Apparatus for connecting with bump connectors or layer connectors

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H01L2224/75

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75Apparatus for connecting with bump connectors or layer connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for exhaust gas purification device
- Patent number 12,121,858
- Issue date Oct 22, 2024
- Cataler Corporation
- Yuki Kido
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Particle capture using transfer stamp
- Patent number 12,094,851
- Issue date Sep 17, 2024
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding systems, and methods of providing a reducing gas on a bondi...
- Patent number 12,062,636
- Issue date Aug 13, 2024
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering electronic component and method for manufactur...
- Patent number 12,051,887
- Issue date Jul 30, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 12,027,486
- Issue date Jul 2, 2024
- L TRIN.CO., LTD
- Yong Won Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component and method for producing a component
- Patent number 12,027,503
- Issue date Jul 2, 2024
- OSRAM OLED GmbH
- Alexander F. Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer tool and method for transferring semiconductor chips
- Patent number 12,020,973
- Issue date Jun 25, 2024
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP BONDING DEVICE
- Publication number 20240404985
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- BONGKEN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
- Publication number 20240371664
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...
- Publication number 20240363580
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
- Publication number 20240332245
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Dae Seo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...
- Publication number 20240332244
- Publication date Oct 3, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240266318
- Publication date Aug 8, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240234362
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with bump connectors or layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Solder reflow apparatus and method of manufacturing an electronic d...

Mounting device and mounting method

Bonding of bridge to multiple semiconductor chips

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Carrier for microelectronic assemblies having direct bonding

Bonding apparatus and bonding method

Manufacturing method for exhaust gas purification device

Method of chip transferring and device/module having gas guiding st...

Apparatus for stacking substrates and method for the same

Hybrid nanosilver/liquid metal ink composition and uses thereof

Particle capture using transfer stamp

Methods and systems for manufacturing semiconductor devices

Selective transfer of micro devices

Chip bonding apparatus and securing assembly therefor

Die bonding apparatus and manufacturing method for semiconductor de...

Bonding systems, and methods of providing a reducing gas on a bondi...

Method for soldering electronic component and method for manufactur...

Bonding head for mounting components and die bonder with such a bon...

Pressure sintering device and method for manufacturing an electroni...

Substrate bonding apparatus

Component and method for producing a component

Semiconductor substrate alignment device and a semiconductor substr...

Transfer tool and method for transferring semiconductor chips

System and method for connecting electronic assemblies

Substrate bonding apparatus and method of manufacturing a semicondu...

Apparatus and method for semiconductor device bonding

Semiconductor manufacturing apparatus

LED with internally confined current injection area

Patents Applicationslast 30 patents

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SEMICONDUCTOR CHIP BONDING DEVICE

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

System and Method for Bonding Semiconductor Devices

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP TRANSFERRING AND BONDING DEVICE

BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP

BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHODS OF PROCESSING A SUBSTRATE ON A BONDING SYSTEM, AND RELATED...

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

CIRCUIT BOARD AND MANUFACTURING METHOD

SEMICONDUCTOR MANUFACTURING EQUIPMENT

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...