Apparatus chuck

Industry

CPC
H01L2224/78981

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78981Apparatus chuck

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 10,340,163
- Issue date Jul 2, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 9,070,762
- Issue date Jun 30, 2015
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 8,752,751
- Issue date Jun 17, 2014
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS
- Publication number 20170309503
- Publication date Oct 26, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140217152
- Publication date Aug 7, 2014
- ASM Technology Singapore Pte Ltd
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140014708
- Publication date Jan 16, 2014
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Apparatus chuck

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with rotating bonding stage

Bonding apparatus with rotating bonding stage

Ultrasonic vibration bonding apparatus

Mounting apparatus

Lead frame support plate and window clamp for wire bonding machines

Lead frame support plate and window clamp for wire bonding machines

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

ULTRASONIC VIBRATION BONDING APPARATUS

MOUNTING APPARATUS

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES