Aluminium [Al] as principal constituent

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H01L2224/29224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29224Aluminium [Al] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metallic sintered bonding body and die bonding method
- Patent number 11,024,598
- Issue date Jun 1, 2021
- Senju Metal Industry Co., Ltd.
- Tetsu Takemasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Image display device
- Patent number 10,763,249
- Issue date Sep 1, 2020
- SHARP KABUSHIKI KAISHA
- Katsuji Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High temperature bonding processes incorporating metal particles an...
- Patent number 9,620,434
- Issue date Apr 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of bonded substrates
- Patent number 9,418,959
- Issue date Aug 16, 2016
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20200172767
- Publication date Jun 4, 2020
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD
- Publication number 20190393188
- Publication date Dec 26, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Tetsu TAKEMASA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMAGE DISPLAY DEVICE
- Publication number 20190371777
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- KATSUJI IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION
- Publication number 20170369746
- Publication date Dec 28, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
- Publication number 20170326640
- Publication date Nov 16, 2017
- Heraeus Deutschland GmbH & Co. KG
- Wolfgang SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal paste for joints, assembly, production method for assembly, s...

Metallic sintered bonding body and die bonding method

Image display device

Sintering pastes with high metal loading for semiconductor die atta...

Electrically conductive composition

Heat-dissipating structure and semiconductor module using same

High temperature bonding processes incorporating metal particles an...

Joint material, and jointed body

Systems of bonded substrates

Patents Applicationslast 30 patents

ELECTROCONDUCTIVE ADHESIVE

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

IMAGE DISPLAY DEVICE

ELECTRICALLY CONDUCTIVE COMPOSITION

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

Joint Material, and Jointed Body