Applying permanent coating

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H01L2224/8502

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8502Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,629,520
- Issue date Apr 21, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for precision placement of integrated circuit overcoat mate...
- Patent number 7,884,449
- Issue date Feb 8, 2011
- Texas Instruments Incorporated
- Sean M. Malolepszy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and structure for controlled impedance wire bonds using co-d...
- Patent number 7,854,368
- Issue date Dec 21, 2010
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for precision placement of integrated circuit overcoat mate...
- Patent number 7,648,857
- Issue date Jan 19, 2010
- Texas Instruments Incorporated
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for controlled impedance wire bonds using co-d...
- Patent number 7,303,113
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated bonding wire tool for microelectronic packaging
- Patent number 6,991,147
- Issue date Jan 31, 2006
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated bonding wire for microelectronic packaging
- Patent number 6,670,214
- Issue date Dec 30, 2003
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for producing electronic elements
- Patent number 5,992,725
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Hidemitsu Egawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and apparatus for the...
- Patent number 5,950,100
- Issue date Sep 7, 1999
- NEC Corporation
- Tadayuki Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making super conducting bonds for thin film devices
- Patent number 5,592,732
- Issue date Jan 14, 1997
- Wisconsin Alumni Research Foundation
- Arthur C. Leuthold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding with applied insulative coating
- Patent number 4,678,114
- Issue date Jul 7, 1987
- Kabushiki Kaisha Toshiba
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire, semiconductor device having the same, and bonding met...
- Patent number 4,488,674
- Issue date Dec 18, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180342442
- Publication date Nov 29, 2018
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20150357304
- Publication date Dec 10, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150255420
- Publication date Sep 10, 2015
- RENESAS ELECTRONICS CORPORATION
- Kentaro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Precision Placement of Integrated Circuit Overcoat Mate...
- Publication number 20100072610
- Publication date Mar 25, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CONTROLLED IMPEDANCE WIRE BONDS USING CO-D...
- Publication number 20080035362
- Publication date Feb 14, 2008
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATE...
- Publication number 20080036046
- Publication date Feb 14, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Sean M. Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for controlled impedance wire bonds using co-d...
- Publication number 20050116013
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulated bonding wire tool for microelectronic packaging
- Publication number 20040182911
- Publication date Sep 23, 2004
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed adhesion deposition to mitigate integrated circuit package...

Semiconductor device and method for manufacturing the same

Printed adhesion deposition to mitigate integrated circuit delamina...

Wire bonding methods and systems incorporating metal nanoparticles

Method of manufacturing semiconductor device

Sintered conductive matrix material on wire bond

Wire bonding methods and systems incorporating metal nanoparticles

Flip chip assembly and process with sintering material on metal bumps

Apparatus with a multi-layer coating and method of forming the same

Process for precision placement of integrated circuit overcoat mate...

Method and structure for controlled impedance wire bonds using co-d...

Process for precision placement of integrated circuit overcoat mate...

Method and structure for controlled impedance wire bonds using co-d...

Insulated bonding wire tool for microelectronic packaging

Insulated bonding wire for microelectronic packaging

Apparatus and method for producing electronic elements

Method of manufacturing semiconductor device and apparatus for the...

Method of making super conducting bonds for thin film devices

Method of wire bonding with applied insulative coating

Bonding wire, semiconductor device having the same, and bonding met...

Patents Applicationslast 30 patents

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

Apparatus with a Multi-Layer Coating and Method of Forming the Same

Process for Precision Placement of Integrated Circuit Overcoat Mate...

METHOD AND STRUCTURE FOR CONTROLLED IMPEDANCE WIRE BONDS USING CO-D...

PROCESS FOR PRECISION PLACEMENT OF INTEGRATED CIRCUIT OVERCOAT MATE...

Method and structure for controlled impedance wire bonds using co-d...

Insulated bonding wire tool for microelectronic packaging