Apparatus therefor

Industry

CPC
H01L2021/6003

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/6003Apparatus therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,587,912
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,088,114
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 9,162,320
- Issue date Oct 20, 2015
- Shibuya Kogyo Co., Ltd.
- Eiji Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20240282755
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ALIGNMENT SYSTEM AND METHOD
- Publication number 20240170303
- Publication date May 23, 2024
- SAMTEC, INC.
- John CORONATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD
- Publication number 20240145259
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20230197689
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20220359240
- Publication date Nov 10, 2022
- SHINKAWA LTD.
- Makoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...
- Publication number 20220319870
- Publication date Oct 6, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20210351163
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20210134759
- Publication date May 6, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER
- Publication number 20190221456
- Publication date Jul 18, 2019
- Intel Corporation
- Dudi AMIR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20140001163
- Publication date Jan 2, 2014
- Eiji TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Apparatus therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density pillar interconnect conversion with stack to substrate...

High density pillar interconnect conversion with stack to substrate...

High density pillar interconnect conversion with stack to substrate...

Package structure and method for manufacturing the same

Bonding device

Patents Applicationslast 30 patents

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

INTERCONNECT ALIGNMENT SYSTEM AND METHOD

SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING DEVICE