an insulative substrate being used as a diepad

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49506an insulative substrate being used as a diepad

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and the method of manufacturing the same
- Patent number 12,107,056
- Issue date Oct 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,923,278
- Issue date Mar 5, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,842,954
- Issue date Dec 12, 2023
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with galvanically isolated semiconductor chips
- Patent number 11,837,531
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory modules and memory packages including graphene layers for th...
- Patent number 11,721,742
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of thin film metal with stable native oxide for solder wetting...
- Patent number 11,683,973
- Issue date Jun 20, 2023
- Universal Display Corporation
- Gregory McGraw
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor module
- Patent number 11,664,298
- Issue date May 30, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies and methods of manufacture
- Patent number 11,521,921
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,417,590
- Issue date Aug 16, 2022
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer die attachment
- Patent number 11,410,913
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with isolation layer
- Patent number 11,404,359
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,328,985
- Issue date May 10, 2022
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing same
- Patent number 11,227,845
- Issue date Jan 18, 2022
- Hyundai Motor Company
- Hyun Koo Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 11,189,548
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory modules and memory packages including graphene layers for th...
- Patent number 11,081,565
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional switch and bidirectional switch device including the...
- Patent number 11,062,981
- Issue date Jul 13, 2021
- Panasonic Corporation
- Yusuke Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device, and a method for...
- Patent number 10,978,399
- Issue date Apr 13, 2021
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust electronics mounting device
- Patent number 10,886,198
- Issue date Jan 5, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided integrated fan-out package
- Patent number 10,861,823
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,753,963
- Issue date Aug 25, 2020
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust integrated circuit package
- Patent number 10,720,379
- Issue date Jul 21, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device including ring frame for thermal impedan...
- Patent number 10,672,688
- Issue date Jun 2, 2020
- Integra Technologies, Inc.
- William Veitschegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer die attachment
- Patent number 10,636,727
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectifier IC and insulation type switching power supply using the same
- Patent number 10,594,228
- Issue date Mar 17, 2020
- Rohm Co., Ltd.
- Junichi Hagino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 10,573,594
- Issue date Feb 25, 2020
- NXP USA, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,373,894
- Issue date Aug 6, 2019
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor isolation
- Patent number 10,345,343
- Issue date Jul 9, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...
- Publication number 20240379518
- Publication date Nov 14, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nicholas L. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENTS
- Publication number 20240363497
- Publication date Oct 31, 2024
- INFINEON TECHNOLOGIES AG
- Andressa COLVERO SCHITTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312877
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...
- Publication number 20240266260
- Publication date Aug 8, 2024
- InfineonTechnologies AG
- Olaf Rüdiger Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240178110
- Publication date May 30, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112971
- Publication date Apr 4, 2024
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369185
- Publication date Nov 16, 2023
- Rohm Co., Ltd.
- Yuto NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER, INSULATION MODULE, LOW-VOLTAGE CIRCUIT UNIT, AND HIGH-...
- Publication number 20230361773
- Publication date Nov 9, 2023
- ROHM CO., LTD.
- Kosei OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230275009
- Publication date Aug 31, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20230174828
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230050112
- Publication date Feb 16, 2023
- Fuji Electric Co., Ltd.
- Masanori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20220392830
- Publication date Dec 8, 2022
- STMicroelectronics S.r.l
- Federico Giovanni ZIGLIOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GALVANICALLY ISOLATED SEMICONDUCTOR CHIPS
- Publication number 20220384319
- Publication date Dec 1, 2022
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20220352055
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220246507
- Publication date Aug 4, 2022
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICON...
- Publication number 20220231157
- Publication date Jul 21, 2022
- GPOWER SEMICONDUCTOR, INC.
- Junfeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH ISOLATION LAYER
- Publication number 20220122905
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...
- Publication number 20210367057
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20210225783
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20210183795
- Publication date Jun 17, 2021
- Hyundai Motor Company
- Hyun Koo Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20210167000
- Publication date Jun 3, 2021
- STMicroelectronics S.r.l
- Federico Giovanni ZIGLIOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210159151
- Publication date May 27, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chao-Tsung Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIDIRECTIONAL SWITCH AND BIDIRECTIONAL SWITCH DEVICE INCLUDING THE...
- Publication number 20210104453
- Publication date Apr 8, 2021
- PANASONIC CORPORATION
- Yusuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210098347
- Publication date Apr 1, 2021
- Rohm Co., Ltd.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20210066174
- Publication date Mar 4, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...
- Publication number 20210036125
- Publication date Feb 4, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

an insulative substrate being used as a diepad

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and the method of manufacturing the same

Package with electrically insulated carrier and at least one step o...

Heat-dissipating wirebonded members on package surfaces

Semiconductor module

Package with electrically insulated carrier and at least one step o...

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor device with galvanically isolated semiconductor chips

Memory modules and memory packages including graphene layers for th...

Use of thin film metal with stable native oxide for solder wetting...

Semiconductor module

Semiconductor device package assemblies and methods of manufacture

Method of manufacturing semiconductor devices and corresponding sem...

Multi-layer die attachment

Leadframe package with isolation layer

Semiconductor module

Power module and method of manufacturing same

Pre-encapsulated lead frames for microelectronic device packages, a...

Memory modules and memory packages including graphene layers for th...

Bidirectional switch and bidirectional switch device including the...

Die interconnect substrate, an electrical device, and a method for...

Robust electronics mounting device

Dual-sided integrated fan-out package

Current sensor isolation

Robust integrated circuit package

Semiconductor power device including ring frame for thermal impedan...

Multi-layer die attachment

Rectifier IC and insulation type switching power supply using the same

Semiconductor package design providing reduced electromagnetic coup...

Package structure and the method to fabricate thereof

Current sensor isolation

Patents Applicationslast 30 patents

INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR MODULE ARRANGEMENTS

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

SEMICONDUCTOR DEVICE

METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER...

SEMICONDUCTOR MODULE

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY

SEMICONDUCTOR DEVICE

GATE DRIVER, INSULATION MODULE, LOW-VOLTAGE CIRCUIT UNIT, AND HIGH-...

SEMICONDUCTOR MODULE

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE WITH GALVANICALLY ISOLATED SEMICONDUCTOR CHIPS

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICON...

LEADFRAME PACKAGE WITH ISOLATION LAYER

MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

POWER MODULE AND METHOD OF MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SENSING DEVICE AND MANUFACTURING METHOD THEREOF

BIDIRECTIONAL SWITCH AND BIDIRECTIONAL SWITCH DEVICE INCLUDING THE...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

MEMORY MODULES AND MEMORY PACKAGES INCLUDING GRAPHENE LAYERS FOR TH...