Aluminium gallium arsenide [AlGaAs]

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CPC
H01L2924/10336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10336Aluminium gallium arsenide [AlGaAs]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface emitting light source with lateral variant refractive index...
- Patent number 11,099,393
- Issue date Aug 24, 2021
- Facebook Technologies, LLC
- Maik Andre Scheller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method of producing an optoelectronic...
- Patent number 9,768,360
- Issue date Sep 19, 2017
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for wafer dicing
- Patent number 9,748,187
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wall in millimeter-wave cavity
- Patent number 9,741,666
- Issue date Aug 22, 2017
- MACOM Technology Solutions Holdings, Inc.
- Emmanuelle R. O. Convert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal for a backside package of backside illuminated image sensor
- Patent number 9,673,246
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 9,508,903
- Issue date Nov 29, 2016
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device and radio communication device
- Patent number 9,263,559
- Issue date Feb 16, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus comprised of two types of transistors
- Patent number 9,153,573
- Issue date Oct 6, 2015
- Sumitomo Electric Industries, Ltd.
- Fumio Yamada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 9,105,555
- Issue date Aug 11, 2015
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Optoelectronic component and method for producing same
- Patent number 9,076,931
- Issue date Jul 7, 2015
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing electronic device
- Patent number 8,878,250
- Issue date Nov 4, 2014
- Sumitomo Chemical Company, Limited
- Masahiko Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and radio communication device
- Patent number 8,860,093
- Issue date Oct 14, 2014
- Murata Manufacturing Co., Ltd.
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting and bonding adjacent layers with nanostructures
- Patent number 8,815,332
- Issue date Aug 26, 2014
- Smoltek AB
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 8,754,396
- Issue date Jun 17, 2014
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor light-emitting device, method for manufacturing the s...
- Patent number 8,742,438
- Issue date Jun 3, 2014
- Nichia Corporation
- Takeshi Kususe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,742,499
- Issue date Jun 3, 2014
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE EMITTING LIGHT SOURCE WITH LATERAL VARIANT REFRACTIVE INDEX...
- Publication number 20210157142
- Publication date May 27, 2021
- Facebook Technologies, LLC
- Maik Andre Scheller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STRUCTURE AND METHOD FOR WAFER DICING
- Publication number 20160181213
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20160020130
- Publication date Jan 21, 2016
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR COOLING THREE-DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20150060039
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- HUI-YU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting and Bonding Adjacent Layers with Nanostructures
- Publication number 20140360661
- Publication date Dec 11, 2014
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20140361406
- Publication date Dec 11, 2014
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
- Publication number 20140340900
- Publication date Nov 20, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Stephen Bathurst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL COUPLING DEVICE
- Publication number 20140159062
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Yukio NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS COMPRISED OF TWO TYPES OF TRANSISTORS
- Publication number 20130321082
- Publication date Dec 5, 2013
- Fumio YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Component and Method for Producing Same
- Publication number 20130264596
- Publication date Oct 10, 2013
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface Structure for Copper-Copper Peeling Integrity
- Publication number 20130149856
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20130100618
- Publication date Apr 25, 2013
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOI
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL METAL FOR A BACKSIDE PACKAGE OF BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20130026467
- Publication date Jan 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...
- Publication number 20120326178
- Publication date Dec 27, 2012
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
- Publication number 20120319170
- Publication date Dec 20, 2012
- Sumitomo Chemical Company, Limited
- Masahiko HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting and Bonding Adjacent Layers with Nanostructures
- Publication number 20120301607
- Publication date Nov 29, 2012
- SMOLTEK AB
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20120273974
- Publication date Nov 1, 2012
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20120261799
- Publication date Oct 18, 2012
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting and Bonding Adjacent Layers with Nanostructures
- Publication number 20120125537
- Publication date May 24, 2012
- SMOLTEK AB
- Mohammad Shafiqul Kabir
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS AND APPARATUS FOR A STACKED-DIE INTERPOSER
- Publication number 20120100672
- Publication date Apr 26, 2012
- Micron Technology, Inc.
- Michael Brooks
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium gallium arsenide [AlGaAs]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for micro-transfer-printing

Stretchable form of single crystal silicon for high performance ele...

Surface emitting light source with lateral variant refractive index...

Dummy metal with zigzagged edges

Method for permanently bonding wafers

Dummy metal with zigzagged edges

Method for applying a bonding layer

Apparatus and methods for micro-transfer-printing

Dummy metal with zigzagged edges

Method for wafer dicing

Optoelectronic component and method of producing an optoelectronic...

Wafer structure and method for wafer dicing

Electromagnetic wall in millimeter-wave cavity

Dual metal for a backside package of backside illuminated image sensor

Method for applying a bonding layer

Apparatus and methods for micro-transfer-printing

Optoelectronic component and method for producing an optoelectronic...

Apparatus and methods for micro-transfer-printing

Apparatus and methods for micro-transfer-printing

Semiconductor device and radio communication device

Semiconductor apparatus comprised of two types of transistors

Stretchable form of single crystal silicon for high performance ele...

Semiconductor composite apparatus, method for manufacturing the sem...

Optoelectronic component and method for producing same

Electronic device and method for producing electronic device

Semiconductor device and radio communication device

Connecting and bonding adjacent layers with nanostructures

Stretchable form of single crystal silicon for high performance ele...

Semiconductor light-emitting device, method for manufacturing the s...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SURFACE EMITTING LIGHT SOURCE WITH LATERAL VARIANT REFRACTIVE INDEX...

Device and Method for UBM/RDL Routing

Stretchable Form of Single Crystal Silicon for High Performance Ele...

Device and Method for UBM/RDL Routing

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

Device and Method for UBM/RDL Routing

METHOD FOR WAFER DICING

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR APPLYING A BONDING LAYER

WAFER STRUCTURE AND METHOD FOR WAFER DICING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

STRUCTURE AND METHOD FOR COOLING THREE-DIMENSIONAL INTEGRATED CIRCUITS

Connecting and Bonding Adjacent Layers with Nanostructures

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS

OPTICAL COUPLING DEVICE

SEMICONDUCTOR APPARATUS COMPRISED OF TWO TYPES OF TRANSISTORS

Optoelectronic Component and Method for Producing Same

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

Interface Structure for Copper-Copper Peeling Integrity

Stretchable Form of Single Crystal Silicon for High Performance Ele...

DUAL METAL FOR A BACKSIDE PACKAGE OF BACKSIDE ILLUMINATED IMAGE SENSOR

OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC...

ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Connecting and Bonding Adjacent Layers with Nanostructures

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

Connecting and Bonding Adjacent Layers with Nanostructures

METHODS AND APPARATUS FOR A STACKED-DIE INTERPOSER