Antimony (Sb) as principal constituent

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H01L2224/4862

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4862Antimony (Sb) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Rohm Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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- Issue date Jun 1, 2021
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second chips and connections th...
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- Issue date Feb 12, 2019
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
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Information Patent Grant
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Information Patent Grant
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
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- Issue date Dec 18, 2018
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- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
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- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate, method for fabricating the same, and package dev...
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- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
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- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
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- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate, method for fabricating the same, and package dev...
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- Issue date May 1, 2018
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
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- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
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Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
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- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
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- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of reinforcing a conductor soldering point of...
- Patent number 9,837,371
- Issue date Dec 5, 2017
- TONGFU MICROELECTRONICS CO., L,TD.
- Haizhong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,824,944
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
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- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,793,265
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
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- Publication number 20230253352
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
- Publication number 20220052003
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- ROHM CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
- Publication number 20200343208
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- ROHM CO., LTD.
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
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- RENESAS ELECTRONICS CORPORATION
- Ryo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
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IMAGING APPARATUS AND METHOD OF MANUFACTURING IMAGING APPARATUS
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- Sony Semiconductor Solutions Corporation
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- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
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- RENESAS ELECTRONICS CORPORATION
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- G01 - MEASURING TESTING
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
- Publication number 20190019771
- Publication date Jan 17, 2019
- ROHM CO., LTD.
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PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20180211909
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- Samsung Electronics Co., Ltd.
- Soojae PARK
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Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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- RENESAS ELECTRONICS CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
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- RENESAS ELECTRONICS CORPORATION
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
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STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF...
- Publication number 20170207189
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- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Haizhong SHI
- H01 - BASIC ELECTRIC ELEMENTS
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- Samsung Electronics Co., Ltd.
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- Publication date Jan 19, 2017
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- H01 - BASIC ELECTRIC ELEMENTS
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- H01 - BASIC ELECTRIC ELEMENTS
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- LSI Corporation
- John M. DeLucca
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STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
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- Yen-Shih HO
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- H01 - BASIC ELECTRIC ELEMENTS

Antimony (Sb) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and fabrication method of the semiconductor de...

Semiconductor device and fabrication method of the semiconductor de...

Semiconductor device

Semiconductor device and fabrication method of the semiconductor de...

Semiconductor device and method of manufacturing thereof

Semiconductor integrated circuit device

Semiconductor device and fabrication method of the semiconductor de...

Semiconductor device for preventing crack in pad region and fabrica...

Method of manufacturing semiconductor device

Package-on-package (PoP) structure including stud bulbs

Semiconductor device with first and second chips and connections th...

Plastic-packaged semiconductor device having wires with polymerized...

Semiconductor device

Semiconductor device

Semiconductor device

Package-on-package (PoP) structure including stud bulbs

Manufacturing method of semiconductor device

Package substrate, method for fabricating the same, and package dev...

Semiconductor component support and semiconductor device

Semiconductor device having a protective material with a first pH f...

Bonding wire for high-speed signal line

Aluminum coated copper bond wire and method of making the same

Package substrate, method for fabricating the same, and package dev...

Sintered conductive matrix material on wire bond

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor device and method of forming vertical interconnect st...

Structure and method of reinforcing a conductor soldering point of...

Semiconductor device

Package on-package (PoP) structure including stud bulbs

Semiconductor device including Schottky barrier diode and power MOS...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

IMAGING APPARATUS AND METHOD OF MANUFACTURING IMAGING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Package-On-Package (PoP) Structure Including Stud Bulbs

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

METHOD FOR PROTECTING BOND PADS FROM CORROSION

STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTIO...

LEADFRAME WITH LEAD OF VARYING THICKNESS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MOISTURE BARRIER FOR A WIRE BOND

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME