Antimony (Sb) as principal constituent

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H01L2224/4542

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4542Antimony (Sb) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method comprising bonding an ele...
- Patent number 10,522,482
- Issue date Dec 31, 2019
- Mitsubishi Electric Corporation
- Yumie Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package and fabricating method th...
- Patent number 9,620,460
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Hyun-Pil Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with segmented base plate
- Patent number 8,237,260
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Roman Tschirbs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190139906
- Publication date May 9, 2019
- Mitsubishi Electric Corporation
- Yumie KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SEGMENTED BASE PLATE
- Publication number 20100127371
- Publication date May 27, 2010
- INFINEON TECHNOLOGIES AG
- Roman Tschirbs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR