Aluminium alloys

Industry

CPC
H01L23/53219

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53219Aluminium alloys

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Apparatus and method of manufacturing interconnect structures
- Patent number 12,091,752
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Ting Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method of bi-layer pixel isolation in advanced LCOS b...
- Patent number 12,055,821
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress passivation layer
- Patent number 11,996,356
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including aluminum alloy word lines...
- Patent number 11,990,413
- Issue date May 21, 2024
- SanDisk Technologies LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,868
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 11,705,340
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,688,684
- Issue date Jun 27, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress passivation layer
- Patent number 11,670,573
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,587,869
- Issue date Feb 21, 2023
- ABLIC INC.
- Hisashi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor device
- Patent number 11,476,195
- Issue date Oct 18, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,367,738
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,257,752
- Issue date Feb 22, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization
- Patent number 11,244,897
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of the line metal structure and method
- Patent number 11,127,674
- Issue date Sep 21, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,056,429
- Issue date Jul 6, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress passivation layer
- Patent number 11,031,325
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor apparatus
- Patent number 10,991,572
- Issue date Apr 27, 2021
- Semiconductor Manufacturing (Shanghai) International Corporation
- Jin E Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a reactant metal layer disposed betw...
- Patent number 10,937,657
- Issue date Mar 2, 2021
- Mitsubishi Electric Corporation
- Ryuji Ueno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 10,886,300
- Issue date Jan 5, 2021
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure and display device
- Patent number 10,756,121
- Issue date Aug 25, 2020
- Innolux Corporation
- Ming-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a contact structure contacting a layer
- Patent number 10,741,494
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Aurore Constant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with improved reliability
- Patent number 10,707,858
- Issue date Jul 7, 2020
- Cree, Inc.
- Mrinal K. Das
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Biconvex low resistance metal wire
- Patent number 10,665,541
- Issue date May 26, 2020
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 10,658,325
- Issue date May 19, 2020
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250054866
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20240384408
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240312885
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...
- Publication number 20240266291
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20230307333
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20230298903
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTE...
- Publication number 20230102711
- Publication date Mar 30, 2023
- Intel Corporation
- Ming-Yi Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230064636
- Publication date Mar 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Yukio TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...
- Publication number 20230051815
- Publication date Feb 16, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20220406648
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220336365
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Dayoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20220319864
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20220298634
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Ting TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC SUBASSEMBLY AND ELECTRONIC ASSEMBLAGE
- Publication number 20220199543
- Publication date Jun 23, 2022
- ROBERT BOSCH GmbH
- Irfan Aydogmus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220139827
- Publication date May 5, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- HYUNYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20210335706
- Publication date Oct 28, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION
- Publication number 20210313264
- Publication date Oct 7, 2021
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Stress Passivation Layer
- Publication number 20210287973
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210134714
- Publication date May 6, 2021
- ABLIC Inc.
- Hisashi HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20210118783
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including bonding pad metal layer structure

Pit-less chemical mechanical planarization process and device struc...

Apparatus and method of manufacturing interconnect structures

Structure and method of bi-layer pixel isolation in advanced LCOS b...

Low-stress passivation layer

Three-dimensional memory device including aluminum alloy word lines...

Semiconductor device including a porous dielectric layer, and metho...

Semiconductor device

Semiconductor device including bonding pad metal layer structure

Pit-less chemical mechanical planarization process and device struc...

Semiconductor structure and method for fabricating the same

Low-stress passivation layer

Semiconductor device and method of manufacturing the same

Semiconductor device including a porous dielectric layer, and metho...

Wiring structure and semiconductor device

Semiconductor device

Fence structure to prevent stiction in a MEMS motion sensor

Semiconductor structure and method for fabricating the same

Back end of line metallization

Back end of the line metal structure and method

Semiconductor device including a porous dielectric layer, and metho...

Low-stress passivation layer

Manufacturing method for semiconductor apparatus

Semiconductor device including a reactant metal layer disposed betw...

Semiconductor device

Conductor structure and display device

Electronic device including a contact structure contacting a layer

Power module with improved reliability

Biconvex low resistance metal wire

Semiconductor device including a buffer layer structure for reducin...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

SEMICONDUCTOR STRUCTURE

Power Semiconductor Devices Including Beryllium Metallization

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

LOW-STRESS PASSIVATION LAYER

MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

Semiconductor Device Including Bonding Pad Metal Layer Structure

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

LOW-STRESS PASSIVATION LAYER

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICES

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES

ELECTRONIC SUBASSEMBLY AND ELECTRONIC ASSEMBLAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device Including Bonding Pad Metal Layer Structure

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

BACK END OF LINE METALLIZATION

Low-Stress Passivation Layer

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LOW-STRESS PASSIVATION LAYER