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H01L2224/862
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/862
Applying energy for connecting
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding and indexing apparatus
Patent number
11,362,058
Issue date
Jun 14, 2022
Nexperia B.V.
Ralph Huybers
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for transferring semiconductor devices from a...
Patent number
11,183,478
Issue date
Nov 23, 2021
Rohinni, LLC
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-LED module and method for fabricating the same
Patent number
11,069,664
Issue date
Jul 20, 2021
LUMENS CO., LTD.
Daewon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
Patent number
10,918,298
Issue date
Feb 16, 2021
The Board of Trustees of the University of Illinois
John A. Rogers
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
Patent number
10,643,942
Issue date
May 5, 2020
Compass Technology Company Limited
Kelvin Po Leung Pun
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Apparatus for the material-bonded connection of connection partners...
Patent number
10,603,741
Issue date
Mar 31, 2020
Semikron Elektronik GmbH & Co., KG
Ingo Bogen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
Patent number
10,529,685
Issue date
Jan 7, 2020
Rohinni, LLC
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
Patent number
10,522,510
Issue date
Dec 31, 2019
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
Patent number
10,468,342
Issue date
Nov 5, 2019
Compass Technology Company, Ltd.
Kelvin Po Leung Pun
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
High density interconnection of microelectronic devices
Patent number
9,842,832
Issue date
Dec 12, 2017
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection of microelectronic devices
Patent number
9,397,071
Issue date
Jul 19, 2016
Intel Corporation
Omkar G. Karhade
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device and a method for fabricating an electronic device
Patent number
9,018,742
Issue date
Apr 28, 2015
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
Patent number
8,263,438
Issue date
Sep 11, 2012
Infineon Technologies AG
Alvin Seah
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for connecting a die assembly to a substrate in an integrate...
Patent number
7,880,277
Issue date
Feb 1, 2011
Infineon Technologies AG
Alvin Seah
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Semiconductor device with micro connecting elements and method for...
Patent number
7,468,560
Issue date
Dec 23, 2008
Infineon Technologies AG
Volker Guengerich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding method and apparatus
Patent number
5,500,502
Issue date
Mar 19, 1996
Mitsubishi Denki Kabushiki Kaisha
Manabu Horita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding method and bonding apparatus
Patent number
5,305,944
Issue date
Apr 26, 1994
Mitsubishi Denki Kabushiki Kaisha
Masaharu Yoshida
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for fluxless solder reflow
Patent number
5,164,566
Issue date
Nov 17, 1992
Microelectronics & Computer Technology Corp.
Philip J. Spletter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
BONDING AND INDEXING METHOD
Publication number
20220310553
Publication date
Sep 29, 2022
NEXPERIA B.V.
Ralph HUYBERS
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMOCOMPRESSION BONDING DEVICE
Publication number
20200411466
Publication date
Dec 31, 2020
Sakai Display Products Corporation
YOHICHIROH SAKAKI
G02 - OPTICS
Information
Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
Publication number
20200135688
Publication date
Apr 30, 2020
Rohinni, LLC.
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING AND INDEXING APPARATUS
Publication number
20190206829
Publication date
Jul 4, 2019
NEXPERIA B.V.
Ralph HUYBERS
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
Publication number
20180226376
Publication date
Aug 9, 2018
Rohinni, LLC.
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
Publication number
20180151541
Publication date
May 31, 2018
Intel Corporation
Kimin JUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
Publication number
20160300824
Publication date
Oct 13, 2016
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
Publication number
20150187731
Publication date
Jul 2, 2015
QUALCOMM Incorporated
Dong Wook KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
Publication number
20130187259
Publication date
Jul 25, 2013
INFINEON TECHNOLOGIES AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
Publication number
20120157804
Publication date
Jun 21, 2012
John A. ROGERS
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
Publication number
20110097848
Publication date
Apr 28, 2011
Alvin Seah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for connecting a die assembly to a substrate in an integrate...
Publication number
20070040251
Publication date
Feb 22, 2007
Alvin Seah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device with micro connecting elements and method for...
Publication number
20060185892
Publication date
Aug 24, 2006
Volker Guengerich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR