Anodic bonding

Industry

CPC
H01L2224/81893

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81893Anodic bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,054,231
- Issue date Jun 9, 2015
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 8,901,751
- Issue date Dec 2, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with dual or multiple-etched flip-chip con...
- Patent number 8,723,318
- Issue date May 13, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with dual or multiple-etched flip-chip con...
- Patent number 8,330,272
- Issue date Dec 11, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20130264600
- Publication date Oct 10, 2013
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...
- Publication number 20130099376
- Publication date Apr 25, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE
- Publication number 20120217638
- Publication date Aug 30, 2012
- TOHOKU UNIVERSITY
- Shuji Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...
- Publication number 20120007232
- Publication date Jan 12, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Anodic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip mounted on a packaging substrate

Method of fabricating semiconductor device using gang bonding and s...

Semiconductor device, electronic device, and semiconductor device m...

Method of fabricating semiconductor device using gang bonding and s...

Semiconductor device, electronic device, and semiconductor device m...

Microelectronic packages with dual or multiple-etched flip-chip con...

Microelectronic packages with dual or multiple-etched flip-chip con...

Patents Applicationslast 30 patents

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE

MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CON...