Applying permanent coating

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CPC
H01L2224/1182

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1182Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor package structure
- Patent number 11,837,572
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,791,313
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising pillar interconnect with cavity
- Patent number 11,721,656
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,456,280
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,171,108
- Issue date Nov 9, 2021
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 10,937,760
- Issue date Mar 2, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 10,903,179
- Issue date Jan 26, 2021
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,872,861
- Issue date Dec 22, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN
- Yong-Da Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,854,567
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...
- Publication number 20240339426
- Publication date Oct 10, 2024
- NXP B.V.
- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING PILLAR
- Publication number 20240096832
- Publication date Mar 21, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030145
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230369288
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20230197632
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY
- Publication number 20230057439
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220392868
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Min WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220392872
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220068868
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- An-Nong WEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...
- Publication number 20210104478
- Publication date Apr 8, 2021
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...
- Publication number 20210091057
- Publication date Mar 25, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082849
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210057382
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Semiconductor package and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Driving substrate and manufacturing method thereof, and micro LED b...

Apparatus and method for manufacturing semiconductor package structure

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor package and method of forming the same

Integrated device comprising pillar interconnect with cavity

Semiconductor device with a heterogeneous solder joint and method f...

Integrated device comprising interconnect structures having an inne...

Semiconductor contact structure having stress buffer layer formed b...

Semiconductor device and manufacturing method thereof

Semiconductor package and method of forming the same

Semiconductor package and method for manufacturing the same

Semiconductor device and bump formation process

Method of making a pillar structure having a non-metal sidewall pro...

Mechanisms for forming post-passivation interconnect structure

Interconnect crack arrestor structure and methods

Semiconductor package and method for manufacturing the same

Semiconductor packaging structure and method

Method for manufacturing interconnect structure

Microelectronic structures having multiple microelectronic devices...

Assembly comprising hybrid interconnecting means including intermed...

Interconnect structures for preventing solder bridging, and associa...

Method for manufacturing a chip package

Porous Cu on Cu surface for semiconductor packages

Semiconductor contact structure having stress buffer layer formed b...

Substrate device, electronic apparatus, and method for manufacturin...

Semiconductor packages

3D packages and methods for forming the same

Patents Applicationslast 30 patents

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

Coating of Nanowires

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

CONNECTING PILLAR

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Light-Emitting Device and Displayer

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...

DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED B...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

Porous Cu on Cu Surface for Semiconductor Packages