Apparatus for manufacturing wire connectors

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CPC
H01L2224/745

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/745Apparatus for manufacturing wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonding wire and manufacturing apparatus t...
- Patent number 11,276,664
- Issue date Mar 15, 2022
- Mun-Sub Song
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire and method for manufacturing same
- Patent number 9,434,027
- Issue date Sep 6, 2016
- NIPPON MICROMETAL CORPORATION
- Ryo Togashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for processing ribbon and wire in ultrasonic bo...
- Patent number 8,651,360
- Issue date Feb 18, 2014
- Orthodyne Electronics Corporation
- Vahid Safavi Ardebili
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for fabricating bonding wires on the basis of mic...
- Patent number 8,561,446
- Issue date Oct 22, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin coated bonding wire, method of manufacturing the same, and se...
- Patent number 5,396,104
- Issue date Mar 7, 1995
- Nippon Steel Corporation
- Masao Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical conductor
- Patent number 4,859,811
- Issue date Aug 22, 1989
- Sumitomo Electric Industries, Ltd.
- Kazuo Sawada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing an electrical conductor
- Patent number 4,815,309
- Issue date Mar 28, 1989
- Sumitomo Electric Industries, Ltd.
- Kazuo Sawada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of wire bonding with applied insulative coating
- Patent number 4,678,114
- Issue date Jul 7, 1987
- Kabushiki Kaisha Toshiba
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing microwire and device for effecting same
- Patent number 4,545,229
- Issue date Oct 8, 1985
- Belorussky Politekhnichesky Institut
- Alexandr V. Stepanenko
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire, semiconductor device having the same, and bonding met...
- Patent number 4,488,674
- Issue date Dec 18, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING BONDING WIRE AND MANUFACTURING APPARATUS T...
- Publication number 20210020598
- Publication date Jan 21, 2021
- Mun-Sub SONG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140329106
- Publication date Nov 6, 2014
- NIPPON MICROMETAL CORPORATION
- Ryo TOGASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROCESSING RIBBON AND WIRE IN ULTRASONIC BO...
- Publication number 20130292456
- Publication date Nov 7, 2013
- Orthodyne Electronics Corporation
- Vahid Safavi Ardebili
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
- Publication number 20130160902
- Publication date Jun 27, 2013
- Jun-Der LEE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE ALLOY BONDING WIRE
- Publication number 20130164169
- Publication date Jun 27, 2013
- Jun-Der Lee
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...
- Publication number 20100107717
- Publication date May 6, 2010
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...
- Publication number 20090044966
- Publication date Feb 19, 2009
- SHOWA SHELL SEKIYU K.K.
- Kenichi Tazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
- Publication number 20070284415
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040217458
- Publication date Nov 4, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040119172
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing bonding wire and manufacturing apparatus t...

Method for forming ball in bonding wire

Metal post bonding using pre-fabricated metal posts

Bonding wire and method for manufacturing same

Method for manufacturing a plurality of metal posts

Systems and methods for processing ribbon and wire in ultrasonic bo...

Method and device for fabricating bonding wires on the basis of mic...

Connecting wire and method for manufacturing same

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Electronic component of a high frequency current suppression type a...

Resin coated bonding wire, method of manufacturing the same, and se...

Electrical conductor

Method of producing an electrical conductor

Method of wire bonding with applied insulative coating

Method for manufacturing microwire and device for effecting same

Bonding wire, semiconductor device having the same, and bonding met...

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

WIRE COATING APPARATUS

METHOD FOR MANUFACTURING BONDING WIRE AND MANUFACTURING APPARATUS T...

METHOD FOR FORMING BALL IN BONDING WIRE

BONDING WIRE AND METHOD FOR MANUFACTURING SAME

Metal Post Bonding Using Pre-Fabricated Metal Posts

Bonded System with Coated Copper Conductor

SYSTEMS AND METHODS FOR PROCESSING RIBBON AND WIRE IN ULTRASONIC BO...

MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE

COMPOSITE ALLOY BONDING WIRE

POLYMER CORE WIRE

METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CON...

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...

Packaged IC using insulated wire

Electronic component of a high frequency current suppression type a...