Antimony [Sb] as principal constituent

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H01L2224/0572

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0572Antimony [Sb] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip structure and method of forming same
- Patent number 10,971,371
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip structure and method of forming same
- Patent number 10,665,468
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip structure and method of forming same
- Patent number 10,037,892
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip structure and method of forming same
- Patent number 9,653,433
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip structure and method of forming same
- Patent number 9,324,698
- Issue date Apr 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20230260938
- Publication date Aug 17, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20220052001
- Publication date Feb 17, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Structure and Method of Forming Same
- Publication number 20200286741
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Structure and Method of Forming Same
- Publication number 20190006187
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS