applying isostatic pressure

Industry

CPC
H01L2224/81209

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81209applying isostatic pressure

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,796,958
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,777,454
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 10,651,086
- Issue date May 12, 2020
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, block stacked body, a...
- Patent number 9,349,714
- Issue date May 24, 2016
- Sumitomo Bakelite Co., Ltd.
- Kensuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focal plane array packaging using isostatic pressure processing
- Patent number 9,142,694
- Issue date Sep 22, 2015
- Raytheon Company
- Kenneth Allen Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration method using SOI substrates and structures produced...
- Patent number 8,563,396
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a microelectronic package using control of die an...
- Patent number 7,585,693
- Issue date Sep 8, 2009
- Intel Corporation
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for adjusting gap width of laminated body
- Patent number 7,527,083
- Issue date May 5, 2009
- Au Optronics Corporation
- Takeshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining semiconductor units with bonding material
- Patent number 6,750,539
- Issue date Jun 15, 2004
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic joining processes
- Patent number 6,651,321
- Issue date Nov 25, 2003
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic joining processes with temporary securement
- Patent number 6,543,131
- Issue date Apr 8, 2003
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bump-component mounted body and device for...
- Patent number 6,513,236
- Issue date Feb 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masahide Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic joining processes with bonding material application
- Patent number 6,492,251
- Issue date Dec 10, 2002
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20180374751
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180337091
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...
- Publication number 20180315655
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Sampath PURUSHOTHAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, A...
- Publication number 20140183758
- Publication date Jul 3, 2014
- SUMITOMO BAKELITE CO., LTD.
- Kensuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...
- Publication number 20120199988
- Publication date Aug 9, 2012
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel 3D Integration Method Using SOI Substrates and Structures Pro...
- Publication number 20120193752
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120118939
- Publication date May 17, 2012
- SUMITOMO BAKELITE CO., LTD.
- Keiyo KUSANAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting Apparatus of Gap Width and Method Thereof
- Publication number 20090221208
- Publication date Sep 3, 2009
- Takeshi Kobayashi
- B30 - PRESSES
Information Patent Application
HIGHLY COMPLIANT PLATE FOR WAFER BONDING
- Publication number 20070284409
- Publication date Dec 13, 2007
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a microelectronic package using control of die an...
- Publication number 20070231952
- Publication date Oct 4, 2007
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Highly compliant plate for wafer bonding
- Publication number 20060003548
- Publication date Jan 5, 2006
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting apparatus of gap width and method thereof
- Publication number 20040149379
- Publication date Aug 5, 2004
- Takeshi Kobayashi
- B30 - PRESSES
Information Patent Application
Microelectronic joining processes
- Publication number 20040035519
- Publication date Feb 26, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining semiconductor units with bonding material
- Publication number 20030139029
- Publication date Jul 24, 2003
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic joining processes
- Publication number 20030041451
- Publication date Mar 6, 2003
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting apparatus of gap width and method thereof
- Publication number 20020069961
- Publication date Jun 13, 2002
- IBM
- Takeshi Kobayashi
- B30 - PRESSES
Information Patent Application
Method of manufacturing bump-component mounted body and device for...
- Publication number 20010015010
- Publication date Aug 23, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masahide Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS

applying isostatic pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

3D integration method using SOI substrates and structures produced...

Method and apparatus for chip-to-wafer integration

Method of manufacturing semiconductor device, block stacked body, a...

Focal plane array packaging using isostatic pressure processing

3D integration method using SOI substrates and structures produced...

Method for manufacturing electronic component, and electronic compo...

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Method of forming a microelectronic package using control of die an...

Apparatus for adjusting gap width of laminated body

Joining semiconductor units with bonding material

Microelectronic joining processes

Microelectronic joining processes with temporary securement

Method of manufacturing bump-component mounted body and device for...

Microelectronic joining processes with bonding material application

Patents Applicationslast 30 patents

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

NOVEL 3D INTEGRATION METHOD USING SOI SUBSTRATES AND STRUCTURES PRO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, A...

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND A...

Novel 3D Integration Method Using SOI Substrates and Structures Pro...

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

Adjusting Apparatus of Gap Width and Method Thereof

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Method of forming a microelectronic package using control of die an...

Highly compliant plate for wafer bonding

Adjusting apparatus of gap width and method thereof

Microelectronic joining processes

Joining semiconductor units with bonding material

Microelectronic joining processes

Adjusting apparatus of gap width and method thereof

Method of manufacturing bump-component mounted body and device for...