Anodic bonding

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CPC
H01L2224/83893

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83893Anodic bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Parameter adjustment method of bonding apparatus and bonding system
- Patent number 11,721,596
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodic bonding of a substrate of glass having contact vias to a sub...
- Patent number 11,398,452
- Issue date Jul 26, 2022
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Stefan Weinberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding structure and bonding method
- Patent number 11,145,589
- Issue date Oct 12, 2021
- Denso Corporation
- Naohisa Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing layered semiconductor structures
- Patent number 10,068,795
- Issue date Sep 4, 2018
- GlobalWafers Co., Ltd.
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,054,231
- Issue date Jun 9, 2015
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stacked semiconductor chips
- Patent number 8,476,738
- Issue date Jul 2, 2013
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-TO-WAFER STACKING METHOD
- Publication number 20240047416
- Publication date Feb 8, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tanlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining Method
- Publication number 20220328449
- Publication date Oct 13, 2022
- Marelli Corporation
- Teruyoshi Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20210327773
- Publication date Oct 21, 2021
- TOKYO ELECTRON LIMITED
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200258863
- Publication date Aug 13, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200258862
- Publication date Aug 13, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE BONDING STRUCTURE AND BONDING METHOD
- Publication number 20200203269
- Publication date Jun 25, 2020
- DENSO CORPORATION
- Naohisa HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200118967
- Publication date Apr 16, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Method for Forming Semiconductor Devices
- Publication number 20180068975
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20130264600
- Publication date Oct 10, 2013
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110317371
- Publication date Dec 29, 2011
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS

Anodic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Parameter adjustment method of bonding apparatus and bonding system

Anodic bonding of a substrate of glass having contact vias to a sub...

Semiconductor package devices and method for forming semiconductor...

Semiconductor module bonding structure and bonding method

Methods for preparing layered semiconductor structures

Method of fabricating semiconductor device using gang bonding and s...

Method of fabricating semiconductor device using gang bonding and s...

Electronic package with stacked semiconductor chips

Patents Applicationslast 30 patents

CHIP-TO-WAFER STACKING METHOD

Joining Method

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

SEMICONDUCTOR MODULE BONDING STRUCTURE AND BONDING METHOD

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

Semiconductor Devices and Method for Forming Semiconductor Devices

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF