Anodic bonding

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H01L2224/80893

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80893Anodic bonding

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-wafer pair anodic bonding apparatus and method
- Patent number 9,287,126
- Issue date Mar 15, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Integrated circuit, a chip package and a method for manufacturing a...
- Patent number 9,165,792
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS pressure sensor device and manufacturing method thereof
- Patent number 8,590,389
- Issue date Nov 26, 2013
- Metrodyne Microsystems Corporation, R.O.C.
- Chin-Fu Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
- Publication number 20140322892
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
INTEGRATED CIRCUIT, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140084302
- Publication date Mar 27, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130205908
- Publication date Aug 15, 2013
- Metrodyne Microsystem Corporation, R.O.C.
- Chin-Fu Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY