Alignment aids

Industry

CPC
H01L2224/0213

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0213Alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure, electronic substrate and method of ma...
- Patent number 11,978,706
- Issue date May 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having an alignment structure
- Patent number 11,158,683
- Issue date Oct 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jeaheon Ahn
- G02 - OPTICS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,573,601
- Issue date Feb 25, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern structure for display device and manufacturing method thereof
- Patent number 10,529,788
- Issue date Jan 7, 2020
- Samsung Display Co., Ltd.
- Se Wan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and forming the same
- Patent number 9,362,243
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for disposing a component
- Patent number 8,187,667
- Issue date May 29, 2012
- Panasonic Corporation
- Hidekazu Arase
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299010
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...
- Publication number 20230061684
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20190139901
- Publication date May 9, 2019
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20150340329
- Publication date Nov 26, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- TSUNG-YUAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...
- Publication number 20120205812
- Publication date Aug 16, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20110229642
- Publication date Sep 22, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer, method for fabricating the same, and semiconductor pack...

Electronic package structure, electronic substrate and method of ma...

Package-on-package (POP) type semiconductor packages

Manufacturing of flip-chip electronic device with carrier having he...

Display device having an alignment structure

Packaged semiconductor devices and methods of packaging thereof

Flip-chip electronic device with carrier having heat dissipation el...

Collars for under-bump metal structures and associated systems and...

Semiconductor device and method of unit specific progressive alignment

Pattern structure for display device and manufacturing method thereof

Semiconductor device

Method for aligning micro-electronic components

Semiconductor package device and forming the same

Method for disposing a component

Patents Applicationslast 30 patents

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Wafer Bonding Method and Bonded Device Structure

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...

METHOD FOR DISPOSING A COMPONENT