Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

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H05K3/4673

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filtering cable
- Patent number 11,929,189
- Issue date Mar 12, 2024
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit support structure with integrated isolation circuitry
- Patent number 11,716,117
- Issue date Aug 1, 2023
- Texas Instruments Incorporated
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,622,443
- Issue date Apr 4, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring body and method for manufacturing same
- Patent number 11,564,313
- Issue date Jan 24, 2023
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 11,452,216
- Issue date Sep 20, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,412,622
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking structure applicable to manufacturing circuit board
- Patent number 11,322,377
- Issue date May 3, 2022
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and method for manufacturing the same
- Patent number 11,234,331
- Issue date Jan 25, 2022
- HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable thin film devices
- Patent number 11,191,952
- Issue date Dec 7, 2021
- Pacesetter, Inc.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide-fed planar antenna array
- Patent number 11,128,056
- Issue date Sep 21, 2021
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,127,664
- Issue date Sep 21, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,089,674
- Issue date Aug 10, 2021
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,083,092
- Issue date Aug 3, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module with compression-molded circuit board and manufacturi...
- Patent number 11,051,400
- Issue date Jun 29, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Manufacturing method of flexible electronic device
- Patent number 11,019,721
- Issue date May 25, 2021
- HannsTouch Solution Incorporated
- Chien-Chih Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing treated sheet and method of manufacturing r...
- Patent number 11,001,042
- Issue date May 11, 2021
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of manufacturing ultra thin dielectric printed circuit boar...
- Patent number 10,993,333
- Issue date Apr 27, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,925,151
- Issue date Feb 16, 2021
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHA...
- Publication number 20250016935
- Publication date Jan 9, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...
- Publication number 20240260201
- Publication date Aug 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...
- Publication number 20240120964
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo Calabrese
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240114619
- Publication date Apr 4, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240114629
- Publication date Apr 4, 2024
- Kensuke MATSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
- Publication number 20240015892
- Publication date Jan 11, 2024
- Primax Electronics Ltd.
- Yi-Te Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20230413431
- Publication date Dec 21, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230380055
- Publication date Nov 23, 2023
- IBIDEN CO., LTD.
- Masataka KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY
- Publication number 20230344467
- Publication date Oct 26, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS
- Publication number 20230114747
- Publication date Apr 13, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, IN...
- Publication number 20230078471
- Publication date Mar 16, 2023
- THE UNIVERSITY COURT OF THE UNIVERSITY OF EDINBURGH
- Philip James Walton HANDS
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20220352120
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Eunseok HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20220346229
- Publication date Oct 27, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
- Publication number 20220225502
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIELECTRIC PRINTED CIRCUIT BOARD
- Publication number 20220201836
- Publication date Jun 23, 2022
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filtering Cable
- Publication number 20220199292
- Publication date Jun 23, 2022
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTABLE THIN FILM DEVICES
- Publication number 20220088375
- Publication date Mar 24, 2022
- PACESETTER, INC.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE
- Publication number 20220087034
- Publication date Mar 17, 2022
- AZOTEK CO., LTD.
- Hung-Jung LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRING BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20220053636
- Publication date Feb 17, 2022
- NIPPON MEKTRON, LTD.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210337665
- Publication date Oct 28, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210329779
- Publication date Oct 21, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT
- Publication number 20210329795
- Publication date Oct 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20210298172
- Publication date Sep 23, 2021
- Toppan Printing Co.,Ltd.
- Jun ONOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY
- Publication number 20210258045
- Publication date Aug 19, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...
- Publication number 20210243903
- Publication date Aug 5, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202361
- Publication date Jul 1, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Circuit board

Printed circuit board and method of producing printed circuit board

Multi-dielectric printed circuit board

Multilayer circuit board manufacturing apparatus

Method for manufacturing multilayer printed circuit board

Thermosetting resin composition, resin sheet, laminate, and printed...

Filtering cable

Manufacturing method of package structure

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Planar coil element and method for producing planar coil element

Circuit support structure with integrated isolation circuitry

Component carrier and method of manufacturing the same

Wiring body and method for manufacturing same

Method for manufacturing multilayer printed wiring board

Wiring board and method of manufacturing the same

Component carrier and method of manufacturing the same

Stacking structure applicable to manufacturing circuit board

Multilayer printed circuit board and method for manufacturing the same

Implantable thin film devices

Waveguide-fed planar antenna array

Circuit board and manufacturing method thereof

Wiring substrate and method for manufacturing wiring substrate

Planar coil element and method for producing planar coil element

Camera module with compression-molded circuit board and manufacturi...

Manufacturing method of flexible electronic device

Method of manufacturing treated sheet and method of manufacturing r...

Methods of manufacturing ultra thin dielectric printed circuit boar...

Wiring board and method of manufacturing the same

Systems and methods for providing a high speed interconnect system...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHA...

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

Component Carrier Method of Manufacturing the Component Carrier and...

UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...

ELECTRONIC DEVICE

WIRING SUBSTRATE

MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

WIRING SUBSTRATE

CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS

FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, IN...

INTERPOSER AND ELECTRONIC DEVICE INCLUDING INTERPOSER

Component Carrier

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

MULTI-DIELECTRIC PRINTED CIRCUIT BOARD

Filtering Cable

IMPLANTABLE THIN FILM DEVICES

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE

WIRING BODY AND METHOD FOR MANUFACTURING SAME

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Component Carrier and Method of Manufacturing the Same

PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT

CIRCUIT BOARD

CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY

ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME