Apparatus for manufacturing means for bonding

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CPC
H01L2224/741

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/741Apparatus for manufacturing means for bonding

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Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,289,841
- Issue date Mar 22, 2016
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Misalignment correction for embedded microelectronic die applications
- Patent number 9,266,723
- Issue date Feb 23, 2016
- Intel Corporation
- Grant A. Crawford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor apparatus
- Patent number 8,492,256
- Issue date Jul 23, 2013
- Fuji Electric Co., Ltd.
- Yuichi Urano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Misalignment correction for embedded microelectronic die applications
- Patent number 8,372,666
- Issue date Feb 12, 2013
- Intel Corporation
- Grant A. Crawford
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...
- Publication number 20140212678
- Publication date Jul 31, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS
- Publication number 20130119046
- Publication date May 16, 2013
- Grant A. Crawford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS
- Publication number 20120009738
- Publication date Jan 12, 2012
- Grant A. Crawford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20110256668
- Publication date Oct 20, 2011
- Fuji Electric Co., Ltd.
- Yuichi URANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20080314742
- Publication date Dec 25, 2008
- NEC Electronics Corporation
- Hiroaki Tachibana
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Apparatus for manufacturing means for bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic devices with semiconductor die attached with sintered me...

Environmental hardened packaged integrated circuit

Electronic devices with semiconductor die coupled to a thermally co...

Soldering device, soldering method, and substrate and electronic co...

Misalignment correction for embedded microelectronic die applications

Method of manufacturing semiconductor apparatus

Misalignment correction for embedded microelectronic die applications

Patents Applicationslast 30 patents

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...

MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS

MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMIC...