Alloy 42

Follow

Industry

CPC
H01L2924/01404

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01404Alloy 42

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip assemblies using stacked leadframes
- Patent number 9,917,041
- Issue date Mar 13, 2018
- Intel Corporation
- Cory A. Runyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device package having improved reliability
- Patent number 9,887,143
- Issue date Feb 6, 2018
- Infineon Technologies Americas Corp.
- Wayne Partington
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP ASSEMBLIES USING STACKED LEADFRAMES
- Publication number 20180158764
- Publication date Jun 7, 2018
- Intel Corporation
- Cory A. Runyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Device Package Having Improved Reliability
- Publication number 20170278764
- Publication date Sep 28, 2017
- Infineon Technologies Americas Corp.
- Wayne Partington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160351492
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Shinya WATANABE
- G01 - MEASURING TESTING