Aluminium (Al) as principal constituent

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H01L2224/85424

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85424Aluminium (Al) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,971,436
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,672,689
- Issue date Jun 2, 2020
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,388,594
- Issue date Aug 20, 2019
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor pad for flexible circuits and flexible circuit incorporat...
- Patent number 10,368,436
- Issue date Jul 30, 2019
- OSRAM SYLVANIA Inc.
- Sridharan Venk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a bondable coating on a carrier strip
- Patent number 10,211,180
- Issue date Feb 19, 2019
- HERAEUS DEUTSCHLAND GMBH & CO., KG
- Joachim-Franz Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit packages including modules that include at least one integr...
- Patent number 10,178,786
- Issue date Jan 8, 2019
- Honeywell International Inc.
- James L. Tucker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making semiconductor device with lead frame made from to...
- Patent number 9,947,636
- Issue date Apr 17, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic wireless transmission device
- Patent number 9,768,518
- Issue date Sep 19, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 9,768,035
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking arrangement for integration of multiple integrated circuits
- Patent number 9,741,644
- Issue date Aug 22, 2017
- Honeywell International Inc.
- Romney R. Katti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame having two leads welded together
- Patent number 9,698,084
- Issue date Jul 4, 2017
- Shinko Electric Industries Co., Ltd.
- Tetsuichiro Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor pad for flexible circuits and flexible circuit incorporat...
- Patent number 9,635,759
- Issue date Apr 25, 2017
- OSRAM SYLVANIA Inc.
- Sridharan Venk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array based fabrication of power semiconductor package with integra...
- Patent number 9,620,475
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 9,559,087
- Issue date Jan 31, 2017
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulated lead frame contact area and...
- Patent number 9,490,146
- Issue date Nov 8, 2016
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 9,478,486
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SOP fan-out...
- Patent number 9,385,006
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using substrate with conductive...
- Patent number 9,368,423
- Issue date Jun 14, 2016
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad configurations for an electronic package assembly
- Patent number 9,331,052
- Issue date May 3, 2016
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (BGA) semiconductor packages
- Patent number 9,159,691
- Issue date Oct 13, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding over active area of a semiconductor circuit
- Patent number 9,153,555
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding over active area of a semiconductor circuit
- Patent number 9,142,527
- Issue date Sep 22, 2015
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of assembling same
- Patent number 9,129,948
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...
- Publication number 20190326201
- Publication date Oct 24, 2019
- STMICROELECTRONICS, INC.
- Frederick Ray GOMEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY
- Publication number 20150035160
- Publication date Feb 5, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20140239509
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES
- Publication number 20140239485
- Publication date Aug 28, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20140099753
- Publication date Apr 10, 2014
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
- Publication number 20140091465
- Publication date Apr 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140070388
- Publication date Mar 13, 2014
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...
- Publication number 20140048936
- Publication date Feb 20, 2014
- Kulite Semiconductor Products, Inc.
- Alex Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021608
- Publication date Jan 23, 2014
- Samsunung Electronics., Ltd.
- KEUN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20130341784
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC WIRELESS TRANSMISSION DEVICE
- Publication number 20130293428
- Publication date Nov 7, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Charles SOURIAU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE AND OUTPUT CIRCUIT
- Publication number 20130200929
- Publication date Aug 8, 2013
- Rohm Co., Ltd.
- Takashi Sawada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES
- Publication number 20130127051
- Publication date May 23, 2013
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20120241956
- Publication date Sep 27, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer-Level Multi-Row Et...
- Publication number 20120038064
- Publication date Feb 16, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Bond o...
- Publication number 20120025373
- Publication date Feb 2, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20110309512
- Publication date Dec 22, 2011
- NISSAN MOTOR CO., LTD.
- Fumihiko Gejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY
- Publication number 20110298117
- Publication date Dec 8, 2011
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal foil interconnection of electrical devices
- Publication number 20110278350
- Publication date Nov 17, 2011
- Keith V. Guinn
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium (Al) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-branch terminal for integrated circuit (IC) package

Printed circuit board and semiconductor package

Protection from ESD during the manufacturing process of semiconduct...

Printed circuit board and semiconductor package

Protection from ESD during the manufacturing process of semiconduct...

Conductor pad for flexible circuits and flexible circuit incorporat...

Semiconductor device and method of forming an embedded SoP fan-out...

Method for producing a bondable coating on a carrier strip

Circuit packages including modules that include at least one integr...

Aluminum coated copper bond wire and method of making the same

Method for making semiconductor device with lead frame made from to...

Microelectronic wireless transmission device

Electronic module and method for producing an electronic module

Stacking arrangement for integration of multiple integrated circuits

Semiconductor device and lead frame having two leads welded together

Conductor pad for flexible circuits and flexible circuit incorporat...

Array based fabrication of power semiconductor package with integra...

Techniques for packaging multiple device components

Semiconductor device with encapsulated lead frame contact area and...

Semiconductor device and method of forming topside and bottom-side...

Semiconductor device and method of forming an embedded SOP fan-out...

Semiconductor device and method of using substrate with conductive...

Pad configurations for an electronic package assembly

Localized alloying for improved bond reliability

Stackable package by using internal stacking modules

Window ball grid array (BGA) semiconductor packages

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device and method of assembling same

Solderless die attach to a direct bonded aluminum substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

Stackable Package by Using Internal Stacking Modules

Semiconductor Device and Method of Forming Topside and Bottom-side...

WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES

Solderless Die Attach to a Direct Bonded Aluminum Substrate

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

MICROELECTRONIC WIRELESS TRANSMISSION DEVICE

POWER MODULE AND OUTPUT CIRCUIT

WINDOW BALL GRID ARRAY (BGA) SEMICONDUCTOR PACKAGES

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

Semiconductor Device and Method of Forming Wafer-Level Multi-Row Et...

Semiconductor Device and Method of Forming Vertically Offset Bond o...

Semiconductor Device

PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY

Metal foil interconnection of electrical devices