TREA

Applying permanent coating

Follow

Industry

  • CPC
  • H01L2224/4312
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4312Applying permanent coating
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230140664
    • Publication date May 4, 2023
    • Mitsubishi Electric Corporation
    • Yusuke KAJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY
    • Publication number 20220336230
    • Publication date Oct 20, 2022
    • QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
    • MAN-ZHI PENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
    • Publication number 20220059489
    • Publication date Feb 24, 2022
    • SCHLUMBERGER TECHNOLOGY CORPORATION
    • Mark Alex Kostinovsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20200328178
    • Publication date Oct 15, 2020
    • Mitsubishi Electric Corporation
    • Hiroyuki MASUMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COAXIAL WIRE
    • Publication number 20190385969
    • Publication date Dec 19, 2019
    • The Charles Stark Draper Laboratory, Inc.
    • Caprice Gray Haley
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATED WIRE
    • Publication number 20180345421
    • Publication date Dec 6, 2018
    • HERAEUS MATERIALS SINGAPORE PTE., LTD.
    • Il Tae Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180122765
    • Publication date May 3, 2018
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    METHOD FOR FORMING BALL IN BONDING WIRE
    • Publication number 20180096965
    • Publication date Apr 5, 2018
    • NIPPON MICROMETAL CORPORATION
    • Noritoshi ARAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170194280
    • Publication date Jul 6, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATED WIRE FOR BONDING APPLICATIONS
    • Publication number 20150360316
    • Publication date Dec 17, 2015
    • Heraeus Deutschland GmbH & Co. KG
    • Eugen MILKE
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    BONDING WIRE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20140329106
    • Publication date Nov 6, 2014
    • NIPPON MICROMETAL CORPORATION
    • Ryo TOGASHI
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
    • Publication number 20140327018
    • Publication date Nov 6, 2014
    • Kohei Tatsumi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal Post Bonding Using Pre-Fabricated Metal Posts
    • Publication number 20140262470
    • Publication date Sep 18, 2014
    • Yi-Li Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140035115
    • Publication date Feb 6, 2014
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR
    • Publication number 20130306352
    • Publication date Nov 21, 2013
    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Shinichi Terashima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR
    • Publication number 20120118610
    • Publication date May 17, 2012
    • NIPPON MICROMETAL CORPORATION
    • Shinichi Terashima
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20120104613
    • Publication date May 3, 2012
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE
    • Publication number 20110104510
    • Publication date May 5, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110089549
    • Publication date Apr 21, 2011
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20110011619
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
    • Publication number 20100327450
    • Publication date Dec 30, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20100282495
    • Publication date Nov 11, 2010
    • NIPPON STEEL MATERIALS CO., LTD
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
    • Publication number 20100213619
    • Publication date Aug 26, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding wire for semiconductor device
    • Publication number 20090188696
    • Publication date Jul 30, 2009
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding Wire and Integrated Circuit Device Using the Same
    • Publication number 20070235887
    • Publication date Oct 11, 2007
    • Shingo Kaimori
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding wire
    • Publication number 20040245320
    • Publication date Dec 9, 2004
    • Mesato Fukagaya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Composite noble metal wire
    • Publication number 20040065468
    • Publication date Apr 8, 2004
    • Jeffrey Michael Seuntjens
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...