Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industry

CPC
H01L21/67126

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industries

Patents Grantslast 30 patents

Information Patent Grant
Isolated volume seals and method of forming an isolated volume with...
- Patent number 12,217,982
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Kirankumar Neelasandra Savandaiah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lid separation device for vacuum chamber
- Patent number 12,217,981
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus for processing substrates
- Patent number 12,183,602
- Issue date Dec 31, 2024
- ASM IP Holding B.V.
- Theodorus Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for encapsulating an electronic component
- Patent number 12,119,422
- Issue date Oct 15, 2024
- H. B. Fuller Company
- Peter Remmers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable fluid inlet assembly for a substrate processing apparatu...
- Patent number 12,110,588
- Issue date Oct 8, 2024
- Picosun Oy
- Timo Malinen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing apparatus and wafer transfer method
- Patent number 12,099,309
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for integrated decomposition and scanning of a semiconducti...
- Patent number 12,094,738
- Issue date Sep 17, 2024
- Elemental Scientific, Inc.
- Tyler Yost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing system
- Patent number 12,080,570
- Issue date Sep 3, 2024
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Heng Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat shield for chamber door and devices manufactured using same
- Patent number 12,074,032
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Je Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,057,326
- Issue date Aug 6, 2024
- Tokyo Electron Limited
- Shota Umezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing patterns including lines and dots at high speeds
- Patent number 12,052,828
- Issue date Jul 30, 2024
- nScrypt, Inc.
- Kenneth H. Church
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate lift mechanism and reactor including same
- Patent number 12,040,217
- Issue date Jul 16, 2024
- ASM IP Holding B.V.
- Eric Hill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure having air gap
- Patent number 12,022,648
- Issue date Jun 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Ching-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 11,984,328
- Issue date May 14, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for filling wafer with glass powder
- Patent number 11,972,959
- Issue date Apr 30, 2024
- SHANDONG CAIJU ELECTRONIC TECHNOLOGY CO. LTD
- Xiangdong Li
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Isolated volume seals and method of forming an isolated volume with...
- Patent number 11,955,355
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kirankumar Neelasandra Savandaiah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Valve structure and substrate processing apparatus including the same
- Patent number 11,948,814
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Kangmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrates or wafers
- Patent number 11,948,810
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece placement apparatus and processing apparatus
- Patent number 11,942,357
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yohei Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system having a front opening unified pod (FOUP) load lock
- Patent number 11,923,217
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Jacob Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-function wafer backside pressure control and edge purge
- Patent number 11,923,233
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
- Patent number 11,901,208
- Issue date Feb 13, 2024
- LG Electronics Inc.
- Inbum Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurizing device and pressurizing method
- Patent number 11,901,199
- Issue date Feb 13, 2024
- Nikkiso Co., Ltd.
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storing container
- Patent number 11,887,875
- Issue date Jan 30, 2024
- Miraial Co., Ltd.
- Yuya Narita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Direct 3D Laser Engraved Gasket For Parts Used In Semiconductor Pro...
- Publication number 20250041973
- Publication date Feb 6, 2025
- Chih-Yang CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SEALING DEVICE
- Publication number 20250038017
- Publication date Jan 30, 2025
- Apic Yamada Corporation
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029868
- Publication date Jan 23, 2025
- EUGENE TECHNOLOGY CO., LTD.
- Doo Yeol RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Molding System and Foreign Object Detection Method
- Publication number 20250029232
- Publication date Jan 23, 2025
- DIODES INCORPORATED
- Desen Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD
- Publication number 20250014920
- Publication date Jan 9, 2025
- Apic Yamada Corporation
- TAKASHI SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...
- Publication number 20240420972
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTITUTE SMOKING CONSUMABLE
- Publication number 20240412990
- Publication date Dec 12, 2024
- NERUDIA LIMITED
- Chris LORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACT...
- Publication number 20240347344
- Publication date Oct 17, 2024
- Canon Kabushiki Kaisha
- SHINICHIRO KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS
- Publication number 20240339343
- Publication date Oct 10, 2024
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240339339
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Shota Umezaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...
- Publication number 20240332046
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Kirankumar Neelasandra SAVANDAIAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor process machine and operation method thereof
- Publication number 20240297056
- Publication date Sep 5, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- HAIPENG ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO LEVEL VACUUM WAFER TRANSFER SYSTEM WITH ROBOTS ON EACH LEVEL
- Publication number 20240290644
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYERED 3D PRODUCT
- Publication number 20240290633
- Publication date Aug 29, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240266194
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20240258134
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS
- Publication number 20240249957
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chao YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...
- Publication number 20240242974
- Publication date Jul 18, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS M...
- Publication number 20240242978
- Publication date Jul 18, 2024
- TOKYO ELECTRON LIMITED
- Shota UMEZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RESIN MOLDED PRODUCT, FILM FIXING MEMBER, LIQU...
- Publication number 20240227251
- Publication date Jul 11, 2024
- TOWA CORPORATION
- Tomoyuki GOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VALVE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20240213053
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Kangmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSIN...
- Publication number 20240175138
- Publication date May 30, 2024
- ASM IP HOLDING B.V.
- Fan Gao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240170302
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chenghan SHE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240153785
- Publication date May 9, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE AND MOLDING...
- Publication number 20240145268
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jun Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PROCESSING APPARATUS, SUCH AS A PRESSURE SINTERING APPARA...
- Publication number 20240096660
- Publication date Mar 21, 2024
- BOSCHMAN TECHNOLOGIES BV
- Johannes Cornelis de Beijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER SYSTEM AND ATMOSPHERIC TRANSFER MODULE
- Publication number 20240047254
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Isolated volume seals and method of forming an isolated volume with...

