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Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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H01L21/67126
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/67126
Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Industries
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Patents Grants
last 30 patents
Information
Patent Grant
Workpiece placement apparatus and processing apparatus
Patent number
11,942,357
Issue date
Mar 26, 2024
Tokyo Electron Limited
Yohei Uchida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrostatically clamped edge ring
Patent number
11,935,776
Issue date
Mar 19, 2024
Lam Research Corporation
Christopher Kimball
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing system having a front opening unified pod (FOUP) load lock
Patent number
11,923,217
Issue date
Mar 5, 2024
Applied Materials, Inc.
Jacob Newman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-function wafer backside pressure control and edge purge
Patent number
11,923,233
Issue date
Mar 5, 2024
Applied Materials, Inc.
Joseph AuBuchon
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
Patent number
11,901,208
Issue date
Feb 13, 2024
LG Electronics Inc.
Inbum Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressurizing device and pressurizing method
Patent number
11,901,199
Issue date
Feb 13, 2024
Nikkiso Co., Ltd.
Takahiro Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate storing container
Patent number
11,887,875
Issue date
Jan 30, 2024
Miraial Co., Ltd.
Yuya Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gas supply member with baffle
Patent number
11,885,021
Issue date
Jan 30, 2024
Applied Materials, Inc.
Kartik Shah
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate processing apparatus and apparatus for manufacturing inte...
Patent number
11,887,868
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Young-hoo Kim
B08 - CLEANING
Information
Patent Grant
System and method for manufacturing a semiconductor package structure
Patent number
11,887,865
Issue date
Jan 30, 2024
Advanced Semiconductor Engineering, Inc.
Chenghan She
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Supercritical processing apparatus
Patent number
11,887,866
Issue date
Jan 30, 2024
Semes Co., Ltd.
Jae Seong Lee
B08 - CLEANING
Information
Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
Patent number
11,876,007
Issue date
Jan 16, 2024
Infineon Technologies AG
Rainer Markus Schaller
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Planarization apparatus, planarization process, and method of manuf...
Patent number
11,869,813
Issue date
Jan 9, 2024
Canon Kabushiki Kaisha
Xiaoming Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Press, actuator set and method for encapsulating electronic compone...
Patent number
11,842,909
Issue date
Dec 12, 2023
Besi Netherlands B.V.
Wilhelmus Gerardus Jozef Gal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planarization apparatus, planarization process, and method of manuf...
Patent number
11,823,963
Issue date
Nov 21, 2023
Canon Kabushiki Kaisha
Xiaoming Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems for integrated decomposition and scanning of a semiconducti...
Patent number
11,804,390
Issue date
Oct 31, 2023
Elemental Scientific, Inc.
Tyler Yost
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical treatment, deposition and/or infiltration apparatus and me...
Patent number
11,802,338
Issue date
Oct 31, 2023
ASM IP Holding B.V.
Robert Huggare
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Resin molding apparatus
Patent number
11,784,069
Issue date
Oct 10, 2023
Apic Yamada Corporation
Masahiko Fujisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging method and packaging device for selectively encapsulating...
Patent number
11,784,063
Issue date
Oct 10, 2023
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
Jie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
Patent number
11,784,076
Issue date
Oct 10, 2023
Applied Materials, Inc.
Masato Ishii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
Patent number
11,776,821
Issue date
Oct 3, 2023
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing apparatus
Patent number
11,756,808
Issue date
Sep 12, 2023
Tokyo Electron Limited
Takehiro Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual actuating tilting slit valve
Patent number
11,749,540
Issue date
Sep 5, 2023
Applied Materials, Inc.
Nir Merry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus for processing substrates
Patent number
11,735,445
Issue date
Aug 22, 2023
ASM IP Holding B.V.
Theodorus Oosterlaken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for treating substrate
Patent number
11,735,437
Issue date
Aug 22, 2023
Semes Co., Ltd.
Boong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing device
Patent number
11,728,188
Issue date
Aug 15, 2023
Kioxia Corporation
Yuji Hashimoto
B08 - CLEANING
Information
Patent Grant
System for thinning substrate
Patent number
11,728,190
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate support unit and substrate treating apparatus having the...
Patent number
11,721,575
Issue date
Aug 8, 2023
Semes Co., Ltd.
Inhwang Park
B08 - CLEANING
Information
Patent Grant
Substrate transfer system and atmospheric transfer module
Patent number
11,705,355
Issue date
Jul 18, 2023
Tokyo Electron Limited
Norihiko Amikura
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
COMPONENT PROCESSING APPARATUS, SUCH AS A PRESSURE SINTERING APPARA...
