Applying an insulating coating on the walls of holes

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CPC
H05K2201/09581

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09581Applying an insulating coating on the walls of holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 11,388,821
- Issue date Jul 12, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assembly
- Patent number 11,122,689
- Issue date Sep 14, 2021
- MBDA UK Limited
- Adam Armitage
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-reciprocal circuit element and method for manufacturing the same
- Patent number 10,944,143
- Issue date Mar 9, 2021
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating in-via routing with a light pipe
- Patent number 10,834,830
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark J. Jeanson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conductor structure and method
- Patent number 10,734,282
- Issue date Aug 4, 2020
- Intel Corporation
- Harold Ryan Chase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 10,660,209
- Issue date May 19, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar on-package via capacitor
- Patent number 10,595,410
- Issue date Mar 17, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor connection structure of laminated wiring body
- Patent number 10,511,111
- Issue date Dec 17, 2019
- Yazaki Corporation
- Masahiro Ito
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Conductor connection structure of laminated wiring body
- Patent number 10,454,192
- Issue date Oct 22, 2019
- Yazaki Corporation
- Masahiro Ito
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Through-hole electrode substrate and semiconductor device using thr...
- Patent number 10,256,176
- Issue date Apr 9, 2019
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conductor structure and method
- Patent number 10,121,701
- Issue date Nov 6, 2018
- Intel Corporation
- Harold Ryan Chase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring plate and method for fabricating same
- Patent number 10,027,012
- Issue date Jul 17, 2018
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optical and electrical vias
- Patent number 9,995,894
- Issue date Jun 12, 2018
- AMS AG
- Jochen Kraft
- G02 - OPTICS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,736,927
- Issue date Aug 15, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copolymers of diglycidyl ether terminated polysiloxane compounds an...
- Patent number 9,518,324
- Issue date Dec 13, 2016
- Rohm and Haas Electronic Materials LLC
- Julia Kozhukh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copolymers of diglycidyl ether terminated polysiloxane compounds an...
- Patent number 9,499,912
- Issue date Nov 22, 2016
- Rohm and Haas Electronic Materials LLC
- Julia Kozhukh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through-hole electrode substrate
- Patent number 9,443,788
- Issue date Sep 13, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate conductor structure and method
- Patent number 9,406,587
- Issue date Aug 2, 2016
- Intel Corporation
- Harold Ryan Chase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,253,873
- Issue date Feb 2, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,872,334
- Issue date Oct 28, 2014
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with metal film
- Patent number 8,826,530
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 8,704,101
- Issue date Apr 22, 2014
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 8,669,643
- Issue date Mar 11, 2014
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...
- Publication number 20220151069
- Publication date May 12, 2022
- Mitsui Chemicals, Inc.
- Taichi KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20200315020
- Publication date Oct 1, 2020
- MBDA UK LIMITED
- Adam ARMITAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATING IN-VIA ROUTING WITH A LIGHT PIPE
- Publication number 20200260594
- Publication date Aug 13, 2020
- International Business Machines Corporation
- MARK J. JEANSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20200245466
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONDUCTOR STRUCTURE AND METHOD
- Publication number 20190027405
- Publication date Jan 24, 2019
- Intel Corporation
- Harold Ryan Chase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20180160525
- Publication date Jun 7, 2018
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki SATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...
- Publication number 20170290165
- Publication date Oct 5, 2017
- TDK Corporation
- Hitoshi SAITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...
- Publication number 20140334108
- Publication date Nov 13, 2014
- Jin-San JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140124258
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONDUCTOR STRUCTURE AND METHOD
- Publication number 20130341772
- Publication date Dec 26, 2013
- Harold Ryan Chase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20130269986
- Publication date Oct 17, 2013
- SUBTRON TECHNOLOGY CO., LTD.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130026653
- Publication date Jan 31, 2013
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...
- Publication number 20120261801
- Publication date Oct 18, 2012
- Taiyo Yuden Co., Ltd.
- Akihito TAKANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARA...
- Publication number 20120234587
- Publication date Sep 20, 2012
- Fujitsu Limited
- Naoki NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE VIA FOR CHIP PACKAGE AND INTERCONNECT
- Publication number 20120180312
- Publication date Jul 19, 2012
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor Element Having Through-Hole Plating
- Publication number 20120111726
- Publication date May 10, 2012
- Dulce Maria Couto Petri
- G01 - MEASURING TESTING
Information Patent Application
WIRING STRUCTURE AND JOINT BOX INCLUDING THE SAME
- Publication number 20120077359
- Publication date Mar 29, 2012
- Honda Motor Co., Ltd.
- Takeyoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRO...
- Publication number 20110249535
- Publication date Oct 13, 2011
- Yoichi Funabiki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT BOARD AND STRUCTURE USING THE SAME
- Publication number 20110232953
- Publication date Sep 29, 2011
- Kyocera Corporation
- Takeshi Oga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...
- Publication number 20110194260
- Publication date Aug 11, 2011
- Samsung Electronics Co., Ltd.
- Jin-san Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Forming an Isolated Electrically Conductive Contact Thr...
- Publication number 20110131807
- Publication date Jun 9, 2011
- Electro Scientific Industries, Inc.
- Michael Nashner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR AND ELECTRIC POWER SUPPLY USING IT
- Publication number 20110102122
- Publication date May 5, 2011
- IBIDEN CO., LTD.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH INSULATING AREAS
- Publication number 20110094788
- Publication date Apr 28, 2011
- AMBIT MICROSYSTEMS (SHANGHAI) LTD.
- KAI-FANG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110056740
- Publication date Mar 10, 2011
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core via for chip package and interconnect
- Publication number 20100326716
- Publication date Dec 30, 2010
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Applying an insulating coating on the walls of holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through-hole electrode substrate

Thin film capacitors for core and adjacent build up layers

Through-hole electrode substrate

Wiring substrate

Circuit assembly

Non-reciprocal circuit element and method for manufacturing the same

Creating in-via routing with a light pipe

Through-hole electrode substrate

Substrate conductor structure and method

Thin film capacitors for core and adjacent build up layers

Through-hole electrode substrate

Non-planar on-package via capacitor

Through-hole electrode substrate

Conductor connection structure of laminated wiring body

Conductor connection structure of laminated wiring body

Through-hole electrode substrate and semiconductor device using thr...

Substrate conductor structure and method

Multilayer wiring plate and method for fabricating same

Through-hole electrode substrate

Semiconductor device with optical and electrical vias

Printed circuit board and method of manufacturing the same

Copolymers of diglycidyl ether terminated polysiloxane compounds an...

Copolymers of diglycidyl ether terminated polysiloxane compounds an...

Through-hole electrode substrate

Substrate conductor structure and method

Printed circuit board and method of manufacturing the same

Method for manufacturing semiconductor device

Method for manufacturing substrate with metal film

Package carrier and manufacturing method thereof

Wiring board, semiconductor device, and method for manufacturing wi...

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...

CIRCUIT ASSEMBLY

CREATING IN-VIA ROUTING WITH A LIGHT PIPE

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

SUBSTRATE CONDUCTOR STRUCTURE AND METHOD

THROUGH-HOLE ELECTRODE SUBSTRATE

CIRCUIT BOARD DEVICE

THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE CONDUCTOR STRUCTURE AND METHOD

THROUGH-HOLE ELECTRODE SUBSTRATE

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Wiring Board, Semiconductor Device, and Method for Manufacturing Wi...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARA...

CORE VIA FOR CHIP PACKAGE AND INTERCONNECT

Sensor Element Having Through-Hole Plating

WIRING STRUCTURE AND JOINT BOX INCLUDING THE SAME

METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRO...

CIRCUIT BOARD AND STRUCTURE USING THE SAME

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN...

Process for Forming an Isolated Electrically Conductive Contact Thr...

INDUCTOR AND ELECTRIC POWER SUPPLY USING IT

PRINTED CIRCUIT BOARD WITH INSULATING AREAS

THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

Core via for chip package and interconnect