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Aluminium [Al] as principal constituent
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H01L2224/13224
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13224
Aluminium [Al] as principal constituent
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last 30 patents
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Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
Patent number
11,658,277
Issue date
May 23, 2023
OSRAM OLED GmbH
Guido Weiss
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
Patent number
11,094,866
Issue date
Aug 17, 2021
OSRAM OLED GmbH
Guido Weiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package structure and method of manufacturing the same
Patent number
9,230,935
Issue date
Jan 5, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Cheng Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
Patent number
7,528,006
Issue date
May 5, 2009
Intel Corporation
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
Publication number
20220093549
Publication date
Mar 24, 2022
Samsung Electronics Co., Ltd.
Kunmo CHU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
Publication number
20210336111
Publication date
Oct 28, 2021
OSRAM OLED GmbH
Guido Weiss
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
Publication number
20200028045
Publication date
Jan 23, 2020
Osram Opto Semiconductors GmbH
Guido Weiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20140159233
Publication date
Jun 12, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particale-filled through-silicon...
Publication number
20100193952
Publication date
Aug 5, 2010
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particle-filled through-silicon m...
Publication number
20070001266
Publication date
Jan 4, 2007
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS