Alignment aids

Industry

CPC
H01L2224/10165

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10165Alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered structure interface between a ball grid array device...
- Patent number 12,080,668
- Issue date Sep 3, 2024
- Dell Products L.P.
- Timothy Martin Radloff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly platform
- Patent number 11,348,890
- Issue date May 31, 2022
- Smoltek AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed-orientation multi-die integrated circuit package with at leas...
- Patent number 11,043,471
- Issue date Jun 22, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly platform
- Patent number 10,840,203
- Issue date Nov 17, 2020
- Smoltek AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of unit specific progressive alignment
- Patent number 10,573,601
- Issue date Feb 25, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure having magnetic bonding between substrates
- Patent number 10,157,885
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,153,250
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,646,948
- Issue date May 9, 2017
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package alignment structure and method of forming same
- Patent number 9,627,325
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having magnetic alignment marks and underfill...
- Patent number 9,548,290
- Issue date Jan 17, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,524,946
- Issue date Dec 20, 2016
- Murata Manufacturing Co., Ltd.
- Katsumi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for high-density chip connectivity
- Patent number 9,472,529
- Issue date Oct 18, 2016
- TERAPEDE SYSTEMS INC.
- Madhukar B. Vora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for MEMS bump side wall angle improvement
- Patent number 9,466,541
- Issue date Oct 11, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chris Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 9,462,693
- Issue date Oct 4, 2016
- Fujitsu Limited
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip stack with electrically insulating walls
- Patent number 9,418,976
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of integrated-circuit chips and electronic device
- Patent number 9,401,349
- Issue date Jul 26, 2016
- STMicroelectronics (Grenoble 2) SAS
- Angelo Crobu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package having magnetic connection member
- Patent number 9,402,315
- Issue date Jul 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsuk Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,343,334
- Issue date May 17, 2016
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures having an extension
- Patent number 9,312,213
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 9,263,378
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED STRUCTURE INTERFACE BETWEEN A BALL GRID ARRAY DEVICE...
- Publication number 20230307401
- Publication date Sep 28, 2023
- Dell Products L.P.
- Timothy Martin Radloff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY PLATFORM
- Publication number 20210043594
- Publication date Feb 11, 2021
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...
- Publication number 20200357767
- Publication date Nov 12, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY PLATFORM
- Publication number 20190267345
- Publication date Aug 29, 2019
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
- Publication number 20190139901
- Publication date May 9, 2019
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20190043838
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...
- Publication number 20180082969
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Eric J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20160307874
- Publication date Oct 20, 2016
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20160035659
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140252604
- Publication date Sep 11, 2014
- TOHOKU-MICROTEC CO., LTD
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Alignment Structure and Method of Forming Same
- Publication number 20140252657
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140206143
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140203428
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...
- Publication number 20140103522
- Publication date Apr 17, 2014
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...
- Publication number 20140084457
- Publication date Mar 27, 2014
- Moon Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INT...
- Publication number 20140070393
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE
- Publication number 20130335940
- Publication date Dec 19, 2013
- Sharp Kabushiki Kaisha
- Takashi Matsui
- G02 - OPTICS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20130256889
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130134583
- Publication date May 30, 2013
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MECHANISM FOR MEMS BUMP SIDE WALL ANGLE IMPROVEMENT
- Publication number 20130127036
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chris Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
- Publication number 20130119536
- Publication date May 16, 2013
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20120313236
- Publication date Dec 13, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20120309133
- Publication date Dec 6, 2012
- PANASONIC CORPORATION
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS

Alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layered structure interface between a ball grid array device...

Assembly platform

Manufacturing of flip-chip electronic device with carrier having he...

Mixed-orientation multi-die integrated circuit package with at leas...

Flip-chip electronic device with carrier having heat dissipation el...

Assembly platform

Ball grid array and land grid array assemblies fabricated using tem...

Semiconductor device and method of unit specific progressive alignment

Chip alignment utilizing superomniphobic surface treatment of silic...

Ball grid array and land grid array assemblies fabricated using tem...

Package structure having magnetic bonding between substrates

Flip-chip electronic device with carrier having heat dissipation el...

Semiconductor device and method of forming dummy pillars between se...

Electronic component and method for manufacturing electronic component

Package alignment structure and method of forming same

Method for aligning micro-electronic components

Magnetic contacts

Semiconductor device having magnetic alignment marks and underfill...

Electronic device

Apparatus and methods for high-density chip connectivity

Mechanism for MEMS bump side wall angle improvement

Electronic device and method of manufacturing electronic device

Chip stack with electrically insulating walls

Stack of integrated-circuit chips and electronic device

Semiconductor package having magnetic connection member

Magnetic contacts

Electronic component and method for manufacturing electronic component

Bump structures having an extension

Ball grid array and land grid array assemblies fabricated using tem...

Semiconductor device and method of making bumpless flipchip interco...

Patents Applicationslast 30 patents

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

MULTI-LAYERED STRUCTURE INTERFACE BETWEEN A BALL GRID ARRAY DEVICE...

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

ASSEMBLY PLATFORM

MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...

ASSEMBLY PLATFORM

SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

Package Alignment Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

In System Reflow of Low Temperature Eutectic Bond Balls

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...

BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...

HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INT...

ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE

SUBSTRATE AND SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

NOVEL MECHANISM FOR MEMS BUMP SIDE WALL ANGLE IMPROVEMENT

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING METHOD