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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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H01L24/799
Apparatus for disconnecting
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Patents Grants
last 30 patents
Information
Patent Grant
Emissive element harvest
Patent number
11,929,356
Issue date
Mar 12, 2024
eLux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for the characterization of emissive elements
Patent number
11,855,051
Issue date
Dec 26, 2023
eLux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
Patent number
11,791,305
Issue date
Oct 17, 2023
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
11,745,281
Issue date
Sep 5, 2023
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
Patent number
11,699,676
Issue date
Jul 11, 2023
LASERSSEL CO., LTD.
Jae-Joon Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fully automated wafer debonding system and method thereof
Patent number
11,670,524
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus
Patent number
11,658,147
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Ilhyoung Koo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatuses for removal of wires from packaging substrates
Patent number
11,616,045
Issue date
Mar 28, 2023
Skyworks Solutions, Inc.
Cesar Melendrez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate debonding apparatus
Patent number
11,581,202
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Ilyoung Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer printing method and transfer printing apparatus
Patent number
11,538,786
Issue date
Dec 27, 2022
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
Xinglong Luan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for reworking flip chip components
Patent number
11,330,746
Issue date
May 10, 2022
Raytheon Company
James A. Robbins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond cleaning method and wire bonding recovery process
Patent number
11,302,669
Issue date
Apr 12, 2022
Skyworks Solutions, Inc.
Aldrin Quinones Garing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
Patent number
11,222,862
Issue date
Jan 11, 2022
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of separating bonded substrate, method of manufacturing semi...
Patent number
11,152,329
Issue date
Oct 19, 2021
TOSHIBA MEMORY CORPORATION
Eiichi Soda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
11,020,811
Issue date
Jun 1, 2021
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pick-and-remove system with deformable contact surface
Patent number
10,985,302
Issue date
Apr 20, 2021
eLux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gallium liquid metal embrittlement for device rework
Patent number
10,679,966
Issue date
Jun 9, 2020
International Business Machines Corporation
David Danovitch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Removal apparatuses for semiconductor chips
Patent number
10,629,564
Issue date
Apr 21, 2020
Samsung Electronics Co., Ltd.
JaeYong Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate separation system and method
Patent number
10,622,332
Issue date
Apr 14, 2020
Princo Corp.
Chun-Hsiung Chou
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Gallium liquid metal embrittlement for device rework
Patent number
10,559,549
Issue date
Feb 11, 2020
International Business Machines Corporation
David Danovitch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Decoupling systems
Patent number
10,529,600
Issue date
Jan 7, 2020
Intel Corporation
Bassam M. Ziadeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for severing a microchip from a wafer and arrangi...
Patent number
10,497,589
Issue date
Dec 3, 2019
Jenoptik Optical Systems GmbH
Meik Panitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for repairing semiconductor chips
Patent number
10,497,584
Issue date
Dec 3, 2019
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
Patent number
10,490,525
Issue date
Nov 26, 2019
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pick-and remove system and method for emissive display repair
Patent number
10,446,728
Issue date
Oct 15, 2019
eLux, Inc.
Kenji Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer printed device repair
Patent number
10,438,859
Issue date
Oct 8, 2019
X-CELEPRINT LIMITED
Ronald S. Cok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiresaw removal of microelectronics from printed circuit board
Patent number
10,403,595
Issue date
Sep 3, 2019
United States of America, as represented by the Secretary of the Navy
Joel T. Harrison
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
10,307,850
Issue date
Jun 4, 2019
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Rework process and tool design for semiconductor package
Patent number
10,269,762
Issue date
Apr 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih Ting Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser assisted transfer welding process
Patent number
10,181,483
Issue date
Jan 15, 2019
Etienne Menard
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
Publication number
20240071992
Publication date
Feb 29, 2024
PlayNitride Display Co., Ltd.
Yen-Mu Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
Publication number
20230378127
Publication date
Nov 23, 2023
Skyworks Solutions, Inc.
Cesar MELENDREZ MURILLO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20230282494
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Removal Head, Chip Removal System and Chip Removal Method
Publication number
20230053040
Publication date
Feb 16, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Bin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...
Publication number
20220406748
Publication date
Dec 22, 2022
LG ELECTRONICS INC.
Juchan CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
Publication number
20220336413
Publication date
Oct 20, 2022
Skyworks Solutions, Inc.
Aldrin Quinones GARING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
Publication number
20220310551
Publication date
Sep 29, 2022
Samsung Electronics Co., Ltd.
ILHYOUNG KOO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
Publication number
20220262764
Publication date
Aug 18, 2022
KIOXIA Corporation
Sho KAWADAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
Publication number
20220189908
Publication date
Jun 16, 2022
NCC NANO, LLC
VAHID AKHAVAN ATTAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE DEBONDING APPARATUS
Publication number
20210358778
Publication date
Nov 18, 2021
Samsung Electronics Co., Ltd.
Ilyoung HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Method for Detaching a Die from an Adhesive Film
Publication number
20210265302
Publication date
Aug 26, 2021
BESI Switzerland AG
Andreas Mayr
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
Publication number
20210252621
Publication date
Aug 19, 2021
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20210242043
Publication date
Aug 5, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ARRAY DEVICE
Publication number
20210005520
Publication date
Jan 7, 2021
Sharp Kabushiki Kaisha
TOSHIYA ISHIO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF SEPARATING BONDED SUBSTRATE, METHOD OF MANUFACTURING SEMI...
Publication number
20200294963
Publication date
Sep 17, 2020
Toshiba Memory Corporation
Eiichi Soda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF
Publication number
20200251442
Publication date
Aug 6, 2020
LASERSSEL CO., LTD.
Jae-Joon CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE SEPARATION SYSTEM AND METHOD
Publication number
20200105716
Publication date
Apr 2, 2020
PRINCO CORP.
CHUN-HSIUNG CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
Publication number
20200105717
Publication date
Apr 2, 2020
SKYWORKS SOLUTIONS, INC.
Cesar MELENDREZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
Publication number
20200051948
Publication date
Feb 13, 2020
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
Publication number
20190348392
Publication date
Nov 14, 2019
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
Publication number
20190247943
Publication date
Aug 15, 2019
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND DEVICE FOR REPAIRING SEMICONDUCTOR CHIPS
Publication number
20190181016
Publication date
Jun 13, 2019
ASTI GLOBAL INC., TAIWAN
CHIEN-SHOU LIAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
Publication number
20190061034
Publication date
Feb 28, 2019
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DECOUPLING SYSTEMS AND METHODS FOR SAME
Publication number
20180286832
Publication date
Oct 4, 2018
Intel Corporation
Bassam M. Ziadeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
Publication number
20180233482
Publication date
Aug 16, 2018
International Business Machines Corporation
David Danovitch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
Publication number
20180233483
Publication date
Aug 16, 2018
International Business Machines Corporation
David Danovitch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TRANSFER PRINTED DEVICE REPAIR
Publication number
20180174932
Publication date
Jun 21, 2018
X-Celeprint Limited
Ronald S. Cok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...
Publication number
20170352640
Publication date
Dec 7, 2017
Samsung Electronics Co., Ltd.
JaeYong PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
Publication number
20170179066
Publication date
Jun 22, 2017
Russell S. Aoki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DIE REMOVAL REWORK
Publication number
20170148762
Publication date
May 25, 2017
International Business Machine Corporation
Stephen P. Ayotte
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR