-
-
-
-
LOW-STRESS PASSIVATION LAYER
-
Publication number 20230307333
-
Publication date Sep 28, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Hsiang-Ku Shen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
SEMICONDUCTOR DEVICES
-
Publication number 20220336365
-
Publication date Oct 20, 2022
-
Samsung Electronics Co., Ltd.
-
Dayoung LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
BACK END OF LINE METALLIZATION
-
Publication number 20210313264
-
Publication date Oct 7, 2021
-
International Business Machines Corporation
-
CHANRO PARK
-
H01 - BASIC ELECTRIC ELEMENTS
-
Low-Stress Passivation Layer
-
Publication number 20210287973
-
Publication date Sep 16, 2021
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Hsiang-Ku Shen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
LOW-STRESS PASSIVATION LAYER
-
Publication number 20210118783
-
Publication date Apr 22, 2021
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Hsiang-Ku Shen
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
BICONVEX LOW RESISTANCE METAL WIRE
-
Publication number 20190393152
-
Publication date Dec 26, 2019
-
International Business Machines Corporation
-
Praneet Adusumilli
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
BICONVEX LOW RESISTANCE METAL WIRE
-
Publication number 20190139894
-
Publication date May 9, 2019
-
International Business Machines Corporation
-
Praneet Adusumilli
-
H01 - BASIC ELECTRIC ELEMENTS