Applying pastes or inks

Industry

CPC
H01L21/4867

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4867Applying pastes or inks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier structure connectable by electrically conductive...
- Patent number 12,009,315
- Issue date Jun 11, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with dummy metallic traces
- Patent number 11,990,399
- Issue date May 21, 2024
- Texas Instruments Incorporated
- Frank Armstrong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,800,639
- Issue date Oct 24, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed ceramic structure with metal traces
- Patent number 11,756,799
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package electrostatic discharge (ESD) protection
- Patent number 11,751,367
- Issue date Sep 5, 2023
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,728,249
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with a structurally balanced package usin...
- Patent number 11,664,302
- Issue date May 30, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic module, electronic module, and e...
- Patent number 11,632,886
- Issue date Apr 18, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with connection lugs for supply lines
- Patent number 11,631,636
- Issue date Apr 18, 2023
- CeramTec GmbH
- Alfred Thimm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,622,444
- Issue date Apr 4, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flip chip solder joint capsules
- Patent number 11,600,498
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic bilayer structure for a cored or coreless semiconductor pa...
- Patent number 11,495,555
- Issue date Nov 8, 2022
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell
- Patent number 11,482,629
- Issue date Oct 25, 2022
- LG Electronics Inc.
- Jaewon Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,476,233
- Issue date Oct 18, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic-component-mounted module
- Patent number 11,476,127
- Issue date Oct 18, 2022
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell
- Patent number 11,456,391
- Issue date Sep 27, 2022
- LG Electronics Inc.
- Jaewon Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Package including a substrate with high resolution rectangular cros...
- Patent number 11,450,598
- Issue date Sep 20, 2022
- QUALCOMM Incorporated
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning component carrier structure with known-good sections and c...
- Patent number 11,430,703
- Issue date Aug 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,395,403
- Issue date Jul 19, 2022
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas cushion apparatus and techniques for substrate coating
- Patent number 11,338,319
- Issue date May 24, 2022
- Kateeva, Inc.
- Alexander Sou-Kang Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solar cell
- Patent number 11,329,172
- Issue date May 10, 2022
- LG Electronics Inc.
- Jaewon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device comprising a paste la...
- Patent number 11,329,021
- Issue date May 10, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick Film Single Layer Capacitor
- Publication number 20240379649
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240355640
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321684
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240234195
- Publication date Jul 11, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240234292
- Publication date Jul 11, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240222246
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20240186292
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240136217
- Publication date Apr 25, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105573
- Publication date Mar 28, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE
- Publication number 20240088009
- Publication date Mar 14, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD
- Publication number 20240032205
- Publication date Jan 25, 2024
- CONNECTEC JAPAN Corporation
- Hiroshi KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, WIRING SUBSTRATE, LIGHT-EMITTING DEVICE,AND MANUF...
- Publication number 20230420269
- Publication date Dec 28, 2023
- Nichia Corporation.
- Eiko MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
- Publication number 20230411334
- Publication date Dec 21, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230335471
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...
- Publication number 20230317476
- Publication date Oct 5, 2023
- Intel Corporation
- Sangeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282555
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20230187223
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20230103298
- Publication date Apr 6, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SURFACES ON SUBSTRATES
- Publication number 20230102345
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Frank ARMSTRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
- Publication number 20220399263
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES AND FABRICATION METHODS USING BOND-ON-PAD (BOP) SU...
- Publication number 20220367334
- Publication date Nov 17, 2022
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE P...
- Publication number 20220336341
- Publication date Oct 20, 2022
- ORMET CIRCUITS, INC.
- Catherine A. SHEARER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH UNDERFILL
- Publication number 20220270894
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE R...
- Publication number 20220130750
- Publication date Apr 28, 2022
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20220108931
- Publication date Apr 7, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi KITAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220104343
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ji-Young OH
- H01 - BASIC ELECTRIC ELEMENTS

Applying pastes or inks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic substrate manufacturing method

Package structure and manufacturing method thereof

Component carrier structure connectable by electrically conductive...

Device with dummy metallic traces

Substrate assembly with encapsulated magnetic feature

Semiconductor package using a coreless signal distribution structure

Flexible circuit board, COF module and electronic device including...

Direct bonded heterogeneous integration silicon bridge

3D printed ceramic structure with metal traces

Microelectronic package electrostatic discharge (ESD) protection

Semiconductor package and method

Integrated circuit module with a structurally balanced package usin...

Method of manufacturing electronic module, electronic module, and e...

Module with connection lugs for supply lines

Method of applying conductive adhesive and manufacturing device usi...

Flexible circuit board, COF module and electronic device including...

Semiconductor package with flip chip solder joint capsules

Magnetic bilayer structure for a cored or coreless semiconductor pa...

Solar cell

Semiconductor package using a coreless signal distribution structure

Manufacturing method of electronic-component-mounted module

Solar cell

Package including a substrate with high resolution rectangular cros...

Substrate assembly with encapsulated magnetic feature

Aligning component carrier structure with known-good sections and c...

Flexible circuit board, COF module and electronic device including...

Embedding magnetic material, in a cored or coreless semiconductor p...

Gas cushion apparatus and techniques for substrate coating

Solar cell

Method for fabricating a semiconductor device comprising a paste la...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Thick Film Single Layer Capacitor

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

Semiconductor Device and Method of Making a Substrate with Improved...

Semiconductor Device and Method of Making a Semiconductor Package w...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

Semiconductor Package Using A Coreless Signal Distribution Structure

Semiconductor Device and Method of Making a Substrate with Improved...

POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE FOR VEHICLE

WIRING FORMATION METHOD AND TRANSFER MOLD MANUFACTURING METHOD

CONDUCTIVE PASTE, WIRING SUBSTRATE, LIGHT-EMITTING DEVICE,AND MANUF...

POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR PACKAGES

DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

Semiconductor Package Using A Coreless Signal Distribution Structure

PLANAR SURFACES ON SUBSTRATES

PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS

CIRCUIT PACKAGES AND FABRICATION METHODS USING BOND-ON-PAD (BOP) SU...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE P...

PACKAGE STRUCTURE WITH UNDERFILL

SOLDER MASK FOR THERMAL PAD OF A PRINTED CIRCUIT BOARD TO PROVIDE R...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME