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H01L2224/83099

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83099Ambient temperature

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 11,777,016
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using range compensating mat...
- Patent number 11,626,392
- Issue date Apr 11, 2023
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 11,552,033
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method and joined structure
- Patent number 11,450,643
- Issue date Sep 20, 2022
- Tohoku University
- Takehito Shimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 11,411,100
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit
- Patent number 10,923,459
- Issue date Feb 16, 2021
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for improved die bonding
- Patent number 10,199,351
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for ultrasonic bonding having at least one first and second...
- Patent number 9,296,065
- Issue date Mar 29, 2016
- Hesse GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compound structure and method for forming a compound structure
- Patent number 9,219,049
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing optical module
- Patent number 9,214,446
- Issue date Dec 15, 2015
- Citizen Holdings Co., Ltd.
- Kaoru Yoda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufcaturing method for room-temperature substrate bonding
- Patent number 8,936,998
- Issue date Jan 20, 2015
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
- Publication number 20240332116
- Publication date Oct 3, 2024
- Intel Corporation
- Chun Keang Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230231087
- Publication date Jul 20, 2023
- Unimicron Technology Corp.
- Hao-Wei TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20230163088
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20220336641
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
- Publication number 20220199569
- Publication date Jun 23, 2022
- TOHOKU UNIVERSITY
- Takehito SHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20220102535
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20210358875
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE
- Publication number 20210320006
- Publication date Oct 14, 2021
- OSRAM OLED GmbH
- Martin Behringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20200194409
- Publication date Jun 18, 2020
- Silicon Genesis Corporation
- Theodore E. FONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160322328
- Publication date Nov 3, 2016
- ZIPTRONIX, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20160190093
- Publication date Jun 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Bonding and Sealing With Spaced Nanorods
- Publication number 20160172327
- Publication date Jun 16, 2016
- University of Connecticut
- Stephen P. Stagon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160086913
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20150287692
- Publication date Oct 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound Structure and Method for Forming a Compound Structure
- Publication number 20150171045
- Publication date Jun 18, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING REWORKABLE, THERMALLY CONDUCTIVE AND ELECTRICALLY...
- Publication number 20140302995
- Publication date Oct 9, 2014
- Board of Trustees of the University of Arkansas
- Ajay P. Malshe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...
- Publication number 20140151439
- Publication date Jun 5, 2014
- Hesse GmbH
- Hans-Juergen Hesse
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20130213561
- Publication date Aug 22, 2013
- Jun UTSUMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD FOR BONDING THIN FILM PIECE
- Publication number 20130075023
- Publication date Mar 28, 2013
- Sumitomo Electric Industries, Ltd.
- Akira Furuya
- B44 - DECORATIVE ARTS
Information Patent Application
Dual Cure Thermally Conductive Adhesive
- Publication number 20130042972
- Publication date Feb 21, 2013
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20120234458
- Publication date Sep 20, 2012
- Kaoru YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MATERIAL BONDING
- Publication number 20110233792
- Publication date Sep 29, 2011
- IMEC
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Ambient temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor device using high stress cleave plane

Packaged multi-chip semiconductor devices and methods of fabricatin...

Package structure and manufacturing method of the same

Display module and manufacturing method thereof

Semiconductor element bonding structure, method for producing semic...

Method of forming backside power rails

Dielectric-dielectric and metallization bonding via plasma activati...

Method of forming semiconductor device using range compensating mat...

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Packaged multi-chip semiconductor devices and methods of fabricatin...

Chemical bonding method and joined structure

Method of forming backside power rails

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Three dimensional integrated circuit

Methods for improved die bonding

Low-temperature bonding with spaced nanorods and eutectic alloys

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method and device for improved die bonding

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Method for coating and bonding substrates

Method for ultrasonic bonding having at least one first and second...

Compound structure and method for forming a compound structure

Method of manufacturing optical module

Manufcaturing method for room-temperature substrate bonding

Patents Applicationslast 30 patents

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

Method of Forming Backside Power Rails

CHEMICAL BONDING METHOD AND JOINED STRUCTURE

Method of Forming Backside Power Rails

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

THREE DIMENSIONAL INTEGRATED CIRCUIT

METHODS FOR IMPROVED DIE BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Low-Temperature Bonding and Sealing With Spaced Nanorods

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Compound Structure and Method for Forming a Compound Structure

METHOD OF FORMING REWORKABLE, THERMALLY CONDUCTIVE AND ELECTRICALLY...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...

DEVICE AND DEVICE MANUFACTURE METHOD

METHOD FOR BONDING THIN FILM PIECE

Dual Cure Thermally Conductive Adhesive

METHOD OF MANUFACTURING OPTICAL MODULE

Method For Low Temperature Bonding And Bonded Structure

METHODS AND SYSTEMS FOR MATERIAL BONDING