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H01L21/67005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67005Apparatus not specifically provided for elsewhere

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conveying system and method for operating the same
- Patent number 11,942,342
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus
- Patent number 11,765,793
- Issue date Sep 19, 2023
- Semes Co., Ltd.
- Muhyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for optically representing electronic semiconduct...
- Patent number 11,754,511
- Issue date Sep 12, 2023
- FormFactor, Inc.
- Jens Fiedler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate carrier deterioration detection and repair
- Patent number 11,584,019
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Ti Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck
- Patent number 11,393,708
- Issue date Jul 19, 2022
- Toto Ltd.
- Masafumi Ikeguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling apparatus and assembling method for semiconductor manufa...
- Patent number 11,114,318
- Issue date Sep 7, 2021
- Tokyo Electron Limited
- Hisashi Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conveying system and method for operating the same
- Patent number 11,107,713
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Hsien Li
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 10,714,362
- Issue date Jul 14, 2020
- Kokusai Electric Corporation
- Shuhei Saido
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Equipment for manufacturing semiconductor devices and method for us...
- Patent number 10,319,619
- Issue date Jun 11, 2019
- Samsung Electronics Co., Ltd.
- BongJin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 10,128,104
- Issue date Nov 13, 2018
- Hitachi Kokusai Electric Inc.
- Atsushi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma assisted atomic layer deposition metal oxide for patterning...
- Patent number 10,043,657
- Issue date Aug 7, 2018
- Lam Research Corporation
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming wafer-level molded structure for package assembly
- Patent number 9,754,917
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma assisted atomic layer deposition titanium oxide for patterni...
- Patent number 9,673,041
- Issue date Jun 6, 2017
- Lam Research Corporation
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for depositing electronically conductive pasti...
- Patent number 9,666,416
- Issue date May 30, 2017
- Applied Materials, Inc.
- John C. Forster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating of graphite tooling for manufacture of semiconductors
- Patent number 9,620,664
- Issue date Apr 11, 2017
- Mossey Creek Technologies, Inc.
- John Carberry
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for operating semiconductor manufacturing equipment
- Patent number 9,580,800
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Byoung-Hoon Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Debonders with a recess and a side wall opening for semiconductor f...
- Patent number 9,539,801
- Issue date Jan 10, 2017
- Skyworks Solutions, Inc.
- Steve Canale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dynamic pattern generator device and method of fabrica...
- Patent number 9,536,706
- Issue date Jan 3, 2017
- Corporation for National Research Initiatives
- Michael A. Huff
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Debonders with a recess and a heater for semiconductor fabrication
- Patent number 9,533,484
- Issue date Jan 3, 2017
- Skyworks Solutions, Inc.
- Steve Canale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressuring module, pressuring apparatus, substrate bonding apparatu...
- Patent number 9,498,944
- Issue date Nov 22, 2016
- Shigeto Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressuring module, pressuring apparatus, substrate bonding apparatu...
- Patent number 9,457,554
- Issue date Oct 4, 2016
- Shigeto Izumi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Debonders and related devices and methods for semiconductor fabrica...
- Patent number 9,296,194
- Issue date Mar 29, 2016
- Skyworks Solutions, Inc.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for depositing electrically conductive pasting...
- Patent number 9,224,582
- Issue date Dec 29, 2015
- Applied Materials, Inc.
- John Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wafer-level molded structure for package assembly
- Patent number 9,117,939
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process device for processing in particular stacked processed goods
- Patent number 9,082,796
- Issue date Jul 14, 2015
- Volker Probst
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,039,867
- Issue date May 26, 2015
- Besi Switzerland AG
- Ernst Barmettler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CONVEYING SYSTEM AND METHOD FOR OPERATING THE SAME
- Publication number 20240222166
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-HSIEN LI
- B66 - HOISTING LIFTING HAULING
Information Patent Application
CLEANING DEVICE AND CLEANING METHOD
- Publication number 20230191460
- Publication date Jun 22, 2023
- EBARA CORPORATION
- Yuki TANAKA
- B08 - CLEANING
Information Patent Application
SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR
- Publication number 20230191619
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Jen-Ti Wang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20220319898
- Publication date Oct 6, 2022
- TOTO LTD.
- Masafumi IKEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYING SYSTEM AND METHOD FOR OPERATING THE SAME
- Publication number 20210384052
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-HSIEN LI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DEVICE POSITIONING USING SENSORS
- Publication number 20210082718
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yan-Han CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
- Publication number 20180286704
- Publication date Oct 4, 2018
- Intel Corporation
- Elizabeth M. Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SUBSTRATES, MICROCHIP AND METHOD OF MANUFACTURING...
- Publication number 20180141280
- Publication date May 24, 2018
- Ushio Denki Kabushiki Kaisha
- Motohiro SAKAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLING DEVICE USED FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20170358463
- Publication date Dec 14, 2017
- HERMES-EPITEK CORPORATION
- Tsan-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ASSISTED ATOMIC LAYER DEPOSITION METAL OXIDE FOR PATTERNING...
- Publication number 20170263450
- Publication date Sep 14, 2017
- LAM RESEARCH CORPORATION
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING MACHINE INCLUDING ELECTRIC DISCHARGER
- Publication number 20170013700
- Publication date Jan 12, 2017
- FANUC CORPORATION
- Naoki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DYNAMIC PATTERN GENERATOR DEVICE AND METHOD OF FABRICA...
- Publication number 20160233054
- Publication date Aug 11, 2016
- Corporation for National Research Initiatives
- Michael A. Huff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Increasing Productivity of Combinatorial Scre...
- Publication number 20140315332
- Publication date Oct 23, 2014
- Gustavo A. Pinto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20140262053
- Publication date Sep 18, 2014
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatu...
- Publication number 20140262045
- Publication date Sep 18, 2014
- Nikon Corporation
- Keiichi Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Application
SELF-ALIGNED DYNAMIC PATTERN GENERATOR DEVICE AND METHOD OF FABRICA...
- Publication number 20140268076
- Publication date Sep 18, 2014
- Corporation for National Research Initiatives
- Michael A. HUFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Wafer-Level Molded Structure for Package Assembly
- Publication number 20140206140
- Publication date Jul 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP SORTING APPARATUS
- Publication number 20140202627
- Publication date Jul 24, 2014
- EPISTAR CORPORATION
- Chen-Ke HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Equipment
- Publication number 20140000655
- Publication date Jan 2, 2014
- Chien-Ping HUANG
- A46 - BRUSHWARE
Information Patent Application
Methods and Apparatus for Ex Situ Seasoning of Electronic Device Ma...
- Publication number 20130299464
- Publication date Nov 14, 2013
- Applied Materials, Inc.
- Jiansheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABLE SURFACE WAVE PLASMA SOURCE
- Publication number 20130264938
- Publication date Oct 10, 2013
- TOKYO ELECTRON LIMITED
- Lee Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE AND METHOD OF MANUFACTURING PROBE
- Publication number 20130247375
- Publication date Sep 26, 2013
- FUJITSU COMPONENT LIMITED
- Koki Sato
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20130219639
- Publication date Aug 29, 2013
- HERMES-EPITEK CORPORATION
- Chien-Ping HUANG
- A46 - BRUSHWARE
Information Patent Application
METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...
- Publication number 20130171820
- Publication date Jul 4, 2013
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR CLEANING SEMICONDUCTOR SUBSTRATE
- Publication number 20130068257
- Publication date Mar 21, 2013
- Hiroshi TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Substrate Processing System
- Publication number 20130046403
- Publication date Feb 21, 2013
- Hitachi Kokusai Electric Inc.
- Yoshihiko Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURING MODULE, PRESSURING APPARATUS, SUBSTRATE BONDING APPARATU...
- Publication number 20120251789
- Publication date Oct 4, 2012
- Keiichi TANAKA
- B32 - LAYERED PRODUCTS

Apparatus not specifically provided for elsewhere

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of bonding substrates, microchip and method of manufacturing...

Conveying system and method for operating the same

Substrate treating apparatus

Method and device for optically representing electronic semiconduct...

Substrate carrier deterioration detection and repair

Electrostatic chuck

Assembling apparatus and assembling method for semiconductor manufa...

Conveying system and method for operating the same

Substrate processing apparatus and method of manufacturing semicond...

Equipment for manufacturing semiconductor devices and method for us...

Methods for bonding substrates

Method of manufacturing semiconductor device, substrate processing...

Plasma assisted atomic layer deposition metal oxide for patterning...

Method of forming wafer-level molded structure for package assembly

Plasma assisted atomic layer deposition titanium oxide for patterni...

Apparatus and method for depositing electronically conductive pasti...

Methods for bonding substrates

Coating of graphite tooling for manufacture of semiconductors

Method for operating semiconductor manufacturing equipment

Debonders with a recess and a side wall opening for semiconductor f...

Self-aligned dynamic pattern generator device and method of fabrica...

Debonders with a recess and a heater for semiconductor fabrication

Pressuring module, pressuring apparatus, substrate bonding apparatu...

Pressuring module, pressuring apparatus, substrate bonding apparatu...

Debonders and related devices and methods for semiconductor fabrica...

Method and apparatus for wafer electroless plating

Apparatus and method for depositing electrically conductive pasting...

Method of forming wafer-level molded structure for package assembly

Process device for processing in particular stacked processed goods

Method for detaching a semiconductor chip from a foil

Patents Applicationslast 30 patents

CONVEYING SYSTEM AND METHOD FOR OPERATING THE SAME

CLEANING DEVICE AND CLEANING METHOD

SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR

ELECTROSTATIC CHUCK

CONVEYING SYSTEM AND METHOD FOR OPERATING THE SAME

DEVICE POSITIONING USING SENSORS

PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE

METHOD OF BONDING SUBSTRATES, MICROCHIP AND METHOD OF MANUFACTURING...

ASSEMBLING DEVICE USED FOR SEMICONDUCTOR EQUIPMENT

PLASMA ASSISTED ATOMIC LAYER DEPOSITION METAL OXIDE FOR PATTERNING...

PROCESSING MACHINE INCLUDING ELECTRIC DISCHARGER

SELF-ALIGNED DYNAMIC PATTERN GENERATOR DEVICE AND METHOD OF FABRICA...

System and Method for Increasing Productivity of Combinatorial Scre...

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatu...

SELF-ALIGNED DYNAMIC PATTERN GENERATOR DEVICE AND METHOD OF FABRICA...

Method of Forming Wafer-Level Molded Structure for Package Assembly

CHIP SORTING APPARATUS

METHODS FOR BONDING SUBSTRATES

Semiconductor Equipment

Methods and Apparatus for Ex Situ Seasoning of Electronic Device Ma...

Method and Apparatus for Wafer Electroless Plating

STABLE SURFACE WAVE PLASMA SOURCE

Method For Detaching A Semiconductor Chip From A Foil

PROBE AND METHOD OF MANUFACTURING PROBE

SEMICONDUCTOR EQUIPMENT

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA G...

METHOD AND DEVICE FOR CLEANING SEMICONDUCTOR SUBSTRATE

Substrate Processing Apparatus and Substrate Processing System

PRESSURING MODULE, PRESSURING APPARATUS, SUBSTRATE BONDING APPARATU...