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Antimony [Sb] as principal constituent
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Antimony [Sb] as principal constituent
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Thermocompression bonding with passivated silver-based contacting m...
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12,363,878
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
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Thermocompression bonding with passivated gold contacting metal
Patent number
12,363,877
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
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Thermocompression bonding with passivated tin-based contacting metal
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12,356,553
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Jul 8, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
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Micro light-emitting diode
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12,334,481
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Jun 17, 2025
PlayNitride Display Co., Ltd.
Chi-Heng Chen
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Device and method for UBM/RDL routing
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12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
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Devices with conductive or magnetic nanowires for localized heating...
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12,300,591
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May 13, 2025
Regents of The University of Minnesota
Bethanie J Stadler
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Semiconductor packages and methods of forming same
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12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
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Semiconductor package and method of manufacturing the semiconductor...
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12,272,665
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Apr 8, 2025
Samsung Electronics Co., Ltd.
Yongho Kim
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Thermocompression bonding using metastable gas atoms
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12,245,379
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Thermocompression bonding with passivated copper-based contacting m...
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12,245,380
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Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
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Thermocompression bonding with passivated nickel-based contacting m...
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12,245,381
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Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
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Chip package structure having molding layer
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12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
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Superconducting bump bonds for quantum computing systems
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12,218,091
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Feb 4, 2025
Google LLC
Zhimin Jamie Yao
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Microwave integrated quantum circuits with cap wafers and their met...
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12,207,569
Issue date
Jan 21, 2025
Rigetti & Co, LLC
Jayss Daniel Marshall
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Low cost package warpage solution
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12,183,596
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Dec 31, 2024
Intel Corporation
Omkar G. Karhade
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Wafer level dicing method and semiconductor device
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12,176,248
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
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Single-shot encapsulation
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12,166,001
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Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
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Bonding structures and methods for forming the same
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12,148,725
Issue date
Nov 19, 2024
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han Chuang
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Etched trenches in bond materials for die singulation, and associat...
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12,132,155
Issue date
Oct 29, 2024
Micron Technology, Inc.
Vladimir Odnoblyudov
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Display device and method for fabricating the same
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12,125,838
Issue date
Oct 22, 2024
Samsung Display Co., Ltd.
Seung Geun Lee
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Semiconductor bonding structures and methods
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12,119,238
Issue date
Oct 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
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Semiconductor structure and method for preparing same
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12,100,680
Issue date
Sep 24, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Luguang Wang
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Semiconductor device with encapsulant deposited along sides and sur...
Patent number
12,094,729
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Sep 17, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
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Supporting backplane, manufacturing method therefor and backplane
Patent number
12,087,892
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Sep 10, 2024
BOE Technology Group Co., Ltd.
Zhiwei Liang
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Semiconductor device and method to minimize stress on stack via
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12,080,600
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Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for manufacturing semiconductor device
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12,057,362
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Aug 6, 2024
Rohm Co., Ltd.
Osamu Miyata
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Semiconductor package and method of fabricating the same
Patent number
12,057,359
Issue date
Aug 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Cheng Lin
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Package structure and manufacturing method thereof
Patent number
12,051,639
Issue date
Jul 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
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Substrate debonding from bonded part
Patent number
12,040,311
Issue date
Jul 16, 2024
The Boeing Company
Peter D. Brewer
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Semiconductor structure and method for manufacturing semiconductor...
Patent number
12,040,296
Issue date
Jul 16, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Luguang Wang
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250239561
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250233083
Publication date
Jul 17, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Young Do KWEON
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method of Making a Molded IPD-CoW
Publication number
20250226334
Publication date
Jul 10, 2025
STATS ChipPAC Pte Ltd.
Kai Chong Chan
H01 - BASIC ELECTRIC ELEMENTS
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CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250226344
Publication date
Jul 10, 2025
MK ELECTRON CO., LTD.
Jae Yeol SON
H01 - BASIC ELECTRIC ELEMENTS
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LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
Publication number
20250218998
Publication date
Jul 3, 2025
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
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CORE-SHELL BALL GRID ARRAY MATERIALS FOR LARGE FORM FACTOR INTEGRAT...
Publication number
20250218992
Publication date
Jul 3, 2025
Intel Corporation
Rui Zhang
H01 - BASIC ELECTRIC ELEMENTS
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STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
Publication number
20250210610
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
Publication number
20250201652
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
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STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
Publication number
20250201668
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching Wang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE
Publication number
20250183205
Publication date
Jun 5, 2025
WIN SEMICONDUCTORS CORP.
Shao-Yu TU
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
Publication number
20250174495
Publication date
May 29, 2025
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Sheng HU
H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
Publication number
20250167158
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
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OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
Publication number
20250164709
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa CHEN
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
Publication number
20250167092
Publication date
May 22, 2025
Advanced Semiconductor Engineering, Inc.
Yung-Li LU
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
Publication number
20250157956
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
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Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
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LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20250096009
Publication date
Mar 20, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20250087543
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
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CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
Publication number
20250087612
Publication date
Mar 13, 2025
Samsung Electronics Co., Ltd.
JUNHYUN AN
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ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250087549
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Mar 13, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Yu Jin JEON
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
Publication number
20250079373
Publication date
Mar 6, 2025
Samsung Electronics Co., Ltd.
Chaein Moon
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Publication number
20250079374
Publication date
Mar 6, 2025
Fujitsu Limited
Shinya SASAKI
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250079402
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND SEMICON...
Publication number
20250070068
Publication date
Feb 27, 2025
WINBOND ELECTRONICS CORP.
Po-Chun SHAO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20250069954
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
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Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250054885
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsing-Hsiang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
Publication number
20250056937
Publication date
Feb 13, 2025
Micron Technology, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS