Aluminium indium arsenide [AlInAs]

Industry

CPC
H01L2924/10339

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10339Aluminium indium arsenide [AlInAs]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,867,900
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 10,541,227
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,510,654
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal with zigzagged edges
- Patent number 10,157,825
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufacur...
- Patent number 9,984,969
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, multi-die packages, and methods of manufactu...
- Patent number 9,659,863
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing same
- Patent number 9,076,931
- Issue date Jul 7, 2015
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...
- Publication number 20170256487
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Component and Method for Producing Same
- Publication number 20130264596
- Publication date Oct 10, 2013
- Osram Opto Semiconductors GmbH
- Wolfgang Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium indium arsenide [AlInAs]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for UBM/RDL routing

System on integrated chips and methods of forming same

System on integrated chips and methods of forming same

Dummy metal with zigzagged edges

System on integrated chips and methods of forming same

Dummy metal with zigzagged edges

Dummy metal with zigzagged edges

Semiconductor devices, multi-die packages, and methods of manufacur...

Semiconductor devices, multi-die packages, and methods of manufactu...

Package systems including passive electrical components

Optoelectronic component and method for producing same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

System on Integrated Chips and Methods of Forming Same

Device and Method for UBM/RDL Routing

Device and Method for UBM/RDL Routing

System on Integrated Chips and Methods of Forming Same

Device and Method for UBM/RDL Routing

Semiconductor Devices, Multi-Die Packages, and Methods of Manufactu...

Optoelectronic Component and Method for Producing Same

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS