Aluminium [Al] as principal constituent

Industry

CPC
H01L2924/15724

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15724Aluminium [Al] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card attachment for enhanced robustness of thermal performance
- Patent number 11,224,927
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,371
- Issue date Sep 8, 2020
- Mitsubishi Electric Corporation
- Yoichi Hironaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,714,415
- Issue date Jul 14, 2020
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,658,324
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 10,636,679
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive interconnect in a semiconductor package
- Patent number 10,609,813
- Issue date Mar 31, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost substrates
- Patent number 10,283,484
- Issue date May 7, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,444
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive bumps of varying heights
- Patent number 10,163,844
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, method for fabricating the same, and package dev...
- Patent number 10,134,666
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and electric power steering apparatus us...
- Patent number 10,096,572
- Issue date Oct 9, 2018
- NSK Ltd.
- Shigeru Shimakawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace structures with high assembly yield
- Patent number 10,050,000
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 10,049,963
- Issue date Aug 14, 2018
- Rolls-Royce PLC
- Kalyani G Menon
- F05 - INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180358319
- Publication date Dec 13, 2018
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20180211909
- Publication date Jul 26, 2018
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME
- Publication number 20180049324
- Publication date Feb 15, 2018
- Samsung Electronics Co., Ltd.
- Jung-eun Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DECOUPLING ATTACHMENT
- Publication number 20170359898
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
- Publication number 20170359893
- Publication date Dec 14, 2017
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER STEERING APPARATUS US...
- Publication number 20170338201
- Publication date Nov 23, 2017
- NSK Ltd.
- Shigeru SHIMAKAWA
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170309559
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20170301609
- Publication date Oct 19, 2017
- Rolls-Royce plc
- Kalyani G. MENON
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE BUMPS OF VARYING HEIGHTS
- Publication number 20170263583
- Publication date Sep 14, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-LIANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20170200677
- Publication date Jul 13, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20170194240
- Publication date Jul 6, 2017
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20170186672
- Publication date Jun 29, 2017
- KYOCERA CORPORATION
- Hiroshi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170170096
- Publication date Jun 15, 2017
- Mitsubishi Electric Corporation
- Yoichi HIRONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED OUTPUT INDUCTOR ON A PRINTED...
- Publication number 20170148705
- Publication date May 25, 2017
- Infineon Techonologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatuses For High Temperature Bonding Controlled Pro...
- Publication number 20170129031
- Publication date May 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170103960
- Publication date Apr 13, 2017
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Structures with High Assembly Yield
- Publication number 20170005059
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Integral Join and Automatic Placement Machine
- Publication number 20160351533
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE HAVING A MULTI-LAYER M...
- Publication number 20160343688
- Publication date Nov 24, 2016
- Amkor Technology, Inc.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a chip package and chip package

Semiconductor package having a chip carrier and a metal plate sized...

Die-attach method to compensate for thermal expansion

Semiconductor device and method of manufacturing semiconductor device

Power decoupling attachment

Circuit card attachment for enhanced robustness of thermal performance

Method for producing an integral join and automatic placement machine

Printed circuit board and semiconductor package

Semiconductor device having terminals directly attachable to circui...

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device

Packaged semiconductor device having nanoparticle adhesion layer pa...

Capacitive interconnect in a semiconductor package

Printed circuit board and semiconductor package

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Semiconductor device including antistatic die attach material

Low cost substrates

Semiconductor device and method of manufacturing the same

Semiconductor device having conductive bumps of varying heights

Electronic device and method for producing an electronic device

Package substrate, method for fabricating the same, and package dev...

Method for manufacturing wire bonding structure, wire bonding struc...

Power semiconductor module and electric power steering apparatus us...

Semiconductor component support and semiconductor device

Bump-on-trace structures with high assembly yield

Power electronics module

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Method for manufacturing semiconductor device, heat insulating load...

Patents Applicationslast 30 patents

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

SEMICONDUCTOR DEVICE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME

POWER DECOUPLING ATTACHMENT

CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER STEERING APPARATUS US...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

POWER ELECTRONICS MODULE

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

Electronic Device and Method for Producing an Electronic Device

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE BUMPS OF VARYING HEIGHTS

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH INTEGRATED OUTPUT INDUCTOR ON A PRINTED...

Methods And Apparatuses For High Temperature Bonding Controlled Pro...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

Bump-on-Trace Structures with High Assembly Yield

Method for Producing an Integral Join and Automatic Placement Machine

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE HAVING A MULTI-LAYER M...