAN INC.
- Chang-Hoon SIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic device including a substrate structure and a process for...
- Publication number 20060137901
- Publication date Jun 29, 2006
- Gang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module comprising two substrates and method of manufacturing...

Four D device process and structure

Die stack arrangement comprising a die-attach-film tape and method...

Semiconductor packages including die over-shift indicating patterns

Die stack arrangement comprising a die-attach-film tape and method...

Imaging module can easily and stably connect an imaging-sensing dev...

Semiconductor packages including die over-shift indicating patterns

Four D device process and structure

Semiconductor module package and method of manufacturing the same

Hermetically sealed wafer packages

4D Device, process and structure

Semiconductor device and method of manufacturing semiconductor device

Hermetically sealed wafer packages

Semiconductor device and method of manufacturing semiconductor device

Manufacturing a filling of a gap in semiconductor devices

4D device process and structure

Adhesive film for stacking semiconductor chips

Adhesive for electronic components, method for manufacturing semico...

Low shrinkage polyester thermosetting resins

Patents Applicationslast 30 patents

Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...

DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power module comprising two substrates and method of manufacturing...

MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...

HERMETICALLY SEALED WAFER PACKAGES

MANUFACTURING A FILLING OF A GAP IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

4D Process and Structure

4D DEVICE PROCESS AND STRUCTURE

ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...

Adhesive for electronic components, method and for manufacturing se...

Low shrinkage polyester thermosetting resins

ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS

Electronic device including a substrate structure and a process for...