Applying permanent coating to the bonding area in the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8002Applying permanent coating to the bonding area in the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
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Information Patent Grant
Display device and method for manufacturing the same
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Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
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Information Patent Grant
Bonded assembly containing oxidation barriers and/or adhesion enhan...
- Patent number 11,139,272
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
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Information Patent Grant
Semiconductor device and method of manufacturing the same
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- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Junichi Shibata
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Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
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Information Patent Grant
Method for bonding wafers and bonding tool
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- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
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Information Patent Grant
Bonding system
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- Issue date Nov 17, 2020
- Tokyo Electron Limited
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Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
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- Issue date Oct 6, 2020
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Information Patent Grant
Semiconductor structure and method of manufacturing thereof
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- Issue date Sep 8, 2020
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Information Patent Grant
Bumped land grid array
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- Issue date May 15, 2018
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- Ah Ron Lee
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Information Patent Grant
Method for bonding substrates
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- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
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Patents Applicationslast 30 patents

Information Patent Application
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NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
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- Kandabara Tapily
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METHOD OF FABRICATING DISPLAY PANEL
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- SAMSUNG DISPLAY CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...
- Publication number 20230253361
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220093555
- Publication date Mar 24, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
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DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
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- Publication date Dec 23, 2021
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SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDING
- Publication number 20210242152
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- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
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BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...
- Publication number 20210028149
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- Raghuveer S. MAKALA
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BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...
- Publication number 20210028135
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- SANDISK TECHNOLOGIES LLC
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200294958
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
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METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
BUMPED LAND GRID ARRAY
- Publication number 20180005971
- Publication date Jan 4, 2018
- Avago Technologies General IP(Singapore) Pte. Ltd.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR BONDING SUBSTRATES
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Information Patent Application
TREATMENT, BEFORE THE BONDING OF A MIXED CU-OXIDE SURFACE, BY A PLA...
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- Publication date Jun 20, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
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- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Applying permanent coating to the bonding area in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Technologies for plasma oxidation protection during hybrid bonding...

Display device and method for manufacturing the same

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Bonded assembly containing oxidation barriers and/or adhesion enhan...

Semiconductor device and method of manufacturing the same

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Hybrid wafer-to-wafer bonding and methods of surface preparation fo...

Method for bonding wafers and bonding tool

Bonding system

Method for bonding semiconductor chips to a landing wafer

Semiconductor structure and method of manufacturing thereof

Bumped land grid array

Method for bonding substrates

Patents Applicationslast 30 patents

DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

METHOD OF FABRICATING DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDING

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR BONDING WAFERS AND BONDING TOOL

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

BUMPED LAND GRID ARRAY

METHOD FOR BONDING SUBSTRATES

TREATMENT, BEFORE THE BONDING OF A MIXED CU-OXIDE SURFACE, BY A PLA...