Apparatus for connecting with bump connectors or layer connectors

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CPC
H01L24/75

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/75Apparatus for connecting with bump connectors or layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Laser bonding system and laser bonding apparatus
- Patent number 11,973,053
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Geun Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
- Patent number 11,961,818
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhanced microelectronic device handling
- Patent number 11,911,904
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding cavity structure and bonding method
- Patent number 11,916,040
- Issue date Feb 27, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xinyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning flip chip assemblies
- Patent number 11,876,005
- Issue date Jan 16, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux tool using elastic pad
- Patent number 11,850,683
- Issue date Dec 26, 2023
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-transfer printing with selective component removal
- Patent number 11,854,855
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transfer of micro-devices
- Patent number 11,843,025
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,835,207
- Issue date Dec 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
- Patent number 11,837,573
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20240139940
- Publication date May 2, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240136321
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240120311
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- FUTOSHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240113067
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240096846
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20240066618
- Publication date Feb 29, 2024
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INVERTER
- Publication number 20240063084
- Publication date Feb 22, 2024
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240063169
- Publication date Feb 22, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20240063171
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...
- Publication number 20240047280
- Publication date Feb 8, 2024
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Kerui XI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047411
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INERT GAS CHAMBER
- Publication number 20240047412
- Publication date Feb 8, 2024
- MRSI Systems LLC
- Dennis Carew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION
- Publication number 20240038570
- Publication date Feb 1, 2024
- X-CELEPRINT LIMITED
- Ken G. Purchase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with bump connectors or layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus

LED with internally confined current injection area

Laser bonding system and laser bonding apparatus

Lid attach process and dispenser head

Method for transferring electronic device

Apparatus and method for forming a package structure

Substrates with heat transfer structures for bonding a stack of mic...

Device and method of fluidic assembly of microchips on a substrate

Laser reflow apparatus and laser reflow method

Low warpage curing methodology by inducing curvature

Die bonding for chip conveying apparatus

Apparatus and methods for enhanced microelectronic device handling

Bonding cavity structure and bonding method

Manufacturing method of power semiconductor device, power semicondu...

Laned belt for cleaner

Methods and apparatus for cleaning flip chip assemblies

Bonding apparatus and bonding method

Flux tool using elastic pad

Micro-transfer printing with selective component removal

Method of using processing oven

Mounting apparatus and film supply apparatus

Method of manufacturing a semiconductor package

Semiconductor device with a semiconductor chip connected in a flip...

Electronic device

Methods for transfer of micro-devices

Inverter

Mounting device

Bonding apparatus and bonding method

Chip bonding apparatus and method of manufacturing semiconductor de...

Semiconductor manufacturing apparatus, and method of manufacturing...

Patents Applicationslast 30 patents

LASING TO ATTACH DIE TO LEAD FRAME

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES

SEMICONDUCTOR MANUFACTURING EQUIPMENT

CIRCUIT BOARD AND MANUFACTURING METHOD

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

SOLDER REFLOW APPARATUS

BONDING APPARATUS

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

SOLDER REFLOW APPARATUS

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

BONDING APPARATUS AND BONDING METHOD

SOLDER BALL ATTACHING APPARATUS

ELECTRONIC DEVICE

METHOD OF USING PROCESSING OVEN

INVERTER

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

MOUNTING HEAD

ASSEMBLY OF A CHIP TO A SUBSTRATE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

INERT GAS CHAMBER

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

BONDING APPARATUS