Alignment aids

Industry

CPC
H01L2224/0217

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0217Alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 11,869,819
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 11,862,599
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 11,650,465
- Issue date May 16, 2023
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having alignment pads and method of manufactur...
- Patent number 11,616,032
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 11,532,578
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding alignment structure, chip bonding structure and method...
- Patent number 11,462,513
- Issue date Oct 4, 2022
- United Microelectronics Corp.
- Chin-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 11,450,579
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,367,712
- Issue date Jun 21, 2022
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, bonding structure and wafer bonding method
- Patent number 11,069,647
- Issue date Jul 20, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 11,056,468
- Issue date Jul 6, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 10,964,654
- Issue date Mar 30, 2021
- Micron Technology Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component and package structure having the same
- Patent number 10,957,610
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,910,333
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip
- Patent number 10,546,827
- Issue date Jan 28, 2020
- WISOL CO., LTD.
- Young Seok Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT HAVING EXPOSED LEADS
- Publication number 20240203919
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240087967
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240047343
- Publication date Feb 8, 2024
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding to Alignment Marks with Dummy Alignment Marks
- Publication number 20230378122
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299041
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20220359315
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding to Alignment marks with Dummy Alignment Marks
- Publication number 20220310554
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285233
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING ALIGNMENT STRUCTURE, CHIP BONDING STRUCTURE AND METHOD...
- Publication number 20220208727
- Publication date Jun 30, 2022
- United Microelectronics Corp.
- Chin-Chia YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280561
- Publication date Sep 9, 2021
- KIOXIA Corporation
- Takashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...
- Publication number 20210242148
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Maurer
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20210210395
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DI Solder Cup
- Publication number 20210202411
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20210193626
- Publication date Jun 24, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC CIRCUIT COMPONENT AND ELECTR...
- Publication number 20210035943
- Publication date Feb 4, 2021
- Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
- Peter RAMM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method
- Publication number 20200335473
- Publication date Oct 22, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DI Solder Cup
- Publication number 20200066664
- Publication date Feb 27, 2020
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20200043816
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST CMP PROCESSING FOR HYBRID BONDING
- Publication number 20200035641
- Publication date Jan 30, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20190378806
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20190198470
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including a pad where a driving chip is mounted

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device with edge-protecting spacers over bonding pad

Integrated circuit component and package structure having the same

Bonding to alignment marks with dummy alignment marks

Display device including a pad where a driving chip is mounted

Electrical overlay measurement methods and structures for wafer-to-...

Semiconductor device having alignment pads and method of manufactur...

Package-on-package (POP) type semiconductor packages

Semiconductor device with spacer over bonding pad

3DI solder cup

Semiconductor device with spacer over bonding pad

Chip bonding alignment structure, chip bonding structure and method...

Integrated circuit component and package structure having the same

Coupling of integrated circuits (ICS) through a passivation-defined...

Semiconductor device and manufacturing method thereof

Film scheme for bumping

Film scheme for bumping

Semiconductor wafer, bonding structure and wafer bonding method

3D semiconductor device and structure

3DI solder cup

Integrated circuit component and package structure having the same

Interconnect structures for preventing solder bridging, and associa...

Display device

Methods of forming connector pad structures, interconnect structure...

Film scheme for bumping

Semiconductor device and method of forming EMI shielding layer with...

Packaging devices and methods of manufacture thereof

Interconnect structures for preventing solder bridging, and associa...

Flip chip

Patents Applicationslast 30 patents

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

INTEGRATED CIRCUIT HAVING EXPOSED LEADS

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...

Bonding to Alignment Marks with Dummy Alignment Marks

Wafer Bonding Method and Bonded Device Structure

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

Bonding to Alignment marks with Dummy Alignment Marks

ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...

CHIP BONDING ALIGNMENT STRUCTURE, CHIP BONDING STRUCTURE AND METHOD...

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

3DI Solder Cup

3D SEMICONDUCTOR DEVICE AND STRUCTURE

METHOD FOR MANUFACTURING AN ELECTRONIC CIRCUIT COMPONENT AND ELECTR...

Semiconductor Wafer, Bonding Structure And Wafer Bonding Method

FILM SCHEME FOR BUMPING

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

3DI Solder Cup

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

POST CMP PROCESSING FOR HYBRID BONDING

FILM SCHEME FOR BUMPING

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...