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Aluminium [Al] as principal constituent
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CPC
H01L2224/81624
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/81624
Aluminium [Al] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Electronic component-mounted structure, IC card and COF package
Patent number
9,516,749
Issue date
Dec 6, 2016
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yoshiyuki Wada
G02 - OPTICS
Patents Applications
last 30 patents
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Patent Application
ELECTRONIC DEVICE
Publication number
20130277850
Publication date
Oct 24, 2013
NAPRA CO., LTD.
Shigenobu Sekine
H01 - BASIC ELECTRIC ELEMENTS