Apparatus for Tape Automated Bonding [TAB]

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H01L24/79

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/79Apparatus for Tape Automated Bonding [TAB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods related to wire bond cleaning and wire bonding...
- Patent number 12,087,728
- Issue date Sep 10, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for debonding temporarily bonded wafers in waf...
- Patent number 11,996,384
- Issue date May 28, 2024
- PulseForge, Inc.
- Vahid Akhavan Attar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for detaching a die from an adhesive film
- Patent number 11,996,385
- Issue date May 28, 2024
- BESI Switzerland AG
- Andreas Mayr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emissive element harvest
- Patent number 11,929,356
- Issue date Mar 12, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for the characterization of emissive elements
- Patent number 11,855,051
- Issue date Dec 26, 2023
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
- Patent number 11,699,676
- Issue date Jul 11, 2023
- LASERSSEL CO., LTD.
- Jae-Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses for removal of wires from packaging substrates
- Patent number 11,616,045
- Issue date Mar 28, 2023
- Skyworks Solutions, Inc.
- Cesar Melendrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding apparatus
- Patent number 11,581,202
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printing method and transfer printing apparatus
- Patent number 11,538,786
- Issue date Dec 27, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Xinglong Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond cleaning method and wire bonding recovery process
- Patent number 11,302,669
- Issue date Apr 12, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape with release liner
- Patent number 11,282,736
- Issue date Mar 22, 2022
- Furukawa Electric Co., Ltd.
- Yukihiro Matsubara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating bonded substrate, method of manufacturing semi...
- Patent number 11,152,329
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,020,811
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick-and-remove system with deformable contact surface
- Patent number 10,985,302
- Issue date Apr 20, 2021
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,679,966
- Issue date Jun 9, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 10,629,564
- Issue date Apr 21, 2020
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate separation system and method
- Patent number 10,622,332
- Issue date Apr 14, 2020
- Princo Corp.
- Chun-Hsiung Chou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,559,549
- Issue date Feb 11, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20250022838
- Publication date Jan 16, 2025
- Vahid Akhavan Attar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240321816
- Publication date Sep 26, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240297144
- Publication date Sep 5, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...
- Publication number 20240284602
- Publication date Aug 22, 2024
- ASTEC IRIE CO., LTD.
- Taichi YOSHIMURA
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING FROM BONDED PART
- Publication number 20240213214
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
- Publication number 20240071992
- Publication date Feb 29, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
- Publication number 20230378127
- Publication date Nov 23, 2023
- Skyworks Solutions, Inc.
- Cesar MELENDREZ MURILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230133340
- Publication date May 4, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Removal Head, Chip Removal System and Chip Removal Method
- Publication number 20230053040
- Publication date Feb 16, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Bin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...
- Publication number 20220406748
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Juchan CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
- Publication number 20220336413
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20220189908
- Publication date Jun 16, 2022
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION JIG TAPE
- Publication number 20220063947
- Publication date Mar 3, 2022
- Dongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING APPARATUS
- Publication number 20210358778
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Detaching a Die from an Adhesive Film
- Publication number 20210265302
- Publication date Aug 26, 2021
- BESI Switzerland AG
- Andreas Mayr
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20210252621
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20210242043
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Device
- Publication number 20210005571
- Publication date Jan 7, 2021
- F&S Bondtec Semiconductor GmbH
- Siegfried Seidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ARRAY DEVICE
- Publication number 20210005520
- Publication date Jan 7, 2021
- Sharp Kabushiki Kaisha
- TOSHIYA ISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
METHOD OF SEPARATING BONDED SUBSTRATE, METHOD OF MANUFACTURING SEMI...
- Publication number 20200294963
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF
- Publication number 20200251442
- Publication date Aug 6, 2020
- LASERSSEL CO., LTD.
- Jae-Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200144221
- Publication date May 7, 2020
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SEPARATION SYSTEM AND METHOD
- Publication number 20200105716
- Publication date Apr 2, 2020
- PRINCO CORP.
- CHUN-HSIUNG CHOU
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for Tape Automated Bonding [TAB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods related to wire bond cleaning and wire bonding...

Substrate debonding from bonded part

Method and apparatus for debonding temporarily bonded wafers in waf...

Apparatus and method for detaching a die from an adhesive film

Emissive element harvest

System for the characterization of emissive elements

Manufacturing apparatus, operation method thereof, and method for m...

Chip packaging device, chip packaging method, and package chip

Solder removal from semiconductor devices

Multi-beam laser de-bonding apparatus and method thereof

Fully automated wafer debonding system and method thereof

Semiconductor manufacturing apparatus

Methods and apparatuses for removal of wires from packaging substrates

Substrate debonding apparatus

Transfer printing method and transfer printing apparatus

Bonding and indexing apparatus

Device and method for reworking flip chip components

Wire bond cleaning method and wire bonding recovery process

Mask-integrated surface protective tape with release liner

High speed handling of ultra-small chips by selective laser bonding...

Apparatus and method for transferring semiconductor devices from a...

Method of separating bonded substrate, method of manufacturing semi...

Solder removal from semiconductor devices

Pick-and-remove system with deformable contact surface

Gallium liquid metal embrittlement for device rework

Power electronics assembly having an adhesion layer, and method for...

Removal apparatuses for semiconductor chips

Substrate separation system and method

Apparatus for the material-bonded connection of connection partners...

Gallium liquid metal embrittlement for device rework

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...

DEBONDING REPAIR DEVICES

SUBSTRATE DEBONDING FROM BONDED PART

METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT

REMOVAL OF WIRES FROM PACKAGING SUBSTRATES

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

BONDING APPARATUS AND BONDING METHOD

Chip Removal Head, Chip Removal System and Chip Removal Method

MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...

SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...

BONDING AND INDEXING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

CONNECTION JIG TAPE

SUBSTRATE DEBONDING APPARATUS

Apparatus and Method for Detaching a Die from an Adhesive Film

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

Bonding Device

METHOD AND APPARATUS FOR MANUFACTURING ARRAY DEVICE

THERMOCOMPRESSION BONDING DEVICE

METHOD OF SEPARATING BONDED SUBSTRATE, METHOD OF MANUFACTURING SEMI...

MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF

BONDING APPARATUS AND BONDING METHOD

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

SUBSTRATE SEPARATION SYSTEM AND METHOD