Lid separation device for vacuum chamber

Manufacturing method of semiconductor package using jig

Batch curing chamber with gas distribution and individual pumping

High pressure wafer processing systems and related methods

Substrate processing apparatus for processing substrates

Semiconductor processing equipment with high temperature resistant...

Semiconductor device packaging warpage control

Systems and methods for encapsulating an electronic component

Adjustable fluid inlet assembly for a substrate processing apparatu...

Wafer processing apparatus and wafer transfer method

Systems for integrated decomposition and scanning of a semiconducti...

Semiconductor processing system

Heat shield for chamber door and devices manufactured using same

Substrate processing apparatus and substrate processing method

Dispensing patterns including lines and dots at high speeds

Substrate lift mechanism and reactor including same

Semiconductor structure having air gap

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Apparatus for filling wafer with glass powder

Isolated volume seals and method of forming an isolated volume with...

Valve structure and substrate processing apparatus including the same

Apparatus for processing substrates or wafers

Workpiece placement apparatus and processing apparatus

Electrostatically clamped edge ring

Processing system having a front opening unified pod (FOUP) load lock

Dual-function wafer backside pressure control and edge purge

Substrate chuck for self-assembling semiconductor light emitting di...

Pressurizing device and pressurizing method

Substrate storing container

Patents Applicationslast 30 patents

Direct 3D Laser Engraved Gasket For Parts Used In Semiconductor Pro...

RESIN SEALING DEVICE

LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS

Semiconductor Molding System and Foreign Object Detection Method

RESIN SEALING DEVICE, SEALING MOLD, AND RESIN SEALING METHOD

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...

SUBSTITUTE SMOKING CONSUMABLE

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACT...

SINTERING PRESS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ISOLATED VOLUME SEALS AND METHOD OF FORMING AN ISOLATED VOLUME WITH...

Semiconductor process machine and operation method thereof

TWO LEVEL VACUUM WAFER TRANSFER SYSTEM WITH ROBOTS ON EACH LEVEL

METHOD OF MANUFACTURING A LAYERED 3D PRODUCT

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

APPARATUS FOR PROCESSING SUBSTRATES OR WAFERS

DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS M...

METHOD FOR PRODUCING RESIN MOLDED PRODUCT, FILM FIXING MEMBER, LIQU...

VALVE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSIN...

SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE

POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...

MOLDING APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE AND MOLDING...

COMPONENT PROCESSING APPARATUS, SUCH AS A PRESSURE SINTERING APPARA...

SUBSTRATE TRANSFER SYSTEM AND ATMOSPHERIC TRANSFER MODULE