Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industry

CPC
H01L21/67126

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Molding device with self-blocking feed channel
- Patent number 12,347,701
- Issue date Jul 1, 2025
- Robert Bosch GmbH
- Martin Fleischmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Purge controlling system
- Patent number 12,334,363
- Issue date Jun 17, 2025
- Brillian Network & Automation Integrated System Co., Ltd.
- Chen-Wei Ku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for treating substrate
- Patent number 12,334,370
- Issue date Jun 17, 2025
- Semes Co., Ltd.
- Sangmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 12,334,402
- Issue date Jun 17, 2025
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,322,606
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Shota Umezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill vacuum process
- Patent number 12,315,775
- Issue date May 27, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for drying substrate
- Patent number 12,308,255
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Sangjine Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method
- Patent number 12,300,523
- Issue date May 13, 2025
- Picosun Oy
- Väinö Kilpi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,293,938
- Issue date May 6, 2025
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device package with mold compound seal
- Patent number 12,293,948
- Issue date May 6, 2025
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head for chemical mechanical polishing apparatus comprising...
- Patent number 12,285,839
- Issue date Apr 29, 2025
- Joon Mo Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring system for a sealing apparatus having a substrate treatm...
- Patent number 12,243,758
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Shota Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,243,760
- Issue date Mar 4, 2025
- BEILAB CORP.
- Jihyun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas curtain for semiconductor manufacturing system
- Patent number 12,243,750
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kent Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded product production method, molding die, and resin mold...
- Patent number 12,230,512
- Issue date Feb 18, 2025
- Towa Corporation
- Ryota Nakatsukasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated volume seals and method of forming an isolated volume with...
- Patent number 12,217,982
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Kirankumar Neelasandra Savandaiah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lid separation device for vacuum chamber
- Patent number 12,217,981
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus for processing substrates
- Patent number 12,183,602
- Issue date Dec 31, 2024
- ASM IP Holding B.V.
- Theodorus Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for encapsulating an electronic component
- Patent number 12,119,422
- Issue date Oct 15, 2024
- H. B. Fuller Company
- Peter Remmers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable fluid inlet assembly for a substrate processing apparatu...
- Patent number 12,110,588
- Issue date Oct 8, 2024
- Picosun Oy
- Timo Malinen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing apparatus and wafer transfer method
- Patent number 12,099,309
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for integrated decomposition and scanning of a semiconducti...
- Patent number 12,094,738
- Issue date Sep 17, 2024
- Elemental Scientific, Inc.
- Tyler Yost
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE FILM FORMING METHOD, PROTECTIVE FILM FORMING APPARATUS,...
- Publication number 20250239469
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Takafumi HASHIMOTO
- B08 - CLEANING
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20250233011
- Publication date Jul 17, 2025
- ZEUS CO., LTD.
- Woon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR DISPENSING AN UNDERFILLING MATERIAL
- Publication number 20250210382
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Junhyeung Jo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Overmolding Structures in Glass
- Publication number 20250191938
- Publication date Jun 12, 2025
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM
- Publication number 20250166998
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Lid.
- Kent LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING DEVICE AND RESIN SEALING METHOD
- Publication number 20250167016
- Publication date May 22, 2025
- Apic Yamada Corporation
- Shusaku Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robotic Cover Sealer
- Publication number 20250112060
- Publication date Apr 3, 2025
- MicroCircuit Laboratories, LLC
- Rich Richardson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DECAPSULATING PACKAGED INTEGRATED CIRCUIT
- Publication number 20250112058
- Publication date Apr 3, 2025
- Tung Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING DEVICE AND RESIN SEALING METHOD
- Publication number 20250096015
- Publication date Mar 20, 2025
- Apic Yamada Corporation
- Shusaku Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVEL SEALING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20250096014
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Meng Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHODS AND PACKAGING APPARATUS
- Publication number 20250079191
- Publication date Mar 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Weisong Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
- Publication number 20250050439
- Publication date Feb 13, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct 3D Laser Engraved Gasket For Parts Used In Semiconductor Pro...
- Publication number 20250041973
- Publication date Feb 6, 2025
- Chih-Yang CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SEALING DEVICE
- Publication number 20250038017
- Publication date Jan 30, 2025
- Apic Yamada Corporation
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029868
- Publication date Jan 23, 2025
- EUGENE TECHNOLOGY CO., LTD.
- Doo Yeol RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Molding System and Foreign Object Detection Method
- Publication number 20250029232
- Publication date Jan 23, 2025
- DIODES INCORPORATED
- Desen Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD
- Publication number 20250014920
- Publication date Jan 9, 2025
- Apic Yamada Corporation
- TAKASHI SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...
- Publication number 20240420972
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTITUTE SMOKING CONSUMABLE
- Publication number 20240412990
- Publication date Dec 12, 2024
- NERUDIA LIMITED
- Chris LORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACT...
- Publication number 20240347344
- Publication date Oct 17, 2024
- Canon Kabushiki Kaisha
- SHINICHIRO KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS
- Publication number 20240339343
- Publication date Oct 10, 2024
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240339339
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Shota Umezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...
- Publication number 20240332046
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Kirankumar Neelasandra SAVANDAIAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor process machine and operation method thereof
- Publication number 20240297056
- Publication date Sep 5, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- HAIPENG ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO LEVEL VACUUM WAFER TRANSFER SYSTEM WITH ROBOTS ON EACH LEVEL
- Publication number 20240290644
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYERED 3D PRODUCT
- Publication number 20240290633
- Publication date Aug 29, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240266194
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Molding device with self-blocking feed channel

