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Apparatus for connecting with bump connectors or layer connectors
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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75
Apparatus for connecting with bump connectors or layer connectors
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last 30 patents
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Methods of operating die attach systems
Patent number
12,288,711
Issue date
Apr 29, 2025
Assembleon B.V.
Alain De Bock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement for forming a connection
Patent number
12,272,669
Issue date
Apr 8, 2025
Infineon Technologies AG
Arthur Unrau
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding system and bonding method
Patent number
12,261,147
Issue date
Mar 25, 2025
BONDTECH CO., LTD.
Akira Yamauchi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Component mounting system and component mounting method
Patent number
12,261,070
Issue date
Mar 25, 2025
BONDTECH CO., LTD.
Akira Yamauchi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Apparatuses for handling microelectronic devices
Patent number
12,251,841
Issue date
Mar 18, 2025
Micron Technology, Inc.
Kuan Wei Tseng
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
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Patent Grant
Apparatus and method for BGA coplanarity and warpage control
Patent number
12,249,589
Issue date
Mar 11, 2025
NVIDIA Corporation
Dongji Xie
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
Patent number
12,237,297
Issue date
Feb 25, 2025
Samsung Electronics Co., Ltd.
Junga Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip laser bonding system
Patent number
12,237,295
Issue date
Feb 25, 2025
PROTEC CO., LTD.
Geunsik Ahn
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
System for laser bonding of flip chip
Patent number
12,237,296
Issue date
Feb 25, 2025
PROTEC CO., LTD.
Youn Sung Ko
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device having through parts of different shapes
Patent number
12,230,600
Issue date
Feb 18, 2025
Fuji Electric Co., Ltd.
Narumi Sato
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for actuating a bonding head
Patent number
12,230,599
Issue date
Feb 18, 2025
BESI Switzerland AG
Markus Aebischer
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Hot-pressing member with improved focus of pressing and longevity a...
Patent number
12,220,891
Issue date
Feb 11, 2025
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Fei-Fan Yu
B30 - PRESSES
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Patent Grant
Method for transferring electronic device
Patent number
12,224,263
Issue date
Feb 11, 2025
MICRAFT SYSTEM PLUS CO., LTD.
Yu-Min Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
12,211,818
Issue date
Jan 28, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
12,199,058
Issue date
Jan 14, 2025
VueReal Inc.
Gholamreza Chaji
G01 - MEASURING TESTING
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Patent Grant
Mounting apparatus
Patent number
12,191,276
Issue date
Jan 7, 2025
Shinkawa Ltd.
Alexander Dzhangirov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Reflow method and system
Patent number
12,176,319
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Shiuan Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal compression bonder nozzle with vacuum relief features
Patent number
12,176,318
Issue date
Dec 24, 2024
Intel Corporation
Mihir Oka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device manufacturing device and manufacturing method
Patent number
12,176,317
Issue date
Dec 24, 2024
Shinkawa Ltd.
Kohei Seyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
12,159,856
Issue date
Dec 3, 2024
Kioxia Corporation
Satoshi Tsukiyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
Patent number
12,154,882
Issue date
Nov 26, 2024
Samsung Electronics Co., Ltd.
Youngja Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting device and mounting method
Patent number
12,154,811
Issue date
Nov 26, 2024
Toray Engineering Co., Ltd.
Yasushi Tamura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonding of bridge to multiple semiconductor chips
Patent number
12,142,603
Issue date
Nov 12, 2024
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Tools and systems for processing semiconductor devices, and methods...
Patent number
12,142,594
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company
Kuei-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Warpage control in the packaging of integrated circuits
Patent number
12,144,065
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Da Cheng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Carrier for microelectronic assemblies having direct bonding
Patent number
12,142,510
Issue date
Nov 12, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonding apparatus and bonding method
Patent number
12,136,604
Issue date
Nov 5, 2024
Shinkawa Ltd.
Hideharu Nihei
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Manufacturing method for exhaust gas purification device
Patent number
12,121,858
Issue date
Oct 22, 2024
Cataler Corporation
Yuki Kido
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of chip transferring and device/module having gas guiding st...
Patent number
12,106,981
Issue date
Oct 1, 2024
MICRAFT SYSTEM PLUS CO., LTD.
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for stacking substrates and method for the same
Patent number
12,100,667
Issue date
Sep 24, 2024
Nikon Corporation
Isao Sugaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMIN...
Publication number
20250132284
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Amram EITAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
Publication number
20250118701
Publication date
Apr 10, 2025
SHINKAWA LTD.
Shinsuke Fukumoto
G05 - CONTROLLING REGULATING
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Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
Publication number
20250112201
Publication date
Apr 3, 2025
KULICKE AND SOFFA INDUSTRIES, INC.
Andreas Marte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...
Publication number
20250105203
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Kyung Deuk MIN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL
Publication number
20250096189
Publication date
Mar 20, 2025
TEXAS INSTRUMENTS INCORPORATED
Chen Chao
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Publication number
20250087625
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Young WANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...
Publication number
20250087626
Publication date
Mar 13, 2025
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
Publication number
20250065400
Publication date
Feb 27, 2025
SEMIKRON ELEKTRONIK GMBH & CO. KG
DOMINIC BIRKICHT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
REFLOW METHOD AND SYSTEM
Publication number
20250070077
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
Publication number
20250046750
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
Publication number
20250038030
Publication date
Jan 30, 2025
CANON KABUSIKI KAISHA
Byung-Jin CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20250033132
Publication date
Jan 30, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING DEVICE AND ITS OPERATING METHOD
Publication number
20250038147
Publication date
Jan 30, 2025
SAMSUNG DISPLAY CO., LTD.
Jong Hyup KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...
Publication number
20250022836
Publication date
Jan 16, 2025
Stroke Precision Advanced Engineering Co., Ltd.
Chingju Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20250015030
Publication date
Jan 9, 2025
VueReal Inc.
Gholamreza CHAJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING DEVICE AND BONDING METHOD
Publication number
20250015039
Publication date
Jan 9, 2025
TORAY ENGINEERING CO., LTD.
Tatsuya OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
Publication number
20250006690
Publication date
Jan 2, 2025
Taiwan Semiconductor Manufacturing Company Limited
Amram Eitan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
Publication number
20240421118
Publication date
Dec 19, 2024
MB Automation GmbH & Co. KG
Benjamin Holzner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
Publication number
20240413093
Publication date
Dec 12, 2024
Nikon Corporation
Isao Sugaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP BONDING DEVICE
Publication number
20240404985
Publication date
Dec 5, 2024
Samsung Electronics Co., Ltd.
BONGKEN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
Publication number
20240404988
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
Publication number
20240404989
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for Bonding Semiconductor Devices
Publication number
20240395766
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kai-Tai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
Publication number
20240395767
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuei-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20240387446
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
Publication number
20240381531
Publication date
Nov 14, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
Publication number
20240371664
Publication date
Nov 7, 2024
ASTI GLOBAL INC., TAIWAN
CHIEN-SHOU LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...
Publication number
20240363580
Publication date
Oct 31, 2024
KULICKE AND SOFFA INDUSTRIES, INC.
Adeel Ahmad Bajwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20240363579
Publication date
Oct 31, 2024
Samsung Electronics Co., Ltd.
Seungyeop Oh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
Publication number
20240339430
Publication date
Oct 10, 2024
ASMPT SINGAPORE PTE. LTD
Zetao MA
H01 - BASIC ELECTRIC ELEMENTS