Alternating conductors

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CPC
H05K2201/097

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/097Alternating conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,254,803
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Tae Hoon Kwon
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit board
- Patent number 12,232,253
- Issue date Feb 18, 2025
- ITABASHI SEIKI CO., LTD.
- Tetsuya Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission module, electronic unit, and electronic device
- Patent number 12,213,244
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,153,750
- Issue date Nov 26, 2024
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Danyang Bi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interconnection device and circuit board assembly
- Patent number 12,127,344
- Issue date Oct 22, 2024
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting conductive patterns
- Patent number 12,013,643
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, light bar, light source and display device
- Patent number 11,991,825
- Issue date May 21, 2024
- Beijing BOE Optoelectronics Technology Co., Ltd
- Yuanda Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,910,529
- Issue date Feb 20, 2024
- Samsung Display Co., Ltd.
- Sehui Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise suppression structure for differential pair
- Patent number 11,877,385
- Issue date Jan 16, 2024
- First Hi-tec Enterprise Co., Ltd.
- Ching-Shan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector and printed circuit board assembly
- Patent number 11,870,169
- Issue date Jan 9, 2024
- IMS Connector Systems GmbH
- Christoph Müllinger-Bausch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontally mounted capacitor module and electronic device includi...
- Patent number 11,856,700
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Chunghyun Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensing module and display apparatus
- Patent number 11,815,391
- Issue date Nov 14, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiahua Wang
- G01 - MEASURING TESTING
Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BODY AND CONNECTOR-ATTACHED CIRCUIT BODY
- Publication number 20250071900
- Publication date Feb 27, 2025
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
- Publication number 20250048533
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core Resonance Suppression in Signal Integrity Optimized Package
- Publication number 20250048535
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Kun Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE OF A SURFACE MOUNT CON...
- Publication number 20250040034
- Publication date Jan 30, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE
- Publication number 20250040033
- Publication date Jan 30, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...
- Publication number 20240388027
- Publication date Nov 21, 2024
- Japan Aviation Electronics Industry, Limited
- Kenta Ashibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20240292516
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Kouichirou SUGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...
- Publication number 20240292530
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240264686
- Publication date Aug 8, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Danyang Bi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...
- Publication number 20240268033
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Florian Eichkorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR BALL AND HOME APPLIANCE SYSTEM HAVING SAME
- Publication number 20240255322
- Publication date Aug 1, 2024
- LG ELECTRONICS INC.
- Byoungjoo LEE
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD, MODULE, AND IMAGE DISPLAY APPARATUS
- Publication number 20240258690
- Publication date Aug 1, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240235072
- Publication date Jul 11, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Conformal Wearable Battery
- Publication number 20240224424
- Publication date Jul 4, 2024
- Inventus Power, Inc.
- Paul John Kudrna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND CONTACT ARRANGEMENT
- Publication number 20240215170
- Publication date Jun 27, 2024
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
- Publication date Jun 6, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20240188227
- Publication date Jun 6, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240172362
- Publication date May 23, 2024
- SAMSUNG DISPLAY CO., LTD.
- SEHUI JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240136740
- Publication date Apr 25, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240023237
- Publication date Jan 18, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS

Alternating conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Printed circuit board

Transmission module, electronic unit, and electronic device

Backplane footprint for high speed, high density electrical connectors

Electrically conductive film

Flexible printed circuit board and method of manufacturing flexible...

Interconnect and method for manufacturing the same

Display apparatus

Wiring substrate and semiconductor device

Circuit board interconnection device and circuit board assembly

Differential circuit board and semiconductor light emitting device

Method of cutting conductive patterns

Resonant-coupled transmission line

Chiplets with connection posts

Flexible circuit board, light bar, light source and display device

Array substrate and method of mounting integrated circuit using the...

Printed circuit board and display device including the same

Mating backplane for high speed, high density electrical connector

Multilayer wiring board and method of producing the same

Display device

Edge connector, circuit board, and connector component

Fine feature formation techniques for printed circuit boards

Anti-interference circuit board and terminal

Electronic component, electric device including the same

Noise suppression structure for differential pair

Edge connector and printed circuit board assembly

Flexible circuit mother board and detection method thereof

Horizontally mounted capacitor module and electronic device includi...

Light sensing module and display apparatus

Breakout structure for an integrated circuit device

Patents Applicationslast 30 patents

CIRCUIT BODY AND CONNECTOR-ATTACHED CIRCUIT BODY

CIRCUIT BOARD

MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE

Core Resonance Suppression in Signal Integrity Optimized Package

REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE OF A SURFACE MOUNT CON...

REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE

PRINTED WIRING BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

CIRCUIT BOARD

CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...

WIRING BOARD AND ELECTRONIC DEVICE

WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...

DISPLAY APPARATUS

FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...

SENSOR BALL AND HOME APPLIANCE SYSTEM HAVING SAME

WIRING BOARD, MODULE, AND IMAGE DISPLAY APPARATUS

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

Conformal Wearable Battery

ELECTRONIC MODULE AND CONTACT ARRANGEMENT

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

CHIPLETS WITH CONNECTION POSTS

DISPLAY DEVICE

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

WIRING CIRCUIT BOARD

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS