Applying energy for connecting

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/822Applying energy for connecting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,990,446
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method and apparatus for through silicon die level interconnect
- Patent number 11,621,219
- Issue date Apr 4, 2023
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,552,045
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including two joint structures including differen...
- Patent number 11,276,661
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,101,405
- Issue date Aug 24, 2021
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
LED with internally confined current injection area
- Patent number 10,593,832
- Issue date Mar 17, 2020
- Apple Inc.
- Kelly McGroddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 10,522,524
- Issue date Dec 31, 2019
- LG Display Co., Ltd.
- Seungchul Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,136,220
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the semiconducto...
- Patent number 9,099,478
- Issue date Aug 4, 2015
- Shinko Electric Industries Co., Ltd.
- Kenta Uchiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, photosensitive resin composition...
- Patent number 8,946,852
- Issue date Feb 3, 2015
- Toray Industries, Inc.
- Hiroyuki Niwa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High frequency flip chip package structure of polymer substrate
- Patent number 8,258,606
- Issue date Sep 4, 2012
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency flip chip package process of polymer substrate and s...
- Patent number 8,033,039
- Issue date Oct 11, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20230145473
- Publication date May 11, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20220310545
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT
- Publication number 20220262715
- Publication date Aug 18, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Chip Packages and a Chip Package
- Publication number 20220181295
- Publication date Jun 9, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20220052021
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210366864
- Publication date Nov 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
- Publication number 20190057950
- Publication date Feb 21, 2019
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190006335
- Publication date Jan 3, 2019
- LG Display Co., Ltd.
- Seungchul LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING TECHNOLOGY FOR COMPONENT ATTACH
- Publication number 20140000804
- Publication date Jan 2, 2014
- STMicroelectronics Pte Ltd
- Han Kong Looi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20130214379
- Publication date Aug 22, 2013
- TORAY INDUSTRIES, INC.
- Hiroyuki Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20130069219
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Kenta UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
- Publication number 20110186974
- Publication date Aug 4, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
- Publication number 20100307798
- Publication date Dec 9, 2010
- Jamal S. Izadian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Frequency Flip Chip Package Process of Polymer Substrate and S...
- Publication number 20100248430
- Publication date Sep 30, 2010
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS

Applying energy for connecting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming chip packages and a chip package having a chipse...

Substrate bonding apparatus and method of manufacturing a semicondu...

Semiconductor assemblies with redistribution structures for die sta...

LED with internally confined current injection area

Method and apparatus for through silicon die level interconnect

Semiconductor device with redistribution structure and method for f...

Semiconductor assemblies with redistribution structures for die sta...

Package structure including two joint structures including differen...

LED with internally confined current injection area

Electronic module and method for producing same

LED with internally confined current injection area

Methods of forming joint structures for surface mount packages

Display device and method for fabricating the same

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Method and apparatus for printing integrated circuit bond connections

Discrete device mounted on substrate

Integrated circuit with printed bond connections

Semiconductor package and method for manufacturing the semiconducto...

Semiconductor package and method for manufacturing the semiconducto...

Photosensitive resin composition, photosensitive resin composition...

High frequency flip chip package structure of polymer substrate

High frequency flip chip package process of polymer substrate and s...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

METHOD AND APPARATUS FOR THROUGH SILICON DIE LEVEL INTERCONNECT

Method for Forming Chip Packages and a Chip Package

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

3D Printed Hermetic Package Assembly and Method

Remapped Packaged Extracted Die with 3D Printed Bond Connections

Method and apparatus for printing integrated circuit bond connections

DISCRETE DEVICE MOUNTED ON SUBSTRATE

FIXING TECHNOLOGY FOR COMPONENT ATTACH

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE

UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES

High Frequency Flip Chip Package Process of Polymer Substrate and S...