Apparatus for manufacturing layer connectors

Industry

CPC
H01L2224/743

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/743Apparatus for manufacturing layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 9,673,165
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating crystal unit, crystal unit fabrication mask,...
- Patent number 9,287,843
- Issue date Mar 15, 2016
- Fujitsu Limited
- Hajime Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tape adhering device and tape adhering method
- Patent number 9,254,635
- Issue date Feb 9, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shingo Yamada
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,006,036
- Issue date Apr 14, 2015
- Renesas Electronics Corporation
- Tomoko Higashino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tape attaching device and tape attaching method
- Patent number 8,951,379
- Issue date Feb 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shingo Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sealed semiconductor device having adhesive patch with inwardly slo...
- Patent number 8,941,226
- Issue date Jan 27, 2015
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips having double adhesive insulating layer...
- Patent number 8,841,776
- Issue date Sep 23, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,841,772
- Issue date Sep 23, 2014
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Equipment and method for manufacturing semiconductor device
- Patent number 8,807,068
- Issue date Aug 19, 2014
- Kabushiki Kaisha Toshiba
- Tsutomu Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 8,756,800
- Issue date Jun 24, 2014
- Panasonic Corporation
- Tsutomu Hiraki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Assembly jig for a semiconductor device and assembly method for a s...
- Patent number 8,759,158
- Issue date Jun 24, 2014
- Fuji Electric Co. Ltd.
- Hideaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating crystal unit, crystal unit fabrication mask,...
- Patent number 8,710,710
- Issue date Apr 29, 2014
- Fujitsu Limited
- Hajime Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and a method of manufacturing the same and a m...
- Patent number 8,637,965
- Issue date Jan 28, 2014
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly jig for a semiconductor device and assembly method for a s...
- Patent number 8,622,276
- Issue date Jan 7, 2014
- Fuji Electric Co., Ltd.
- Hideaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,574,963
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape applying device, tape holding unit, and tape applying method
- Patent number 8,545,664
- Issue date Oct 1, 2013
- Panasonic Corporation
- Kozo Odawara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 8,530,278
- Issue date Sep 10, 2013
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,513,088
- Issue date Aug 20, 2013
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
- Patent number 8,513,060
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wiring assembly, semiconductor composite wiring assem...
- Patent number 8,471,371
- Issue date Jun 25, 2013
- Dai Nippon Printing Co., Ltd.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer apparatus for multiple adhesives
- Patent number 8,397,785
- Issue date Mar 19, 2013
- ASM Assembly Automation LTD
- Keung Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power package including multiple semiconductor devices
- Patent number 8,399,997
- Issue date Mar 19, 2013
- Shanghai Kalhong Electronic Company Limited
- Jiangyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,390,117
- Issue date Mar 5, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor light emitting device, semiconductor element, and met...
- Patent number 8,357,950
- Issue date Jan 22, 2013
- Sharp Kabushiki Kaisha
- Masahiro Ikehara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240282611
- Publication date Aug 22, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...
- Publication number 20240153907
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
- Publication number 20180061673
- Publication date Mar 1, 2018
- Intel Corporation
- JOSHUA D. HEPPNER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CRYSTAL UNIT, CRYSTAL UNIT FABRICATION MASK,...
- Publication number 20140158292
- Publication date Jun 12, 2014
- Fujitsu Limited
- Hajime Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20140091131
- Publication date Apr 3, 2014
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140080260
- Publication date Mar 20, 2014
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT MANUFACTURING SYSTEM AND MANUFACTURING METHO...
- Publication number 20130288404
- Publication date Oct 31, 2013
- PANASONIC CORPORATION
- Masaru Nonomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE ADHERING DEVICE AND TAPE ADHERING METHOD
- Publication number 20130269870
- Publication date Oct 17, 2013
- PANASONIC CORPORATION
- Shingo Yamada
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20130161823
- Publication date Jun 27, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20130119113
- Publication date May 16, 2013
- ASM Assembly Automation Ltd
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE ATTACHING DEVICE AND TAPE ATTACHING METHOD
- Publication number 20130075012
- Publication date Mar 28, 2013
- PANASONIC CORPORATION
- Shingo Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...
- Publication number 20130040426
- Publication date Feb 14, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROAKI NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE APPLYING DEVICE, TAPE HOLDING UNIT, AND TAPE APPLYING METHOD
- Publication number 20120318445
- Publication date Dec 20, 2012
- Kozo Odawara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...
- Publication number 20120318431
- Publication date Dec 20, 2012
- Kabushiki Kaisha Toshiba
- Yukio KATAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Package Including Multiple Semiconductor Devices
- Publication number 20120313232
- Publication date Dec 13, 2012
- SHANGHAI KAIHONG ELECTRONIC COMPANY LIMITED
- Jiangyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120276663
- Publication date Nov 1, 2012
- Kabushiki Kaisha Toshiba
- Tsutomu MIYAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20120202322
- Publication date Aug 9, 2012
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120199993
- Publication date Aug 9, 2012
- Kabushiki Kaisha Toshiba
- Atsushi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120168954
- Publication date Jul 5, 2012
- Stanley Electric Co., Ltd
- Toshihiro SEKO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A M...
- Publication number 20120146228
- Publication date Jun 14, 2012
- HITACHI YONEZAWA ELECTRONICS CO., LTD.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating crystal unit, crystal unit fabrication mask,...
- Publication number 20120062072
- Publication date Mar 15, 2012
- FUJITSU LIMITED
- Hajime Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120052628
- Publication date Mar 1, 2012
- RENESAS ELECTRONICS CORPORATION
- Hiroshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film and display device using the same

Electroconductive film, roll, connected structure, and process for...

Method for producing a connecting medium on an assembly partner, me...

Anisotropic conductive film and display device using the same

Method for coating conductive substrate with adhesive

Method and apparatus for assembling a component with a flexible foi...

Component mounting apparatus

Method of fabricating crystal unit, crystal unit fabrication mask,...

Tape adhering device and tape adhering method

Method of manufacturing semiconductor device

Tape attaching device and tape attaching method

Sealed semiconductor device having adhesive patch with inwardly slo...

Stacked semiconductor chips having double adhesive insulating layer...

Semiconductor device and method of manufacturing the same

Equipment and method for manufacturing semiconductor device

Electronic component mounting method

Assembly jig for a semiconductor device and assembly method for a s...

Method of fabricating crystal unit, crystal unit fabrication mask,...

Semiconductor device and a method of manufacturing the same and a m...

Assembly jig for a semiconductor device and assembly method for a s...

Method of manufacturing semiconductor device

Tape applying device, tape holding unit, and tape applying method

Semiconductor device and a manufacturing method of the same

Semiconductor device and method for manufacturing the same

Manufacturing method using multi-step adhesive curing for sealed se...

Semiconductor wiring assembly, semiconductor composite wiring assem...

Transfer apparatus for multiple adhesives

Power package including multiple semiconductor devices

Semiconductor device and method of manufacturing the same

Semiconductor light emitting device, semiconductor element, and met...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...

FERROMAGNETIC CONTROL OF WAFER BONDING

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

Method for Producing a Connecting Medium on an Assembly Partner, Me...

METHOD OF FABRICATING CRYSTAL UNIT, CRYSTAL UNIT FABRICATION MASK,...

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

LIGHT EMITTING ELEMENT MANUFACTURING SYSTEM AND MANUFACTURING METHO...

TAPE ADHERING DEVICE AND TAPE ADHERING METHOD

Semiconductor Device and Method of Manufacturing the Same

SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...

TAPE ATTACHING DEVICE AND TAPE ATTACHING METHOD

MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

TAPE APPLYING DEVICE, TAPE HOLDING UNIT, AND TAPE APPLYING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

Power Package Including Multiple Semiconductor Devices

EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE BONDING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A M...

Method of fabricating crystal unit, crystal unit fabrication mask,...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE