Apparatus specially adapted for plating wafers

Industry

CPC
C25D17/001

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/001Apparatus specially adapted for plating wafers

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Lipseal edge exclusion engineering to maintain material integrity a...
- Patent number 12,247,310
- Issue date Mar 11, 2025
- Lam Research Corporation
- Justin Oberst
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating process method
- Patent number 12,247,311
- Issue date Mar 11, 2025
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 12,227,865
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating membrane
- Patent number 12,195,866
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsiang Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer immersion in semiconductor processing chambers
- Patent number 12,188,144
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John L. Klocke
- G05 - CONTROLLING REGULATING
Information Patent Grant
Device and method for pressure force inspection
- Patent number 12,181,362
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for monitoring edge bevel removal area in semi...
- Patent number 12,169,179
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chao-Tung Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 12,157,950
- Issue date Dec 3, 2024
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 12,134,831
- Issue date Nov 5, 2024
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus having conductive liquid and plating method
- Patent number 12,104,266
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Choi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 12,104,269
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,071,699
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system and method of plating wafer
- Patent number 12,071,701
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for plating and method of plating
- Patent number 12,054,841
- Issue date Aug 6, 2024
- Ebara Corporation
- Kazuma Ideguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 12,024,785
- Issue date Jul 2, 2024
- Maxeon Solar Pte. Ltd.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating method and electroplating apparatus
- Patent number 11,959,186
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ting Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20250092559
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF PLATING
- Publication number 20250075362
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Naoto TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20250051955
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
- Publication number 20250034744
- Publication date Jan 30, 2025
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
JET STREAM TYPE PLATING DEVICE
- Publication number 20250027225
- Publication date Jan 23, 2025
- ASKA CORPORATION
- Takayuki FURUSAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20250019857
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig
- Publication number 20240401222
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig
- Publication number 20240401221
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
- Publication number 20240393199
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ELECTROPLATING APPARATUS
- Publication number 20240376627
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROCHEMICAL PLATING
- Publication number 20240360585
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEM AND METHOD OF PLATING WAFER
- Publication number 20240360584
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20240312800
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Hakuba KITAGAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS
- Publication number 20240247396
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240247394
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING
- Publication number 20240213131
- Publication date Jun 27, 2024
- Intel Corporation
- Yi YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS
- Publication number 20240200223
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...
- Publication number 20240167188
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES
- Publication number 20240150923
- Publication date May 9, 2024
- MTI GmbH
- Markus HACKSTEINER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
- Publication number 20240141534
- Publication date May 2, 2024
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Apparatus specially adapted for plating wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lipseal edge exclusion engineering to maintain material integrity a...

Plating apparatus and plating process method

Plating apparatus for plating semiconductor wafer and plating method

Plating apparatus and method for electroplating wafer

Plating method and plating apparatus

Plating membrane

Electrochemical deposition systems with enhanced crystallization pr...

Semiconductor manufacturing apparatus, failure prediction method fo...

Wafer immersion in semiconductor processing chambers

Device and method for pressure force inspection

Method and apparatus for monitoring edge bevel removal area in semi...

Method of adjusting plating module

Methods and systems of forming metal interconnect layers using engi...

Lipseals and contact elements for semiconductor electroplating appa...

Method of controlling chemical concentration in electrolyte

Cross flow conduit for foaming prevention in high convection platin...

Plating and deplating currents for material co-planarity in semicon...

Apparatus for an inert anode plating cell

Parameter adjustment model for semiconductor processing chambers

Plating apparatus having conductive liquid and plating method

Mechanically-driven oscillating flow agitation

Apparatus for electro-chemical plating

Plating system and method of plating wafer

Apparatus for plating and method of plating

Electroplating apparatus and electroplating method

Dual wafer plating fixture for a continuous plating line

Copper electrofill on non-copper liner layers

Electroplating system

Electroplating method and electroplating apparatus

Electroplating apparatus and electroplating method

Patents Applicationslast 30 patents

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

APPARATUS FOR PLATING AND METHOD OF PLATING

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

METHOD OF ADJUSTING PLATING MODULE

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS

JET STREAM TYPE PLATING DEVICE

APPARATUS FOR AN INERT ANODE PLATING CELL

Workpiece Holding Jig

Workpiece Holding Jig

DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

ELECTROPLATING APPARATUS

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHODS OF ELECTROCHEMICAL PLATING

PLATING SYSTEM AND METHOD OF PLATING WAFER

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS

PLATING APPARATUS AND PLATING METHOD

DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING

CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...

METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...