Purge controlling system

Apparatus and method for treating substrate

Fabrication of thin-film encapsulation layer for light-emitting device

Substrate processing apparatus and substrate processing method

Underfill vacuum process

Molded product for semiconductor strip and method of manufacturing...

Apparatus and method for drying substrate

Substrate processing apparatus and method

Wafer processing apparatus and wafer processing method

Flip chip semiconductor device package with mold compound seal

Carrier head for chemical mechanical polishing apparatus comprising...

Method and device for producing a housing

Semiconductor manufacturing apparatus and method of manufacturing s...

Monitoring system for a sealing apparatus having a substrate treatm...

Substrate processing apparatus

Gas curtain for semiconductor manufacturing system

Resin molded product production method, molding die, and resin mold...

Isolated volume seals and method of forming an isolated volume with...

Lid separation device for vacuum chamber

Manufacturing method of semiconductor package using jig

Batch curing chamber with gas distribution and individual pumping

High pressure wafer processing systems and related methods

Substrate processing apparatus for processing substrates

Semiconductor processing equipment with high temperature resistant...

Semiconductor device packaging warpage control

Systems and methods for encapsulating an electronic component

Adjustable fluid inlet assembly for a substrate processing apparatu...

Wafer processing apparatus and wafer transfer method

Systems for integrated decomposition and scanning of a semiconducti...

Patents Applicationslast 30 patents

PROTECTIVE FILM FORMING METHOD, PROTECTIVE FILM FORMING APPARATUS,...

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

JIG FOR DISPENSING AN UNDERFILLING MATERIAL

Overmolding Structures in Glass

GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM

RESIN SEALING DEVICE AND RESIN SEALING METHOD

Robotic Cover Sealer

METHOD FOR DECAPSULATING PACKAGED INTEGRATED CIRCUIT

RESIN SEALING DEVICE AND RESIN SEALING METHOD

BEVEL SEALING SYSTEM AND METHOD OF USING THE SAME

PACKAGING METHODS AND PACKAGING APPARATUS

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...

Direct 3D Laser Engraved Gasket For Parts Used In Semiconductor Pro...

RESIN SEALING DEVICE

LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS

Semiconductor Molding System and Foreign Object Detection Method

RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...

SUBSTITUTE SMOKING CONSUMABLE

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACT...

SINTERING PRESS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...

Semiconductor process machine and operation method thereof

TWO LEVEL VACUUM WAFER TRANSFER SYSTEM WITH ROBOTS ON EACH LEVEL

METHOD OF MANUFACTURING A LAYERED 3D PRODUCT

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...