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Apparatus specially adapted for plating wafers
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CPC
C25D17/001
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C
CHEMISTRY METALLURGY
C25
Electrolytic processing
C25D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR
C25D17/00
Constructional parts, or assemblies thereof, of cells for electrolytic coating
Current Industry
C25D17/001
Apparatus specially adapted for plating wafers
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Patents Grants
last 30 patents
Information
Patent Grant
Electroplating method and electroplating apparatus
Patent number
11,959,186
Issue date
Apr 16, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ting Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating apparatus and electroplating method
Patent number
11,926,920
Issue date
Mar 12, 2024
ACM RESEARCH (SHANGHAI), INC.
Zhaowei Jia
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Detection of contact formation between a substrate and contact pins...
Patent number
11,920,254
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yung Chang Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and device for plating a recess in a substrate
Patent number
11,908,698
Issue date
Feb 20, 2024
SEMSYSCO GMBH
Franz Markut
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Semiconductor device manufacturing jig and method for manufacturing...
Patent number
11,891,713
Issue date
Feb 6, 2024
Kabushiki Kaisha Toshiba
Takeyuki Suzuki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
Patent number
11,859,300
Issue date
Jan 2, 2024
Lam Research Corporation
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate cleaning components and methods in a plating system
Patent number
11,814,744
Issue date
Nov 14, 2023
Applied Materials, Inc.
Nolan Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating membrane
Patent number
11,814,743
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Hsiang Chen
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Fluid recovery in semiconductor processing
Patent number
11,788,200
Issue date
Oct 17, 2023
Applied Materials, Inc.
Sam Lee
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and apparatus for monitoring edge bevel removal area in semi...
Patent number
11,781,995
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chao-Tung Wu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
Patent number
11,781,233
Issue date
Oct 10, 2023
Ebara Corporation
Junitsu Yamakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Plating apparatus and plating method
Patent number
11,781,235
Issue date
Oct 10, 2023
ACM RESEARCH (SHANGHAI), INC.
Yinuo Jin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Systems and methods for plate-up detection
Patent number
11,781,238
Issue date
Oct 10, 2023
Applied Materials, Inc.
Matthew Heller
B08 - CLEANING
Information
Patent Grant
Plating support system, plating support device, and recording medium
Patent number
11,773,504
Issue date
Oct 3, 2023
Ebara Corporation
Mitsuhiro Shamoto
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
Patent number
11,767,606
Issue date
Sep 26, 2023
Ebara Corporation
Junitsu Yamakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Methods and systems of forming metal interconnect layers using engi...
Patent number
11,756,800
Issue date
Sep 12, 2023
Rashid Mavliev
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Removing bubbles from plating cells
Patent number
11,746,435
Issue date
Sep 5, 2023
Lam Research Corporation
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating systems having reduced air entrainment
Patent number
11,739,434
Issue date
Aug 29, 2023
Applied Materials, Inc.
Cameron Law
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plate, plating apparatus, and method of manufacturing plate
Patent number
11,725,296
Issue date
Aug 15, 2023
Ebara Corporation
Mitsuhiro Shamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
Patent number
11,717,796
Issue date
Aug 8, 2023
Ebara Corporation
Yasuyuki Masuda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
Patent number
11,699,590
Issue date
Jul 11, 2023
Lam Research Corporation
Jeyavel Velmurugan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate holder
Patent number
11,697,886
Issue date
Jul 11, 2023
Ebara Corporation
Matsutaro Miyamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Multi-compartment electrochemical replenishment cell
Patent number
11,697,887
Issue date
Jul 11, 2023
Applied Materials, Inc.
Nolan L. Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating systems and methods with increased metal ion concent...
Patent number
11,686,005
Issue date
Jun 27, 2023
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
Patent number
11,686,647
Issue date
Jun 27, 2023
Ebara Corporation
Kiyoshi Suzuki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Regulation plate, anode holder, and substrate holder
Patent number
11,686,009
Issue date
Jun 27, 2023
Ebara Corporation
Naoki Shimomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate holder
Patent number
11,676,837
Issue date
Jun 13, 2023
Ebara Corporation
Matsutaro Miyamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Flow assisted dynamic seal for high-convection, continuous-rotation...
Patent number
11,655,556
Issue date
May 23, 2023
Lam Research Corporation
Aaron Berke
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Apparatus for electrochemically processing semiconductor substrates
Patent number
11,643,744
Issue date
May 9, 2023
SPTS Technologies Limited
John Macneil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plating system and method of plating wafer
Patent number
11,634,832
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company Limited
Kuo-Lung Hou
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES
Publication number
20240150923
Publication date
May 9, 2024
MTI GmbH
Markus HACKSTEINER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
Publication number
20240141534
Publication date
May 2, 2024
Semsysco GmbH
Andreas Gleissner
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
Publication number
20240141540
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
Publication number
20240141541
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Lee Peng Chua
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
Publication number
20240141543
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Paolo CREMA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES
Publication number
20240084473
Publication date
Mar 14, 2024
LAM RESEARCH CORPORATION
Steven T. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...
Publication number
20240076795
Publication date
Mar 7, 2024
LAM RESEARCH CORPORATION
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
Publication number
20240044038
Publication date
Feb 8, 2024
ACM RESEARCH (SHANGHAI), INC.
Hui Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS AND PLATING METHOD
Publication number
20240026561
Publication date
Jan 25, 2024
ACM RESEARCH (SHANGHAI), INC.
Zhaowei Jia
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper Electrodeposition in Microelectronics
Publication number
20240018678
Publication date
Jan 18, 2024
MacDermid Enthone Inc.
Vincent Paneccasio
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS AND PLATING METHOD
Publication number
20240018681
Publication date
Jan 18, 2024
ACM RESEARCH (SHANGHAI), INC.
Yinuo Jin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING MEMBRANE
Publication number
20240018685
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Hsiang CHEN
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PROCESS KIT DE-BUBBLING
Publication number
20230407514
Publication date
Dec 21, 2023
LAM RESEARCH CORPORATION
James Isaac Fortner
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD AND APPARATUS FOR MONITORING EDGE BEVEL REMOVAL AREA IN SEMI...
Publication number
20230375482
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHAO-TUNG WU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
Publication number
20230369065
Publication date
Nov 16, 2023
Rashid Mavliev
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
Publication number
20230349064
Publication date
Nov 2, 2023
Applied Materials, Inc.
Cameron Law
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
Publication number
20230298894
Publication date
Sep 21, 2023
LAM RESEARCH CORPORATION
Jeyavel Velmurugan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...
Publication number
20230290901
Publication date
Sep 14, 2023
Solarlab Aiko Europe GmbH
Yongqian WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
Publication number
20230272546
Publication date
Aug 31, 2023
Applied Materials, Inc.
Kwan Wook Roh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
Publication number
20230265578
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Chang HUANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SUBSTRATE HOLDER
Publication number
20230268209
Publication date
Aug 24, 2023
EBARA CORPORATION
Matsutaro MIYAMOTO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING SYSTEM AND METHOD OF PLATING WAFER
Publication number
20230257901
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company Limited
Kuo-Lung HOU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THRO...
Publication number
20230260837
Publication date
Aug 17, 2023
LAM RESEARCH CORPORATION
Hyungjun Hur
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
Publication number
20230245917
Publication date
Aug 3, 2023
LAM RESEARCH CORPORATION
Douglas Hill
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS
Publication number
20230235474
Publication date
Jul 27, 2023
Applied Materials, Inc.
Joel L. Cannone
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD AND SYSTEM FOR IMPROVING UNIFORMITY OF PLATING FILM ON WAFER
Publication number
20230220581
Publication date
Jul 13, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Yulong GAO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
Publication number
20230193503
Publication date
Jun 22, 2023
Semsysco GmbH
Andreas GLEISSNER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
Publication number
20230193502
Publication date
Jun 22, 2023
Maxeon Solar Pte. Ltd
Hung-Ming Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION
Publication number
20230193504
Publication date
Jun 22, 2023
Applied Materials, Inc.
Paul R. McHugh
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD
Publication number
20230183881
Publication date
Jun 15, 2023
Samsung Electronics Co., Ltd.
Jaewon CHOI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR