Aluminium indium antimonide [AlInSb]

Industry

CPC
H01L2924/1034

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1034Aluminium indium antimonide [AlInSb]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,956
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,749,622
- Issue date Sep 5, 2023
- SUMITOMO DEVICE INNOVATIONS, INC.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,710,778
- Issue date Jul 25, 2023
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transistor amplifiers having leadframes with integr...
- Patent number 11,588,448
- Issue date Feb 21, 2023
- Wolfspeed, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting device
- Patent number 11,367,994
- Issue date Jun 21, 2022
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for providing electrical isolation in semiconductor devices
- Patent number 11,296,055
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,289,407
- Issue date Mar 29, 2022
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 11,270,967
- Issue date Mar 8, 2022
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor substrate
- Patent number 11,201,217
- Issue date Dec 14, 2021
- COORSTEK KK
- Kenichi Eriguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,158,557
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface emitting light source with lateral variant refractive index...
- Patent number 11,099,393
- Issue date Aug 24, 2021
- Facebook Technologies, LLC
- Maik Andre Scheller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,094,680
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,081,452
- Issue date Aug 3, 2021
- Sumitomo Electric Device Innovations, Inc.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,965,097
- Issue date Mar 30, 2021
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,950,524
- Issue date Mar 16, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 10,910,491
- Issue date Feb 2, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
- Publication number 20220271015
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077131
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
- Publication number 20210408976
- Publication date Dec 30, 2021
- Cree, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...
- Publication number 20210408978
- Publication date Dec 30, 2021
- Cree, Inc.
- Madhu Chidurala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210398883
- Publication date Dec 23, 2021
- Vanguard International Semiconductor Corporation
- Chih-Yen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20210375842
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE EMITTING LIGHT SOURCE WITH LATERAL VARIANT REFRACTIVE INDEX...
- Publication number 20210157142
- Publication date May 27, 2021
- Facebook Technologies, LLC
- Maik Andre Scheller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20210159665
- Publication date May 27, 2021
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098617
- Publication date Apr 1, 2021
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20200287004
- Publication date Sep 10, 2020
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200279822
- Publication date Sep 3, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20200185881
- Publication date Jun 11, 2020
- Nichia Corporation.
- Takuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Metal with Zigzagged Edges
- Publication number 20200083156
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
- Publication number 20200066685
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20200020791
- Publication date Jan 16, 2020
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190386128
- Publication date Dec 19, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Metal with Zigzagged Edges
- Publication number 20190122975
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20190115332
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20190115435
- Publication date Apr 18, 2019
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190043825
- Publication date Feb 7, 2019
- ROHM CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium indium antimonide [AlInSb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Semiconductor device with a passivation layer and method for produc...

Packaging for RF transistor amplifiers

Semiconductor device having reduced capacitance between source and...

Front-to-back bonding with through-substrate via (TSV)

Field effect transistor and semiconductor device

Packages and methods of forming packages

Semiconductor device and method for fabricating the same

System on integrated chips and methods of forming same

Radio frequency transistor amplifiers having leadframes with integr...

Multi-zone radio frequency transistor amplifiers

Apparatus and methods for micro-transfer-printing

Stretchable form of single crystal silicon for high performance ele...

Light emitting device

Structures for providing electrical isolation in semiconductor devices

Package structure

Method for manufacturing semiconductor device and semiconductor device

Nitride semiconductor substrate

Semiconductor device with a passivation layer and method for produc...

Surface emitting light source with lateral variant refractive index...

Packages and methods of forming packages

Field effect transistor and semiconductor device

System on integrated chips and methods of forming same

Light emitting device

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor device having reduced capacitance between source and...

Dummy metal with zigzagged edges

Methods for processing high electron mobility transistor (HEMT)

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Structures for Providing Electrical Isolation in Semiconductor Devices

SEMICONDUCTOR DEVICE

MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS

RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGR...

PACKAGE STRUCTURE

Packages and Methods of Forming Packages

System on Integrated Chips and Methods of Forming Same

SURFACE EMITTING LIGHT SOURCE WITH LATERAL VARIANT REFRACTIVE INDEX...

LIGHT EMITTING DEVICE

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE

Dummy Metal with Zigzagged Edges

Structures for Providing Electrical Isolation in Semiconductor Devices

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

Stretchable Form of Single Crystal Silicon for High Performance Ele...

Device and Method for UBM/RDL Routing

SEMICONDUCTOR DEVICE

Dummy Metal with Zigzagged Edges

Packages and Methods of Forming Packages

HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

SEMICONDUCTOR DEVICE

System on Integrated Chips and Methods of Forming Same