Publication number
20240096660
Publication date
Mar 21, 2024
BOSCHMAN TECHNOLOGIES BV
Johannes Cornelis de Beijer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSFER SYSTEM AND ATMOSPHERIC TRANSFER MODULE
Publication number
20240047254
Publication date
Feb 8, 2024
TOKYO ELECTRON LIMITED
Norihiko AMIKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240014049
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Chulho Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...
Publication number
20240006201
Publication date
Jan 4, 2024
ELEMENTAL SCIENTIFIC, INC.
Tyler Yost
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES AND METHODS FOR REDUCING PARTICLE CONTAMINATION OF WAFE...
Publication number
20240006202
Publication date
Jan 4, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Zheng-Hao Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP MOLDING DIE DEVICE
Publication number
20240006198
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
Hwansoo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
Publication number
20230420279
Publication date
Dec 28, 2023
Applied Materials, Inc.
Masato ISHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
Publication number
20230420406
Publication date
Dec 28, 2023
KULICKE AND SOFFA HI-TECH CO., LTD.
Lu-Min Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
Publication number
20230420289
Publication date
Dec 28, 2023
LAM RESEARCH CORPORATION
Karl Frederick Leeser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...
Publication number
20230395406
Publication date
Dec 7, 2023
ELEMENTAL SCIENTIFIC, INC.
Tyler Yost
G01 - MEASURING TESTING
Information
Patent Application
MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE
Publication number
20230395403
Publication date
Dec 7, 2023
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS FOR PROCESSING SUBSTRATES
Publication number
20230395405
Publication date
Dec 7, 2023
ASM IP HOLDING B.V.
Theodorus Oosterlaken
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
Publication number
20230369283
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
Publication number
20230343612
Publication date
Oct 26, 2023
Samsung Electronics Co., Ltd.
Minkyu Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR PROCESSING A WAFER-SHAPED ARTICLE
Publication number
20230298928
Publication date
Sep 21, 2023
LAM RESEARCH AG
Michael BRUGGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lid Separation Device For Vacuum Chamber
Publication number
20230290655
Publication date
Sep 14, 2023
Vijayabhaskara VENKATAGIRIYAPPA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR TRANSFERRING MEMBER TO BE DISPOSED IN SUBSTRATE PROCE...
Publication number
20230290656
Publication date
Sep 14, 2023
TOKYO ELECTRON LIMITED
Wataru MATSUMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR PRODUCING A GAS CURTAIN OF PURGE GAS IN A...
Publication number
20230287566
Publication date
Sep 14, 2023
Siltronic AG
Patrick MOOS
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
Publication number
20230278123
Publication date
Sep 7, 2023
WATLOW ELECTRIC MANUFACTURING COMPANY
Brent Elliot
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAP
Publication number
20230238276
Publication date
Jul 27, 2023
NANYA TECHNOLOGY CORPORATION
CHING-KAI CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Publication number
20230230855
Publication date
Jul 20, 2023
TOKYO ELECTRON LIMITED
Takeo NAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMITTER AND METHOD FOR PLASMA FUSING OF MATERIALS
Publication number
20230189424
Publication date
Jun 15, 2023
Essentium IPCo, LLC
William Jack MacNeish
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL VACUUM PROCESS
Publication number
20230178445
Publication date
Jun 8, 2023
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE LIFT MECHANISM AND REACTOR INCLUDING SAME
Publication number
20230163019
Publication date
May 25, 2023
ASM IP HOLDING B.V.
Eric Hill
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
FABRICATION OF THIN-FILM ENCAPSULATION LAYER FOR LIGHT-EMITTING DEVICE
Publication number
20230147887
Publication date
May 11, 2023
Kateeva, Inc.
Eliyahu Vronsky
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METHODS AND MATERIALS FOR MAKING ELASTOMER RESISTANT TO DEGRADATION...
Publication number
20230145789
Publication date
May 11, 2023
Applied Materials, Inc.
Mehran Moalem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
Publication number
20230127641
Publication date
Apr 27, 2023
Samsung Electronics Co., Ltd.
Seunghwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTI...
Publication number
20230111929
Publication date
Apr 13, 2023
ELEMENTAL SCIENTIFIC, INC.
Tyler Yost
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL
Publication number
20230102688
Publication date
Mar 30, 2023
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADJUSTABLE FLUID INLET ASSEMBLY FOR A SUBSTRATE PROCESSING APPARATU...
Publication number
20230090809
Publication date
Mar 23, 2023
Picosun Oy
Timo MALINEN
H01 - BASIC ELECTRIC ELEMENTS