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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4867
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate assembly with encapsulated magnetic feature
Patent number
11,901,115
Issue date
Feb 13, 2024
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
11,869,879
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,800,639
Issue date
Oct 24, 2023
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct bonded heterogeneous integration silicon bridge
Patent number
11,791,270
Issue date
Oct 17, 2023
International Business Machines Corporation
Kamal K Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D printed ceramic structure with metal traces
Patent number
11,756,799
Issue date
Sep 12, 2023
HRL Laboratories, LLC
Tobias Schaedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package electrostatic discharge (ESD) protection
Patent number
11,751,367
Issue date
Sep 5, 2023
Intel Corporation
Veronica Aleman Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,728,249
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit module with a structurally balanced package usin...
Patent number
11,664,302
Issue date
May 30, 2023
International Business Machines Corporation
Mark K. Hoffmeyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing electronic module, electronic module, and e...
Patent number
11,632,886
Issue date
Apr 18, 2023
Canon Kabushiki Kaisha
Mitsutoshi Hasegawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module with connection lugs for supply lines
Patent number
11,631,636
Issue date
Apr 18, 2023
CeramTec GmbH
Alfred Thimm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
Patent number
11,626,295
Issue date
Apr 11, 2023
Epistar Corporation
Min-Hsun Hsieh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,622,444
Issue date
Apr 4, 2023
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with flip chip solder joint capsules
Patent number
11,600,498
Issue date
Mar 7, 2023
Texas Instruments Incorporated
James Raymond Maliclic Baello
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic bilayer structure for a cored or coreless semiconductor pa...
Patent number
11,495,555
Issue date
Nov 8, 2022
Intel Corporation
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell
Patent number
11,482,629
Issue date
Oct 25, 2022
LG Electronics Inc.
Jaewon Chang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
11,476,233
Issue date
Oct 18, 2022
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of electronic-component-mounted module
Patent number
11,476,127
Issue date
Oct 18, 2022
Mitsubishi Materials Corporation
Tomoya Oohiraki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell
Patent number
11,456,391
Issue date
Sep 27, 2022
LG Electronics Inc.
Jaewon Chang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Package including a substrate with high resolution rectangular cros...
Patent number
11,450,598
Issue date
Sep 20, 2022
QUALCOMM Incorporated
Sebastian Brunner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate assembly with encapsulated magnetic feature
Patent number
11,443,892
Issue date
Sep 13, 2022
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning component carrier structure with known-good sections and c...
Patent number
11,430,703
Issue date
Aug 30, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Marco Gavagnin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible circuit board, COF module and electronic device including...
Patent number
11,395,403
Issue date
Jul 19, 2022
LG Innotek Co., Ltd
Jun Young Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
Patent number
11,355,459
Issue date
Jun 7, 2022
INTEL CORPOATION
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gas cushion apparatus and techniques for substrate coating
Patent number
11,338,319
Issue date
May 24, 2022
Kateeva, Inc.
Alexander Sou-Kang Ko
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for fabricating a semiconductor device comprising a paste la...
Patent number
11,329,021
Issue date
May 10, 2022
Infineon Technologies AG
Francisco Javier Santos Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell
Patent number
11,329,172
Issue date
May 10, 2022
LG Electronics Inc.
Jaewon Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of package structure with underfill
Patent number
11,328,936
Issue date
May 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell
Patent number
11,309,441
Issue date
Apr 19, 2022
LG Electronics Inc.
Jaewon Chang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Enabling magnetic films in inductors integrated into semiconductor...
Patent number
11,270,959
Issue date
Mar 8, 2022
Intel Corporation
Kirstof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Production method for antenna substrate, production method for ante...
Patent number
11,269,254
Issue date
Mar 8, 2022
Toray Industries, Inc.
Junji Wakita
B82 - NANO-TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
Publication number
20240136217
Publication date
Apr 25, 2024
UTAC Headquarters Pte. Ltd.
Hua Hong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105573
Publication date
Mar 28, 2024
Hyundai Motor Company
Jun Hee PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR VEHICLE
Publication number
20240088009
Publication date
Mar 14, 2024
Hyundai Motor Company
Jun Hee PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD
Publication number
20240032205
Publication date
Jan 25, 2024
CONNECTEC JAPAN Corporation
Hiroshi KOMATSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE PASTE, WIRING SUBSTRATE, LIGHT-EMITTING DEVICE,AND MANUF...
Publication number
20230420269
Publication date
Dec 28, 2023
Nichia Corporation.
Eiko MINATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
Publication number
20230411334
Publication date
Dec 21, 2023
BOARDTEK ELECTRONICS CORPORATION
CHIEN-CHENG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230335471
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...
Publication number
20230317476
Publication date
Oct 5, 2023
Intel Corporation
Sangeon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230282555
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chiang Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
Publication number
20230187223
Publication date
Jun 15, 2023
TEXAS INSTRUMENTS INCORPORATED
James Raymond Maliclic Baello
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
Publication number
20230103298
Publication date
Apr 6, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANAR SURFACES ON SUBSTRATES
Publication number
20230102345
Publication date
Mar 30, 2023
TEXAS INSTRUMENTS INCORPORATED
Frank ARMSTRONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
Publication number
20220399263
Publication date
Dec 15, 2022
Intel Corporation
Brandon Christian Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT PACKAGES AND FABRICATION METHODS USING BOND-ON-PAD (BOP) SU...
Publication number
20220367334
Publication date
Nov 17, 2022
Avago Technologies International Sales Pte. Limited
Wen-Hsien HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
Publication number
20220359401
Publication date
Nov 10, 2022
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
Publication number
20220359115
Publication date
Nov 10, 2022
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE P...
Publication number
20220336341
Publication date
Oct 20, 2022
ORMET CIRCUITS, INC.
Catherine A. SHEARER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH UNDERFILL
Publication number
20220270894
Publication date
Aug 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Yu HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE R...
Publication number
20220130750
Publication date
Apr 28, 2022
STMicroelectronics Pte Ltd
Daniel Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
Publication number
20220108931
Publication date
Apr 7, 2022
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Takashi KITAWADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220104343
Publication date
Mar 31, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Ji-Young OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier Structure Connectable by Electrically Conductive...
Publication number
20220068838
Publication date
Mar 3, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abderrazzaq Ifis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
Publication number
20220059368
Publication date
Feb 24, 2022
STMicroelectronics S.r.l
Fulvio Vittorio FONTANA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROS...
Publication number
20220037246
Publication date
Feb 3, 2022
QUALCOMM Incorporated
Sebastian BRUNNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Publication number
20210410343
Publication date
Dec 30, 2021
Intel Corporation
Veronica Aleman Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module with Connection Lugs for Supply Lines
Publication number
20210384115
Publication date
Dec 9, 2021
CERAMTEC GMBH
Alfred THIMM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method
Publication number
20210343626
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE PILLAR USING CONDUCTIVE PASTE
Publication number
20210313197
Publication date
Oct 7, 2021
DIC CORPORATION
Ryota Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
Publication number
20210280436
Publication date
Sep 9, 2021
EPISTAR CORPORATION
Min-Hsun HSIEH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS AND SYSTEM OF IMPROVING CONNECTIVITY OF INTEGRATED COMPONEN...
Publication number
20210249316
Publication date
Aug 12, 2021
NANO-DIMENSION TECHNOLOGIES LTD.
Jaim Nulman
H01 - BASIC ELECTRIC ELEMENTS