Applying permanent coating

Industry

CPC
H01L2224/4382

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4382Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Fluorinated polymers with low dielectric loss for environmental pro...
- Patent number 11,877,505
- Issue date Jan 16, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturization of optical sensor modules through wirebonded ball s...
- Patent number 11,552,053
- Issue date Jan 10, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- G02 - OPTICS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulating a bonded wire with low profile encapsulation
- Patent number 10,946,658
- Issue date Mar 16, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device with copper structure
- Patent number 10,937,720
- Issue date Mar 2, 2021
- Infineon Technologies Austria AG
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,861,824
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,153,254
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 9,583,476
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a semiconductor device having wires with polymerized insu...
- Patent number 9,378,984
- Issue date Jun 28, 2016
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006354
- Publication date Jan 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Shota OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINATED POLYMERS WITH LOW DIELECTRIC LOSS FOR ENVIRONMENTAL PRO...
- Publication number 20220123216
- Publication date Apr 21, 2022
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20210050321
- Publication date Feb 18, 2021
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
- Publication number 20200139705
- Publication date May 7, 2020
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor Device with Copper Structure
- Publication number 20190304884
- Publication date Oct 3, 2019
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT FOR ELECTRICAL CONNECTORS
- Publication number 20190148332
- Publication date May 16, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...
- Publication number 20190096857
- Publication date Mar 28, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20170053888
- Publication date Feb 23, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulating a Bonded Wire with Low Profile Encapsulation
- Publication number 20160257117
- Publication date Sep 8, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...
- Publication number 20160172349
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150255420
- Publication date Sep 10, 2015
- RENESAS ELECTRONICS CORPORATION
- Kentaro Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM COATED COPPER RIBBON
- Publication number 20150137390
- Publication date May 21, 2015
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B32 - LAYERED PRODUCTS
Information Patent Application
SEVERING BOND WIRE BY KINKING AND TWISTING
- Publication number 20150129647
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20150129646
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...
- Publication number 20150037938
- Publication date Feb 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...
- Publication number 20130341805
- Publication date Dec 26, 2013
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Palladium-coated copper bonding wire and method for manufacturing same

Palladium-coated copper bonding wire, manufacturing method of palla...

Fluorinated polymers with low dielectric loss for environmental pro...

Semiconductor package structure with heat sink and method preparing...

Miniaturization of optical sensor modules through wirebonded ball s...

Semiconductor package structure with heat sink and method preparing...

Noble metal-coated silver wire for ball bonding and method for prod...

Bonding wire for semiconductor device

Encapsulating a bonded wire with low profile encapsulation

Semiconductor device with copper structure

Microelectronic device packages, stacked microelectronic device pac...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Reinforcement for electrical connectors

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Plastic-packaged semiconductor device having wires with polymerized...

Microelectronic device packages, stacked microelectronic device pac...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Coated bond wires for die packages and methods of manufacturing sai...

Off substrate kinking of bond wire

Bonding wire for semiconductor device

Microelectronic device packages, stacked microelectronic device pac...

Packaging a semiconductor device having wires with polymerized insu...

Bonding structure of bonding wire

Core-jacket bonding wire

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

FLUORINATED POLYMERS WITH LOW DIELECTRIC LOSS FOR ENVIRONMENTAL PRO...

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

Encapsulating a Bonded Wire with Low Profile Encapsulation

Semiconductor Device with Copper Structure

REINFORCEMENT FOR ELECTRICAL CONNECTORS

MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

Encapsulating a Bonded Wire with Low Profile Encapsulation

MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...

COATED WIRE FOR BONDING APPLICATIONS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ALUMINUM COATED COPPER RIBBON

SEVERING BOND WIRE BY KINKING AND TWISTING

OFF SUBSTRATE KINKING OF BOND WIRE

PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...

MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...