Alignment aids

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H01L2224/0224

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0224Alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,094,867
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,837,579
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with chip pad and associated solder flux outgassing trench
- Patent number 11,830,835
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,749,662
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment apparatus and method of manufacturing semiconductor device
- Patent number 11,387,131
- Issue date Jul 12, 2022
- Kioxia Corporation
- Miki Toshima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method and manufacturing apparatus for stacked substr...
- Patent number 11,362,059
- Issue date Jun 14, 2022
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,998,293
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 10,930,608
- Issue date Feb 23, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 10,910,289
- Issue date Feb 2, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,847,476
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining alignment between a LED device and a backplane during b...
- Patent number 10,811,401
- Issue date Oct 20, 2020
- Facebook Technologies, LLC
- William Padraic Henry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,629,554
- Issue date Apr 21, 2020
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern structure for display device and manufacturing method thereof
- Patent number 10,529,788
- Issue date Jan 7, 2020
- Samsung Display Co., Ltd.
- Se Wan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 10,347,563
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,038,024
- Issue date Jul 31, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optimized solder pads for microelectronic components
- Patent number 10,014,274
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,911,778
- Issue date Mar 6, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,837,346
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 9,786,611
- Issue date Oct 10, 2017
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,698,079
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413144
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
- Publication number 20240055376
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230361101
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220293580
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICE
- Publication number 20220085091
- Publication date Mar 17, 2022
- SK HYNIX INC.
- Seok Jae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with Chip Pad and Associated Solder Flux Outgassing Trench
- Publication number 20220068851
- Publication date Mar 3, 2022
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210257340
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210043488
- Publication date Feb 11, 2021
- Kioxia Corporation
- Miki TOSHIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20200411459
- Publication date Dec 31, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20200395339
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...
- Publication number 20200273836
- Publication date Aug 27, 2020
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200168565
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20190333841
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190319000
- Publication date Oct 17, 2019
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20190259633
- Publication date Aug 22, 2019
- Sony Semiconductor Solutions Corporation
- MASATAKA MAEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20180277585
- Publication date Sep 27, 2018
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS
- Publication number 20170141072
- Publication date May 18, 2017
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160351511
- Publication date Dec 1, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20140362267
- Publication date Dec 11, 2014
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140138852
- Publication date May 22, 2014
- J-DEVICES CORPORATION
- Toru SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20130009321
- Publication date Jan 10, 2013
- SONY CORPORATION
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of measuring photoresist and bump misalignment
- Publication number 20030133115
- Publication date Jul 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- G01 - MEASURING TESTING

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of soldering a semiconductor chip to a chip carrier

Semiconductor package

Chip structure and method for forming the same

Semiconductor structure

Chip with chip pad and associated solder flux outgassing trench

Semiconductor package

Package-on-package (POP) type semiconductor packages

Semiconductor device, fabrication method for a semiconductor device...

Alignment apparatus and method of manufacturing semiconductor device

Manufacturing method and manufacturing apparatus for stacked substr...

Barrier structures between external electrical connectors

Packaged semiconductor devices and methods of packaging thereof

Method of fabricating semiconductor structure

Semiconductor device, fabrication method for a semiconductor device...

3D semiconductor device and structure

Electronic substrate and electronic apparatus

Semiconductor package

Maintaining alignment between a LED device and a backplane during b...

Package structure and manufacturing method thereof

Pattern structure for display device and manufacturing method thereof

Semiconductor device, fabrication method for a semiconductor device...

Barrier structures between external electrical connectors

Semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Optimized solder pads for microelectronic components

Semiconductor device, fabrication method for a semiconductor device...

Method for bonding substrates

Packaging device having plural microstructures disposed proximate t...

Method for manufacturing a semiconductor package

Barrier structures between external electrical connectors

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

CHIP STRUCTURE

METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

Barrier Structures Between External Electrical Connectors

IMAGE SENSING DEVICE

Chip with Chip Pad and Associated Solder Flux Outgassing Trench

SEMICONDUCTOR STRUCTURE

ALIGNMENT APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...

SEMICONDUCTOR PACKAGE

Barrier Structures Between External Electrical Connectors

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

Method of measuring photoresist and bump misalignment